Abstract: A multi-well plate and plate holder assembly comprising a multi-well assay plate clamped between an upper plate holder and a lower plate holder to facilitate handling of the plate, and to prevent the plate from warping when liquid samples placed within wells of the multi-well assay plate are stored, analyzed and/or subjected to a reaction or other process, particularly when the samples are subjected to high temperatures. The upper plate holder is releasably engageable with the lower plate holder. Preferably, at least one detent positions and holds the upper plate holder in relation to the lower plate holder.

Abstract: An apparatus and method for use in magnetic separation of magnetically attractable particles suspended in a liquid. The apparatus includes a magnetic separator plate having a plurality of channels, one for each column of wells of a multi-well assay plate which is received by the magnetic separator plate. A plurality of magnets are positioned in each channel so that when the magnetic separator plate receives the multi-well assay plate, the magnets attract the magnetically attractable particles to create a pellet of material of a substance of interest on a side wall within each associated well.

Abstract: In accordance with the present invention, there is provided a low observable fastener for use with a panel structure having a panel bore formed therein. The panel structure has a RAM panel layer formed thereon. The RAM panel layer has a RAM panel layer bore formed therethrough aligned with the panel bore. The RAM panel layer bore defines an inner surface. The fastener is provided with a fastener head disposable within the panel bore. The fastener head has a tool engagement recess formed therein. The fastener is further provided with a RAM treatment layer disposed upon the fastener head. The RAM treatment layer has a fastener access bore aligned with the tool engagement recess of the fastener head. The RAM treatment layer further has a cylindrical outer surface sized and configured to be concentrically received by the inner surface of the RAM panel layer.