Abstract: The present invention includes a tooling apparatus designed to provide accurately aligned printed circuits on both major sides of a printed circuit board layer, especially advantageous for use in multi-layer PCB's. Also disclosed is the method manufacture of the apparatus and the methods of using the apparatus. The apparatus includes patterns formed on glass masks attached to frames incorporating alignment pins and slots. The patterns include registration marks for alignment during manufacture of the apparatus. During use, the apparatus allows accurate alignment of patterns on both sides of a PCB layer. Also disclosed is the apparatus with buttons used to pattern PCB layers having pre-drilled Z-axis holes.

Abstract: A method of manufacturing interconnect bumps on electrical connectors is disclosed. The interconnect bumps are formed with mechanically interlocking structure which allows the bumps to reach a height substantially greater than prior art bumps, while remaining structurally intact. The interconnect bumps are formed using standard photolithography techniques to form the bumps in multiple interlocking portions to achieve a structurally superior interconnect bump.

Abstract: A flexible automated bonding apparatus electrically interconnects integrated circuit carriers, printed circuit boards, and other devices. A metallized interconnect pattern is deposited on the surface of the substrate. The metallized interconnects in the pattern span apertures created in the substrate using an excimer laser. Thus, the metallized interconnects can be electrically bonded through the apertures to elements lying underneath the substrate.