Abstract: An improved circuit board structure and method of forming the same are provided. The circuit board includes an insulating core and has plated through holes connecting the circuitry on both sides and intermediate layers of the core. A permanent dielectric material is applied on at least one surface of the board covering the circuitry and plated through holes. Vias are formed through the dielectric material and signal lines are formed on the top of the dielectric material connected to the circuitry onto the board through the vias. Additional layers of dielectric material with additional wiring and vias can also be formed for multi-level wiring.

Abstract: A connector assembly for connecting several coaxial cables to a circuit board such that the center conductors of each cable are inserted within a conductive hole which forms part of the board structure. The assembly includes a common housing which may be electrically conductive or insulative and a spring contact member which serves as part of the grounding means to effectively ground the shield members of the coaxial cables to the board's ground. The spring contacts may be in the form of resilient springs which extend from the assembly or of compressible members coupled to a conductive layer which in turn is connected to the shield members. An apparatus for positioning more than one such assembly on a common board structure is also shown and described, as is an assembly designed for positioning the cables therein in a substantially compact orientation.

Abstract: An improved circuit board structure and method of forming the same are provided. The circuit board includes an insulating core and has plated through holes connecting the circuitry on both sides and intermediate layers of the core. A permanent dielectric material is applied on at least one surface of the board covering the circuitry and plated through holes. Vias are formed through the dielectric material and signal lines are formed on the top of the dielectric material connected to the circuitry onto the board through the vias. Additional layers of dielectric material with additional wiring and vias can also be formed for multi-level wiring.