Abstract: The present invention is related to a method and device for precision and passive alignment such as precision and passive alignment technology for low cost array fibre access components. A laser carrier is passively aligned to an MT-interface using alignment structures on a replicated carrier. The laser carrier is based on a self-aligned semiconductor laser, flip-chip mounted on a silicon substrate with planar polymeric waveguides.

Abstract: The present invention is related to a method and device for precision and passive alignment such as precision and passive alignment technology for low cost array fibre access components. A laser carrier is passive aligned to an MT-interface using alignment structures on a replicated carrier. The laser carrier is based on a self-aligned semiconductor laser, flip-chip mounted on a silicon substrate with planar polymeric waveguides. The concept for the alignment according to the invention is shown in FIG. 1 as a front view of a laser carrier (1) mounted on a polymeric carrier (5).

Abstract: An optocasule unit for an optohybrid assembly (10), said capsule unit comprising a lower casing part (36) and a compatible upper cover part (54) which together form, at one end (50) thereof, an integral receptacle section for obtaining an optomechanical interface and receiving and detachably holding therein an optical connector with at least one external optical fiber. A central section (38) of the lower casing part (36) has a cavity (42) for receiving, in a form-closed manner, a ferrule (12) of the optohybrid assembly (10). The lower casing part (36) has, at a second end thereof, a base plate (44) for supporting a substrate (20) having at least one optochip (26, 28) and a proximal end of at least one primary optical fiber (22, 24) mounted thereon. The cover part (54) also has a section (58) covering the substrate (20) and at least a portion of the base plate (44) of the lower part.

Abstract: An optocasule unit for an optohybrid assembly (10), said capsule unit comprising a lower casing part (36) and a compatible upper cover part (54) which together form, at one end (50) thereof, an integral receptacle section for obtaining an optomechani-cal interface and receiving and detachably holding therein an optical connector with at least one external optical fiber. A central section (38) of the lower casing part (36) has a cavity (42) for receiving, in a form-closed manner, a ferrule (12) of the opto-hybrid assembly (10). The lower casing part (36) has, at a second end thereof, a base plate (44) for supporting a substrate (20) having at least one optochip (26, 28) and a proximal end of at least one primary optical fiber (22, 24) mounted thereon. The cover part (54) also has a section (58) covering the substrate (20) and at least a por-tion of the base plate (44) of the lower part.

Abstract: An opto-mechanical interface apparatus includes an optical hybrid, an electronic hybrid adapted to receive electronic components, an adapter fixture for fixing the electronic hybrid and the optical hybrid to one another to form a combined hybrid, a lower-capsule part, and an upper-capsule part adapted to mate with the lower-capsule part. Mating of the upper-capsule part and the lower-capsule part encloses at least part of the combined hybrid. The apparatus forms an opto-mechanical interface for making external optical connection(s).

Abstract: The present invention relates to a spring clip for holding the connection sides of optical units in contact with one another, said optical units including guide pins and optical coupling surfaces. The clip includes a main part from which hooked members project out generally at right angles. A first and a second hooked member are adapted to snap firmly over a first optical unit, whereas a third hooked member is adapted to urge an optical connection side on a second optical unit against an optical connection side on the first optical unit.

Abstract: A plastic encapsulated optomodule is provided which includes a leadframe, an optoelectric component, an electric component, and an optical connection interface integrated in the capsule. The electric component is connected electrically to the leadframe. The electric component and the optoelectric component are mutually connected electrically and the optoelectric component and the integrated connection interface are connected together via at least one optical waveguide. The electric component is provided on a first part of the leadframe and electric contact surfaces (80) are provided on leads (5a and 5b) in the leadframe (1). The optoelectric component is provided on a second part of the leadframe and the optical connection interface arranged on an optodevice is connected to a third part of the leadframe. The optodevice is aligned by alignment elements provided on the leadframe and the leadframe includes alignment elements that conform with corresponding alignment elements on a plastic-encapsulation mold tool.

Abstract: The present invention relates to an angled opto-mechanical connector (10) and to a manufacturing process for the same. The connector (10) comprises a fixture (1) with straight and parallel grooves (2, 3) of two sizes running on the upper side of the fixture (1) from a first fixture side (1a) to a second fixture side (1b). A lid (4) is fastened above the fixture (1). Fibre ends (8a) of optical fibres (8) are placed in the capillaries which are formed between the smaller grooves (2) of the fixture and the lid (4) in such a way that they stick out through the side of the fixture (1b). A plastic capsule (11) encloses the fixture (1), the lid (4) and the fibres (8) completely or partially. The fibres (8) stick out from the plastic capsule (11) in a direction separated from that defined by the grooves of the fixture. The connector (10) can also have an opto-mechanical interface of the above mentioned type at its other end (10b).

Abstract: The present invention is related to a method and device for precision and passive alignment such as precision and passive alignment technology for low cost array fibre access components. A laser carrier is passive aligned to an MT-interface using alignment structures on a replicated carrier. The laser carrier is based on a self-aligned semiconductor laser, flip-chip mounted on a silicon substrate with planar polymeric waveguides. The concept for the alignment according to the invention is shown in FIG. 1 as a front view of a laser carrier (1) mounted on a polymeric carrier (5).

Abstract: In encapsulating an optocomponent, a leadframe is used for the electrical connection of the component, the leadframe having a flag, to which the main body of the optocomponent is attached. The flag is located asymmetrically at an outer edge of the leadframe and is, in the encapsulating operation, placed close to a sidewall in a mold cavity in a mold. In this way, an optical interface of standard type can be obtained in the wall of the capsule. Further, the flag is flexibly attached, by zigzag-shaped bridges, to other portions of the leadframe so that the flag and thus the optocomponent will have a possibility to be resiliently and flexibly displaced a little at the positioning thereof in the mold cavity in the mold in relation to the other portions of the leadframe, in particular to its outer frame portions and bridge portions.

Abstract: In manufacturing an encapsulated optocomponent, the optocomponent is embedded in a plastics material. The optocomponent has guide grooves on one of its surfaces in which guide pins are to extend so that the encapsulated optocomponent will obtain an optical interface of standard type. For the encapsulating operation guide pins are placed in a mold cavity in a mold half and the optocomponent is placed in the cavity in the mold, so that the guide pins are engaged in the guide grooves and ar accurately inserted therein. To achieve this effect, a resilient or elastic force such as from plunger is applied to the other side of the optocomponent, so that it is pressed with some force against the guide pins. The cavity in the mold is then closed by placing a second mold half on top after which the encapsulating material can be introduced in the closed cavity in the mold.

Abstract: A method and arrangement for aligning a waveguide connector to at least one optical device is set forth. The arrangement includes a waveguide connector and a substrate carrying at least one waveguide. The waveguide connector having both guide legs and aligning elements. The method includes the step of shaking the arrangement at a frequency and amplitude sufficient to cause opposing aligning elements disposed on the waveguide connector and on the substrate to engage each other.

Abstract: In manufacturing an encapsulated optocomponent, the optocomponent is embedded in a plastics material. The optocomponent has guide grooves on one of its surfaces in which guide pins are to extend so that the encapsulated optocomponent will obtain an optical interface of standard type. For the encapsulating operation guide pins are placed in a mold cavity of a mold half and the optocomponent is placed in the cavity of the mold, so that the guide pins are engaged in the guide grooves and are accurately inserted therein. To achieve this effect, a resilient or elastic force, such as from a plunger, is applied to the other side of the optocomponent, so that it is pressed with some force against the guide pins. The cavity in the mold is then closed by placing a second mold half on top after which the encapsulating material can be introduced in the closed cavity of the mold.

Abstract: The present invention relates to a manufacturing method for an opto-mechanical connector (10) and to the connector itself. The invention includes that a fixture (1) is manufactured with straight and parallel grooves (2,3) running on the upper side of the fixture (1) from a first fixture side (1a) to a second fixture side (1b), and which grooves (2,3) are intended partly for optical fibers and partly for guide pins. A lid (4) is attached above the fixture (1), whereafter optical fibers (8) from, for example, a fiber ribbon cable (6) are introduced into the grooves (2) intended for the fibers from the first fixture side (1a) so that the fiber ends (8) extend out through the second fixture side (1b). Guide pins (9) are furthermore introduced into the grooves (3) intended for the guide pins. The structure obtained (fixture (1), lid (4), fiber ends (8) and guide pins (9)) is completely or partially enclosed by a plastic capsule (11).

Abstract: An encapsulated optocomponent has an optocomponent assembly having an optical interface at one side, which has guide pins for positioning a connected optical component or optical connector. The assembly is attached to the outermost portion of a flexible tongue, which is an integral part of a dielectric carrier such as a polymer carrier. On or inside the carrier and the tongue thereof electrical conductive paths are arranged which are connected to the optoassembly and to electrical driver circuits in a driver circuit assembly, so that the carrier also has the function of a conventional lead frame. The entire device is molded into encapsulating plastic material.

Abstract: In encapsulating an optocomponent a leadframe (51) is used for the electrical connection of the component, the leadframe having a flag (53), to which the main body of the optocomponent is attached. The flag (53) is located asymmetrically at an outer edge of the leadframe and is, in the encapsulating operation, placed close to a sidewall in a mould cavity in a mould. Thereby an optical interface of standard type can be obtained in the wall of the capsule. Further, the flag (53) is flexibly attached, by means of zigzag-shaped bridges (67), to other portions of the leadframe so that the flag and thus the optocomponent will have a possibility to be resiliently and flexibly displaced a little at the positioning thereof in the mould cavity in the mould in relation to the other portions of the leadframe, in particular to its outer frame portions (61) and bridge portions (59).

Abstract: In encapsulating an optocomponent with a plastics material, an MT-connector compatible interface is obtained having bores for guide pins in the wall of the capsule and optical connection surfaces. These bores are obtained from mold cavity guide pins that are used for aligning the optocomponent in a mold cavity in a mold in the molding operation of the encapsulating material on top of the component. In order to achieve a good accuracy in the positioning of the component during the molding operation, the mold guide pins are as short as possible and end directly behind the component where they are supported by projections extending from each mold half. Thus, cavities are created extending straight through the capsule behind the component. The cavities allow that the guide pin bores are cleansed and that material residues are removed after the molding operation. Further, the cavities can be used for spring clamps for retaining the optocomponent capsule at an optical connector having a similar interface.

Abstract: In manufacturing an encapsulated optocomponent, the optocomponent is embedded in a plastics material. The optocomponent has guide grooves on one of its surfaces in which guide pins are to extend so that the encapsulated optocomponent will obtain an optical interface of standard type. For the encapsulating operation guide pins are placed in a mold cavity in a mold half and the optocomponent is placed in the cavity in the mold, so that the guide pins are engaged in the guide grooves and ar accurately inserted therein. To achieve this effect, a resilient or elastic force such as from plunger is applied to the other side of the optocomponent, so that it is pressed with some force against the guide pins. The cavity in the mold is then closed by placing a second mold half on top after which the encapsulating material can be introduced in the closed cavity in the mold.

Abstract: The optoelectrical components which up to now have been used in the fibre-optical region have had waveguides of quartz and glass with hermetic encapsulating, which components have had too high manufacturing costs for profitable use. Through making polymeric single mode (SM) waveguides from plastic, for example, benzocyclobutene polymer (BCB) a simple reliable and inexpensive concept for making waveguides can be obtained. Two of the commercially available grades of BCB/DOW Chemicals have furthermore a refractive index difference which permits manufacturing of buried waveguides with SM characteristics. These two types of BCB material have shown themselves to be especially usable for manufacturing of so-called buried SM waveguides: a heat curable grade (1,4) used for under- and over-cladding for waveguides and a photo-definable derivative (3) used as the waveguide material.

Abstract: An encapsulated optocomponent (1) comprises a single-crystal silicon wafer (3) and waveguides (9) located thereon, which at least partly are manufactured by means of process methods taken from the methods for manufacturing electronic integrated circuits. The waveguides (9) extend from an edge of the optoelectronic component (1) to an optoelectronic, active or passive component (11) attached to the surface of the silicon wafer (3). Over the region for connecting the waveguides (9) to the optoelectronic component (11) a transparent plastics material is molded (17), for instance an elastomer, having a refractive index adjusted to improve the optical coupling between the waveguides (9) and the optoelectronic component (11). The molding (17) covers advantageously all of said component (11) to also reduce thermal stresses between it and an exterior, protective layer (19) of a curable plastics material. The molded layer (17) can also cover the whole area of the waveguides (9) to form an upper cladding thereof.