Abstract: The disclosure relates to semiconductor structures and, more particularly, to structures for preventing dicing damage on photonics wafers. The structure includes: an optical waveguide structure to optical fiber interface formed on an integrated circuit; and a groove formed in a substrate and which includes a structure preventing a fluid pressure of a dicing operation from damaging the substrate along the groove.

Abstract: A component and chip assembly apparatus includes an assembly stage configured to support a chip, the chip including grooves defining a first pitch, the grooves including a first groove opening configured to receive a plurality of optical fibers and to align the plurality of optical fibers. A picker brings a fiber component including a plurality of optical fibers having a second pitch into contact with the chip such that each optical fiber is aligned with a respective groove. At least one of the assembly stage and the picker includes a comb having a plurality of teeth that define individual cavities therebetween, the cavities having a first cavity opening to receive the optical fibers and isolate each optical fiber from one another and pre-align the optical fibers so as to adjust the second pitch to substantially match the first pitch.

Abstract: A mechanism is provided for a fiber pigtail. The fiber pigtail includes a single mode fiber optic ribbon having a section of polymer ribbon removed to expose bare fibers, a fiber optic ferrule in contact with the single mode fiber optic ribbon at one distal end, and an integrated polymer lid permanently attached to the bare fibers of the single mode fiber optic ribbon at another distal end of the single mode fiber optic ribbon.

Abstract: A method and apparatus for making chip assemblies is disclosed that prevent or reduce the cracking and delamination of ultra low-k dielectrics in the back-end-of-line in Si chips that can occur during the chip assembly process. The method and apparatus apply pressure to the top and bottom surfaces of a substrate during the chip bonding process so that the bending and warping of the assembled modules are reduced. The reduced bending and warping prevent or reduce the cracking and delamination of ultra low-k dielectrics.

Abstract: Systems and methods are provided for obtaining measurements of an integrated circuit chip and a connected carrier to obtain the measurements of the interconnect heights. More specifically, a method is provided that includes defining a top best fit reference plane and a bottom best fit reference plane, and adjusting the top best fit reference and the bottom best fit reference to be superposed to one another. The method further includes calculating first distances between each height measurement for a first set of points and the adjusted top best fit reference plane, and calculating second distances between each height measurement for a second set of points and the adjusted bottom best fit reference plane. The method further includes calculating height values of a gap or interconnect between the first substrate and the second substrate by subtracting the thickness of the first substrate and the second distances from the first distances.

Abstract: A multi semiconductor device package includes a laser die and a photonics die. The laser die generates light and includes a laser facet that emits light from a light emitting surface. The photonics die modulates light emitted from the laser light emitting surface and includes a device side cavity that exposes an embedded waveguide optically connected with the laser facet. A laser die and photonics die attachment method includes positioning a device side of the laser die relative to a device side of the photonics die, engaging an alignment feature of the photonics die with an alignment feature of the laser die, installing the laser die within a device side recess of photonics die, electrically connecting the laser die with the photonics die, and optically connecting a laser facet of the laser die with an embedded waveguide of the phonics die.

Abstract: A structured substrate for optical fiber alignment is produced at least in part by forming a substrate with a plurality of buried conductive features and a plurality of top level conductive features. At least one of the plurality of top level conductive features defines a bond pad. A groove is then patterned in the substrate utilizing a portion of the plurality of top level conductive features as an etch mask and one of the plurality of buried conductive features as an etch stop. At least a portion of an optical fiber is placed into the groove.

Abstract: A structured substrate for optical fiber alignment is produced at least in part by forming a substrate with a plurality of buried conductive features and a plurality of top level conductive features. At least one of the plurality of top level conductive features defines a bond pad. A groove is then patterned in the substrate utilizing a portion of the plurality of top level conductive features as an etch mask and one of the plurality of buried conductive features as an etch stop. At least a portion of an optical fiber is placed into the groove.

Abstract: A mechanism is provided for a fiber pigtail. The fiber pigtail includes a single mode fiber optic ribbon having a section of polymer ribbon removed to expose bare fibers, a fiber optic ferrule in contact with the single mode fiber optic ribbon at one distal end, and an integrated polymer lid permanently attached to the bare fibers of the single mode fiber optic ribbon at another distal end of the single mode fiber optic ribbon.

Abstract: A component assembly apparatus includes a first device supportive of a first component and a second device configured to bring a second component into contact with the first component. The second device is further configured to apply a first pressurizing force directed to force respective first surfaces of the first and second components together, and the first device is configured to convert a portion of the first pressurizing force into a second pressurizing force directed transversely with respect to the first pressurizing force to force respective second surfaces of the first and second components together.

Abstract: A picktip is provided and includes a picktip member configured to extend along a longitudinal axis defined in parallel with emissions from an ultraviolet (UV) light source. The picktip member partially includes UV transparent material through which the emissions are directed and has an end face from which the emissions are exited. The picktip member defines vacuum pathways terminating at the end face, and the end face has a non-planar topography.

Abstract: A multi semiconductor device package includes a laser die and a photonics die. The laser die generates light and includes a laser facet that emits light from a light emitting surface. The photonics die modulates light emitted from the laser light emitting surface and includes a device side cavity that exposes an embedded waveguide optically connected with the laser facet. A laser die and photonics die attachment method includes positioning a device side of the laser die relative to a device side of the photonics die, engaging an alignment feature of the photonics die with an alignment feature of the laser die, installing the laser die within a device side recess of photonics die, electrically connecting the laser die with the photonics die, and optically connecting a laser facet of the laser die with an embedded waveguide of the phonics die.

Abstract: A method for assembling a semiconductor photonic package device includes bonding a portion of a first surface of a semiconductor die portion to a portion of a carrier portion, bonding a single mode optical ferrule portion to a portion of the first surface of the semiconductor die portion, and disposing a cover plate assembly in contact with the optical ferrule portion and the carrier portion.

Abstract: A structured substrate for optical fiber alignment is produced at least in part by forming a substrate with a plurality of buried conductive features and a plurality of top level conductive features. At least one of the plurality of top level conductive features defines a bond pad. A groove is then patterned in the substrate utilizing a portion of the plurality of top level conductive features as an etch mask and one of the plurality of buried conductive features as an etch stop. At least a portion of an optical fiber is placed into the groove.

Abstract: A method for assembling a semiconductor photonic package device includes bonding a portion of a first surface of a semiconductor die portion to a portion of a carrier portion, bonding a single mode optical ferrule portion to a portion of the first surface of the semiconductor die portion, and disposing a cover plate assembly in contact with the optical ferrule portion and the carrier portion.

Abstract: A mechanism is provided for a fiber pigtail. The fiber pigtail includes a single mode fiber optic ribbon having a section of polymer ribbon removed to expose bare fibers, a fiber optic ferrule in contact with the single mode fiber optic ribbon at one distal end, and an integrated polymer lid permanently attached to the bare fibers of the single mode fiber optic ribbon at another distal end of the single mode fiber optic ribbon.

Abstract: A structured substrate for optical fiber alignment is produced at least in part by forming a substrate with a plurality of buried conductive features and a plurality of top level conductive features. At least one of the plurality of top level conductive features defines a bond pad. A groove is then patterned in the substrate utilizing a portion of the plurality of top level conductive features as an etch mask and one of the plurality of buried conductive features as an etch stop. At least a portion of an optical fiber is placed into the groove.

Abstract: A mechanism is provided for a fiber pigtail. The fiber pigtail includes a single mode fiber optic ribbon having a section of polymer ribbon removed to expose bare fibers, a fiber optic ferrule in contact with the single mode fiber optic ribbon at one distal end, and an integrated polymer lid permanently attached to the bare fibers of the single mode fiber optic ribbon at another distal end of the single mode fiber optic ribbon.

Abstract: A method for assembling a semiconductor photonic package device includes bonding a portion of a first surface of a semiconductor die portion to a portion of a carrier portion, bonding a single mode optical ferrule portion to a portion of the first surface of the semiconductor die portion, and disposing a cover plate assembly in contact with the optical ferrule portion and the carrier portion.

Abstract: A method for assembling a semiconductor photonic package device includes bonding a portion of a first surface of a semiconductor die portion to a portion of a carrier portion, bonding a single mode optical ferrule portion to a portion of the first surface of the semiconductor die portion, and disposing a cover plate assembly in contact with the optical ferrule portion and the carrier portion.