Abstract: The invention encompasses delivery of reactants for chemical vapor deposition by direct liquid injection of a liquid ammonia solution. In a preferred embodiment, a solution of titanium tetraiodide in liquid ammonia provides reactants for the deposition of titanium nitride.

Abstract: The invention provides method and apparatus that control the thermal environment of the first substrate or substrate of series of substrates treated by a uniform direct-plasma, in order to reduce first-wafer effect. By providing supplemental heat to the substrate in treatment or, equivalently, reducing the rate of heat extraction from the substrate in treatment, early in the series, the invention creates steady-state process conditions that reduce substrate-to-substrate variability in process outcome.

Abstract: A DC power circuit for a electrostatic chuck adapted for use in a plasma etching system is disclosed. The power circuit receives an input that reflects a voltage bias on the workpiece caused by the application of an RF signal for creating the plasma. A DC power supply outputs a differential voltage that is balanced by inputting the voltage bias to a common reference node. The balanced DC output voltages are then presented to two electrodes of the ESC to create a clamping force securing the workpiece to the chuck at a lower voltage than would otherwise be applied in the absence of the bias feedback.