Abstract: A surface smooth enough to allow the formation thereon of a single domain magnetic element is obtained by covering a polished layer with a thin layer of the same material, to smooth sharp edges and corners. The resulting structure is useful in thin film magnetic heads.

Abstract: A combined read/write magnetic head is disclosed in which the read head includes a magnetoresistive element (MRE) overlying a substrate of substantially magnetically impermeable material, a broken (discontinuous) flux guide overlying the MRE and a continuous flux guide overlying the broken flux guide. The write head of the combined read/write magnetic head overlies the read head and shares the continuous flux guide with the read head, the continuous flux guide serving as a bottom pole of the write head. Significantly, the dimensions of the various elements of the combined read/write magnetic head are chosen so that relatively little magnetic flux produced by the write head during writing, or entering the write head during reading, is communicated via the shared flux guide to the MRE.

Abstract: A surface smooth enough to allow the formation thereon of a single domain magnetic element is obtained by covering a polished layer with a thin layer of the same material, to smooth sharp edges and corners. The resulting structure is useful in thin film magnetic heads.

Abstract: This is a system for connecting flexible electrical connectors having raised conductors above an insulating substrate to a plasma display panel having a glass substrate with the electrical conductors deposited in the bottom surface of conductor pathways etched in a glass substrate. The raised conductors on the connectors mate with the depressed conductors in the panel substrate. The spacing of the conductors in the connector may be varied to facilitate an exact mating with the conductors in the panel substrate. A clip device in combination with a flexible insulating force spreading member applies a uniform continuous pressure to the connector cable and glass substrate combination to maintain connection. This system may be used to facilitate the direct attachment of large scale integrated circuit chip carriers having conductor members on a surface thereof directly to conductors in a plasma display panel substrate.