Abstract: An apparatus for measuring a magnetic field is described, which comprises a core and an exciter coil for remagnetizing the core material. The remagnetizable core material is embodied as a layer or as multiple layers disposed at a distance from one another, and the core has a maximum total extension G where 2.5 mm?G?0.2 mm, a ratio of length to width that is greater than or equal to a value of twenty, and a thickness D where 2 ?m?D?0.2 ?m. Also described is a corresponding method for measuring a magnetic field.

Abstract: An expansion of the functional scope of a hybrid integrated component including an MEMS element, a cap for the micromechanical structure of the MEMS element, and an ASIC element having circuit components is provided. In this component, the circuit components of the ASIC element interact with the micromechanical structure of the MEMS element. The MEMS element is mounted on the ASIC element in such a way that the micromechanical structure of the MEMS element is situated in a cavity between the cap and the ASIC element. The ASIC element is additionally equipped with the circuit components of a magnetic sensor system. These circuit components are produced in or on the CMOS back-end stack of the ASIC element. The magnetic sensor system may thus be implemented without enlarging the chip area.

Abstract: An apparatus for measuring a magnetic field is described, which comprises a core and an exciter coil for remagnetizing the core material. The remagnetizable core material is embodied as a layer or as multiple layers disposed at a distance from one another, and the core has a maximum total extension G where 2.5 mm?G?0.2 mm, a ratio of length to width that is greater than or equal to a value of twenty, and a thickness D where 2 ?m?D?0.2 ?m. Also described is a corresponding method for measuring a magnetic field.

Abstract: An expansion of the functional scope of a hybrid integrated component including an MEMS element, a cap for the micromechanical structure of the MEMS element, and an ASIC element having circuit components is provided. In this component, the circuit components of the ASIC element interact with the micromechanical structure of the MEMS element. The MEMS element is mounted on the ASIC element in such a way that the micromechanical structure of the MEMS element is situated in a cavity between the cap and the ASIC element. The ASIC element is additionally equipped with the circuit components of a magnetic sensor system. These circuit components are produced in or on the CMOS back-end stack of the ASIC element. The magnetic sensor system may thus be implemented without enlarging the chip area.

Abstract: A magnetic field sensor having a first magnetic sensor core for measuring a magnetic field in a first measuring direction, and a second magnetic sensor core for measuring a magnetic field in a second measuring direction, the first and second magnetic sensor cores having a shared magnetic anisotropy.

Abstract: A method for producing a silicon substrate, including the steps of providing a silicon substrate having an essentially planar silicon surface, producing a porous silicon surface having a plurality of pores, in particular having macropores and/or mesopores and/or nanopores, applying a filling material that is to be inserted into the silicon, which has a diameter that is less than a diameter of the pores, inserting the filling material into the pores and removing the excess filling material form the silicon surface, if necessary, and tempering the silicon substrate that is furnished with the filling material that has been filled into the pores, at a temperature between ca. 1000° C. and ca. 1400° C., in order to close the generated pores again and to enclose the filling material.

Abstract: A magnetic field sensor includes a magnetizable core having a curved surface at least sectionally, a magnetization device for magnetizing the core, and a determination device for determining a magnetic field in the core.

Abstract: A method for manufacturing a semiconductor structure is provided which includes the following steps: a crystalline semiconductor substrate (1) is supplied; a porous region (10) is provided adjacent to a surface (OF) of the semiconductor substrate (1); a dopant (12) is introduced into the porous region (10) from the surface (OF); and the porous region (10) is thermally recrystallized into a crystalline doping region (10?) of the semiconductor substrate (1) whose doping type and/or doping concentration and/or doping distribution are/is different from those or that of the semiconductor substrate (1). A corresponding semiconductor structure is likewise provided.

Abstract: A semiconductor chip having contact surfaces on an upper side parallel to the wafer plane has terminal pads on a terminal-pad side perpendicular to the upper side, each terminal pad being conductively connected to an assigned contact surface. This allows vertical mounting of the chip on a substrate and contacting with the aid of customary bonding techniques. A manufacturing method and two mounting methods are described.

Abstract: A method for manufacturing a semiconductor structure is provided which includes the following operations: supplying a crystalline semiconductor substrate, providing a porous region adjacent to a surface of the semiconductor substrate, introducing a dopant into the porous region from the surface, and thermally recrystallizing the porous region into a crystalline doping region of the semiconductor substrate whose doping type and/or doping concentration and/or doping distribution are/is different from those or that of the semiconductor substrate. A corresponding semiconductor structure is likewise provided.

Abstract: A method for producing a silicon substrate, including the steps of providing a silicon substrate having an essentially planar silicon surface, producing a porous silicon surface having a plurality of pores, in particular having macropores and/or mesopores and/or nanopores, applying a filling material that is to be inserted into the silicon, which has a diameter that is less than a diameter of the pores, inserting the filling material into the pores and removing the excess filling material form the silicon surface, if necessary, and tempering the silicon substrate that is furnished with the filling material that has been filled into the pores, at a temperature between ca. 1000° C. and ca. 1400° C., in order to close the generated pores again and to enclose the filling material.

Abstract: A method for manufacturing a semiconductor structure is provided which includes the following operations: supplying a crystalline semiconductor substrate, providing a porous region adjacent to a surface of the semiconductor substrate, introducing a dopant into the porous region from the surface, and thermally recrystallizing the porous region into a crystalline doping region of the semiconductor substrate whose doping type and/or doping concentration and/or doping distribution are/is different from those or that of the semiconductor substrate. A corresponding semiconductor structure is likewise provided.

Abstract: A magnetic sensor system (1) is provided that contains sensor elements (5, 6) that are sensitive to magnetic fields, the electrical properties of said sensor elements being modifiable according to a magnetic field that can be influenced by a mobile, passive transmitter element (8). The magnetic sensor system (1) includes two sensor elements (5, 6) in a gradiometer system, each of which is assigned to one of two permanent magnets (2, 3) having a predetermined separation. In terms of their dimensions, separation and position relative to the sensor elements (5, 6), the permanent magnets (2, 3) are located such that the offset of the output signal of the sensor elements (5, 6) is minimized in the gradiometer system.

Abstract: A GMR sensor element is proposed, having a rotationally symmetrical positioning of especially eight GMR resistor elements which are connected to each other to form two Wheatstone's full bridges. This GMR sensor element is especially suitable for use in an angle sensor for the detection of the absolute position of the camshaft or the crankshaft in a motor vehicle, particularly in the case of a camshaft-free engine having electrical or electrohydraulic valve timing, of a motor position of an electrically commutated motor, or of detection of a windshield wiper position, or in the steering angle sensor system in motor vehicles.

Abstract: A magnetic sensor system (1) is provided that contains sensor elements (5, 6) that are sensitive to magnetic fields, the electrical properties of said sensor elements being modifiable according to a magnetic field that can be influenced by a mobile, passive transmitter element (8). The magnetic sensor system (1) includes two sensor elements (5, 6) in a gradiometer system, each of which is assigned to one of two permanent magnets (2, 3) having a predetermined separation. In terms of their dimensions, separation and position relative to the sensor elements (5, 6), the permanent magnets (2, 3) are located such that the offset of the output signal of the sensor elements (5, 6) is minimized in the gradiometer system.

Abstract: A magnetoresistive sensor element is provided, having a magnetoresistive layer system which, in top view, is at least regionally striated. The sensor element operates on the basis of the GMR effect and is constructed according to the spin valve principle, the striated layer system featuring a reference layer having a direction of magnetization substantially uninfluenced by a direction of an outer magnetic field acting on it. During operation, the sensor element provides a measuring signal which changes as a function of a measurement angle between the component of the field strength of the outer magnetic field lying in the plane of the layer system, and the direction of magnetization, and from which this measurement angle is able to be ascertained.

Abstract: A magnetoresistive sensor element is provided, having a magnetoresistive layer system which, in top view, is at least regionally striated. The sensor element operates on the basis of the GMR effect and is constructed according to the spin valve principle, the striated layer system featuring a reference layer having a direction of magnetization substantially uninfluenced by a direction of an outer magnetic field acting on it. During operation, the sensor element provides a measuring signal which changes as a function of a measurement angle between the component of the field strength of the outer magnetic field lying in the plane of the layer system, and the direction of magnetization, and from which this measurement angle is able to be ascertained.

Abstract: A GMR sensor element is proposed, having a rotationally symmetrical positioning of especially eight GMR resistor elements which are connected to each other to form two Wheatstone's full bridges. This GMR sensor element is especially suitable for use in an angle sensor for the detection of the absolute position of the camshaft or the crankshaft in a motor vehicle, particularly in the case of a camshaft-free engine having electrical or electrohydraulic valve timing, of a motor position of an electrically commutated motor, or of detection of a windshield wiper position, or in the steering angle sensor system in motor vehicles.