Abstract: A method for generating a postal indicia associated with a mailpiece is disclosed. The method includes generating an indicia data stream including a postal information segment and a security segment that is based upon the postal information segment and modifying a portion of the security segment to include additional information, thereby defining a modified indicia data stream.

Abstract: A method and mobile device for providing fast rendering of a web page and zoom capability using progressive image download. A data server requests the web page and converts images within the webpage into a progressive format before forwarding the web page data to the mobile device. The initial fully zoomed-out view of the web page is rendered using initial low resolution image data first received at the device. As additional progressive resolution data is received, the device is capable of zooming in to portions of the web page using the higher resolution data. If interpolations are used in rendering an image at a particular zoom level, then the image is repainted in higher resolution as additional progressive resolution data is received.

Abstract: An electrical connection for a surface-mount circuit device, and a method for forming the electrical connection. The electrical connection includes a solder stop that promotes the accurate location of a solder joint that electrically connects the surface-mount device to the conductor. In accordance with the invention, the solder stop also promotes stress relief of the electrical connection during thermal cycling, such that thermal cycle fatigue cracking occurs in the solder stop instead of the conductor and solder joint. As a result, thermal stresses are absorbed and dissipated by the solder stop, and do not adversely affect the continuity and mechanical integrity of the electrical connection. The solder stop preferably has a composition that contains an inorganic particulate filler in a glass matrix, the latter being present in an amount that forms a weak bond between the inorganic particles and between the solder stop and conductor.