Abstract: In some implementations, an optical assembly comprises an optical cavity; one or more detectors; and an optical component having an input face and an output face configured to receive an input beam to the input face and to produce one or more primary output beams, and a plurality of secondary output beams from the output face, the secondary output beams resulting from multiple internal reflections within the optical component. At least one of the input face is not perpendicular to the input beam or the output face is not perpendicular to the one or more primary output beams. Each primary output beam is transmitted through the optical cavity perpendicular to at least one surface of the optical cavity, and directed to a respective one of the one or more detectors. Each detector is arranged to exclude at least a portion of each secondary output beam.

Abstract: In some implementations, an optical assembly comprises an optical cavity; one or more detectors; and an optical component having an input face and an output face configured to receive an input beam to the input face and to produce one or more primary output beams, and a plurality of secondary output beams from the output face, the secondary output beams resulting from multiple internal reflections within the optical component. At least one of the input face is not perpendicular to the input beam or the output face is not perpendicular to the one or more primary output beams. Each primary output beam is transmitted through the optical cavity perpendicular to at least one surface of the optical cavity, and directed to a respective one of the one or more detectors. Each detector is arranged to exclude at least a portion of each secondary output beam.

Abstract: The invention relates to an optoelectronic assembly. The optoelectronic assembly comprises one or more optoelectronic components and a housing. The housing comprises an outer wall electrically connected to the one or more optoelectronic elements. The housing is configured to provide an electrical interface between the one or more optoelectronic components and an external electronic device. The electrical connection between the outer wall and the one or more optoelectronic components comprises an electrically conductive element. The electrically conductive element is supported on a dielectric material, such that the dielectric material provides structural support to the electrically conductive element between the one or more optoelectronic components and the outer wall.

Abstract: The invention relates to an optoelectronic assembly. The optoelectronic assembly comprises one or more optoelectronic components and a housing. The housing comprises an outer wall electrically connected to the one or more optoelectronic elements. The housing is configured to provide an electrical interface between the one or more optoelectronic components and an external electronic device. The electrical connection between the outer wall and the one or more optoelectronic components comprises an electrically conductive element. The electrically conductive element is supported on a dielectric material, such that the dielectric material provides structural support to the electrically conductive element between the one or more optoelectronic components and the outer wall.

Abstract: Optical devices are disclosed consisting of optical chips (planar lightwave circuits) which have optically symmetric or matching designs and properties and optical components which create asymmetry in the optical devices. The devices find application in detection in coherent and non-coherent optical communications systems.

Abstract: An enclosure for a laser package the enclosure being configured to receive a laser component within the enclosure, and further configured to receive for a driver integrated circuit (IC) (34) on the exterior of the enclosure, wherein the enclosure comprises first external electrical contacts (52) electrically connected to respective first IC electrical contacts (60), and second IC electrical contacts (62) electrically connected to respective first internal electrical contacts (64), wherein the first and second IC electrical contacts (60, 62) are configured for electrical connection to the driver IC (34). Heat dissipation of the driver IC is improved for the IC being mounted outside of the enclosure.

Abstract: The invention relates to a lens comprising two or more seating surfaces and an optical axis offset from the center of the lens such that the optical axis is spaced by a first distance from a first seating surface and by a second distance from a second seating surface. The first and second distances are different so that the lens can be orientated to provide at least two different optical axis heights depending upon which seating surface is chosen to seat the lens.

Abstract: An enclosure for a laser package the enclosure being configured to receive a laser component within the enclosure, and further configured to receive for a driver integrated circuit (IC) (34) on the exterior of the enclosure, wherein the enclosure comprises first external electrical contacts (52) electrically connected to respective first IC electrical contacts (60), and second IC electrical contacts (62) electrically connected to respective first internal electrical contacts (64), wherein the first and second IC electrical contacts (60, 62) are configured for electrical connection to the driver IC (34). Heat dissipation of the driver IC is improved for the IC being mounted outside of the enclosure.

Abstract: The invention relates to a lens comprising two or more seating surfaces and an optical axis offset from the centre of the lens such that the optical axis is spaced by a first distance from a first seating surface and by a second distance from a second seating surface. The first and second distances are different so that the lens can be orientated to provide at least two different optical axis heights depending upon which seating surface is chosen to seat the lens.

Abstract: A method of treating a surface for an electronic or optoelectronic component to be bonded with adhesive, and a substrate comprising a ceramic surface for an electronic or optoelectronic component. A coating is applied to the surface that causes a reduction in the surface energy of the surface.

Abstract: Optical devices are disclosed consisting of optical chips (planar lightwave circuits) which have optically symmetric or matching designs and properties and optical components which create asymmetry in the optical devices. The devices find application in detection in coherent and non-coherent optical communications systems.