Abstract: A vacuum system end effector and methods of use are presented. A method of picking and placing an object applies a negative pressure to a first chamber of a base of a vacuum system end effector. The negative pressure is supplied from the first chamber to a first region of a manifold to lift the object while venting a second chamber of the base to atmosphere. A barrier is moved away from an opening in the first chamber to supply negative pressure from the first chamber of the base to the second chamber of the base. A number of vents through the second chamber is blocked to cease venting to atmosphere. The negative pressure is supplied from the second chamber to a second region of the manifold to compress the object.

Abstract: A counter rotating generator has an outer housing including a cylindrical sidewall defining a pair of openings and a pair of circular mounting plates connected to the outer housing adjacent respective opposed ends thereof. A first shaft and an armature mounted thereon are rotatably mounted on one mounting plate. A second shaft and a field magnet mounted thereon via an inner housing is rotatably mounted on the other mounting plate in a direction opposite the armature. Slip rings are mounted on and encircle the inner housing. A pair of brush assemblies are mounted on the outer housing and extend respectively through the openings in sidewall thereof with brushes contacting the slip rings between and adjacent the inner housing and the outer housing sidewall. The large-diameter slip rings more quickly dissipate heat caused by frictional engagement of the brushes and slip rings, thus allowing the generator to operate at higher rates of revolution and higher temperatures.

Abstract: Systems and methods for polishing a substrate with reduced contamination are described. Moist air is directed to one or more surfaces in proximity to the polishing surface and exposed to airborne slurry particles generated during polishing. By maintaining the atmosphere in the vicinity of the exposed surfaces at an elevated relative humidity level, airborne slurry particles adhering to the exposed surfaces remain in suspension and, therefore, may be easily cleaned, e.g., during a high pressure rinse cycle. This feature reduces the likelihood that slurry particles will accumulate on exposed surfaces of the polishing apparatus and flake off while a substrate is being polished, reducing the likelihood of substrate defects caused by such slurry contamination.