Abstract: Methods for depositing film on substrates are provided. In these embodiments, the substrates are processed in batches. Due to changing conditions within a reaction chamber as additional substrates in the batch are processed, various film properties may trend over the course of a batch. The methods herein can be used to address the trending of film properties over the course of a batch. More specifically, film property trending is minimized by changing the amount of RF power used to process substrates over the course of the batch. Such methods are sometimes referred to as RF compensation methods.

Abstract: The embodiments herein relate to methods, apparatus, and systems for depositing film on substrates. In these embodiments, the substrates are processed in batches. Due to changing conditions within a reaction chamber as additional substrates in the batch are processed, various film properties may trend over the course of a batch. Disclosed herein are methods and apparatus for minimizing the trending of film properties over the course of a batch. More specifically, film property trending is minimized by changing the amount of RF power used to process substrates over the course of the batch. Such methods are sometimes referred to as RF compensation methods.

Abstract: Methods and apparatuses for calibrating eddy current sensors. A calibration curve is formed relating thickness of a conductive layer in a magnetic field to a value measured by the eddy current sensors or a value derived from such measurement, such as argument of impedance. The calibration curve may be an analytic function having infinite number terms, such as trigonometric, hyperbolic, and logarithmic, or a continuous plurality of functions, such as lines. High accuracy allows the omission of optical sensors, and use of eddy current sensors for endpoint detection, transition call detection, and closed loop control in which a process parameter is changed based on the measured magnetic flux density change in one or more processing zones.

Abstract: Methods and apparatuses for calibrating eddy current sensors. A calibration curve is formed relating thickness of a conductive layer in a magnetic field to a value measured by the eddy current sensors or a value derived from such measurement, such as argument of impedance. The calibration curve may be an analytic function having infinite number terms, such as trigonometric, hyperbolic, and logarithmic, or a continuous plurality of functions, such as lines. High accuracy allows the omission of optical sensors, and use of eddy current sensors for endpoint detection, transition call detection, and closed loop control in which a process parameter is changed based on the measured magnetic flux density change in one or more processing zones.

Abstract: Methods and apparatuses for calibrating eddy current sensors. A calibration curve is formed relating thickness of a conductive layer in a magnetic field to a value measured by the eddy current sensors or a value derived from such measurement, such as argument of impedance. The calibration curve may be an analytic function having infinite number terms, such as trigonometric, hyperbolic, and logarithmic, or a continuous plurality of functions, such as lines. High accuracy allows the omission of optical sensors, and use of eddy current sensors for endpoint detection, transition call detection, and closed loop control in which a process parameter is changed based on the measured magnetic flux density change in one or more processing zones.

Abstract: A work piece handling apparatus moves workpieces with a plurality of independently movable load cups that have combined multiple axes of motion. The apparatus can load and unload work pieces from a wet process station and move work pieces between wet process stations and maintain wet chemistry delivery to the workpiece without involving a robot. A method of work piece handling using the apparatus provides a significant throughput improvement by reducing the inherent time lag of pneumatic systems and eliminating multiple steps involving the robot during inter-station wafer transfer.

Abstract: Methods and apparatuses are provided for calibrating eddy current sensors. A calibration curve is formed relating thickness of a conductive layer in a magnetic field to a value measured by the eddy current sensors or a value derived from such measurement, such as argument of impedance. The calibration curve may be an analytic function having infinite number terms, such as trigonometric, hyperbolic, and logarithmic, or a continuous plurality of functions, such as lines. Such curves can reduce the number of wafers used in the calibration of the sensors while providing higher accuracy over a larger thickness range. High accuracy allows the omission of optical sensors, and use of eddy current sensors for endpoint detection, transition call detection, and closed loop control in which a process parameter is changed based on the measured magnetic flux density change in one or more processing zones.

Abstract: A method is provided for measuring edge exclusion on a workpiece that includes a wafer having a film disposed thereon. The method is performed by a CMP system employing a platen and a thickness sensor coupled to the platen and positioned to repeatedly travel a path over the edge of the film during polishing. The method comprises measuring the thickness of the workpiece during selected iterations of the probe path, and establishing from the wafer thickness measurements the length of time the probe is over the film (ton) during the selected iterations. Edge exclusion is determined for at least one iteration utilizing a function related to ton.

Abstract: A method is provided for measuring edge exclusion on a workpiece that includes a wafer having a film disposed thereon. The method is performed by a CMP system employing a platen and a thickness sensor coupled to the platen and positioned to repeatedly travel a path over the edge of the film during polishing. The method comprises measuring the thickness of the workpiece during selected iterations of the probe path, and establishing from the wafer thickness measurements the length of time the probe is over the film (ton) during the selected iterations. Edge exclusion is determined for at least one iteration utilizing a function related to ton.

Abstract: Methods are provided for monitoring a CMP process. An exemplary method comprises generating a plurality of thickness measurements of a metal layer using an in-situ eddy current measuring system. The thickness measurements are analyzed to derive a plurality of work piece metrics and the work piece metrics are assessed to determine if a predetermined number is within a predetermined specification. A signal is generated if the predetermined number of the work piece metrics is outside the predetermined specification.

Abstract: Methods are provided for controlling adjustable pressure zones of a CMP carrier. A method comprises determining a first thickness of a layer on a wafer underlying a first zone of the carrier. A first portion of the layer underlying the first zone is removed. The first zone is configured to exert a first pressure against the second surface of the wafer. A second thickness of the layer underlying the first zone is determined and a target thickness corresponding to a predetermined thickness profile is selected. A second pressure for the first zone is calculated using the first thickness, the second thickness, the first pressure, and the target thickness. The pressure exerted by the first zone against the second surface of the wafer is adjusted to the second pressure and the steps are repeated for a second zone.

Abstract: A mount for interposition between an electrode holder and an electrode for electrical discharge machining (EDM). The mount is cast from material such as aluminum or zinc. The mount has a shank portion that is connectable to the electrode holder and a connector portion or tip portion that is connectable to the electrode. The tip portion has a gluing surface that is dimensioned to be glued with a corresponding surface on the electrode. A plurality of deformable ears cast onto the gluing surface of the mount project outward and deform in contact with the electrode when the electrode and the mount are connected and bonded by glue, to thereby provide good electrical contact therebetween. The tip portion may also include grooves cast therein for receiving glue thereby improving the glue bond strength between the electrode and the mount. The mount includes an axial passage to provide for dielectric fluid flow therethrough.

Abstract: A centrifuge apparatus and a method of filtration are described. The centrifuge has radial and lateral filtration surfaces and separate discharge chambers for each. The lateral filter is located at an imperforate radial distance from the radial filter. This distance forces the filtration to occur through the radial filter and develop the filter cake rather than pass through the lateral filter which has no developed cake. The use of separate, laterally-disposed withdrawal chambers at different radial heights allows accurate control over the hydraulic filtration forces acting across the filter surfaces.

Abstract: A method and apparatus for recovering heat energy which is contained in the vapors of multi-stage evaporators utilized for thermal material-separation processes. According to the method, the vapors are supplied to at least one expulsion stage and to at least one vaporizing stage, whereby in the expulsion stage easily volatized or low boiling components of a multi-material mixture are vaporized, and in the vaporizing stage, at a pressure greater than the pressure in the expulsion stage, easily volatized components entering the vaporizing stage are vaporized; furthermore, the vaporous, easily volatized components at the higher pressure are supplied, along with the residue or remainder (the so-called residual mixture) of the multi-material mixture existing after the expulsion procedure, to an absorption stage; in addition, heating-steam or vapor is recovered by means of the heat resulting during the absorption stage.

Abstract: A multistage evaporator plant having combined vapor compressor and heat pump for recovery of the heat contained in the vapors. The evaporator section comprises several stages and a heat input, a condensate output and a vapor output. The vapor compressor can comprise a steam jet injector connected to a source of booster steam for providing steam power and connected to the heat input of the evaporator section, a distributor valve connected to an input of the steam jet injector.

Abstract: An apparatus for evaporating with heat regeneration has a plurality of evaporating stages, and an absorber which accommodates a multi-component mixture and is connected with the evaporating stages so that the vapor is admitted into the absorber and absorbed by the mixture with generation of heat which is further utilized for the evaporating process per se or another process.