Abstract: A method for controlling an actuated system includes receiving one or more data points, where each data point included in the one or more data points associates animation data with a different point in time, computing a curve based on the one or more data points, and causing the actuated system to perform a motion based on the curve.

Abstract: A Physical Layer (PHY) device, for use in an Ethernet network in a vehicle, includes a link interface and a transceiver. The link interface is configured to connect to a full-duplex Ethernet link. The transceiver is configured to communicate over the full-duplex Ethernet link in a first direction using a High-Data-Rate (HDR) signal having a first data rate, and to communicate over the full-duplex Ethernet link in a second direction, opposite to the first direction, using a Low-Data-Rate (LDR) signal having a second data rate, lower than the first data rate. A frequency spectrum of the LDR signal is contained within a frequency spectrum of the HDR signal.

Abstract: Systems and methods provide secure, end-to-end high-speed data encoding and communication. In certain embodiments, this is accomplished by modifying a header portion of a data packet received from a first device and complying with a one Mobile Industry Processor Interface (MIPI) protocol to create a modified data packet that complies with a faster MIPI protocol. The header portion of the modified data packet is validated during a tunnel mode operation using an error detection process to validate the modified data packet, which can then be securely transmitted to a second device that complies with the faster MIPI protocol.

Abstract: Systems and methods provide secure, end-to-end high-speed data encoding and communication. In certain embodiments, this is accomplished by modifying a header portion of a data packet received from a first device and complying with a one Mobile Industry Processor Interface (MIPI) protocol to create a modified data packet that complies with a faster MIPI protocol. The header portion of the modified data packet is validated during a tunnel mode operation using an error detection process to validate the modified data packet, which can then be securely transmitted to a second device that complies with the faster MIPI protocol.

Abstract: Systems and methods provide secure, end-to-end high-speed data encoding and communication. In certain embodiments, this is accomplished by modifying a header portion of a data packet received from a first device and complying with a one Mobile Industry Processor Interface (MIPI) protocol to create a modified data packet that complies with a faster MIPI protocol. The header portion of the modified data packet is validated during a tunnel mode operation using an error detection process to validate the modified data packet, which can then be securely transmitted to a second device that complies with the faster MIPI protocol.

Abstract: Systems and methods provide secure, end-to-end high-speed data encoding and communication. In certain embodiments, this is accomplished by modifying a header portion of a data packet received from a first device and complying with a one Mobile Industry Processor Interface (MIPI) protocol to create a modified data packet that complies with a faster MIPI protocol. The header portion of the modified data packet is validated during a tunnel mode operation using an error detection process to validate the modified data packet, which can then be securely transmitted to a second device that complies with the faster MIPI protocol.

Abstract: Methods, systems, and apparatus for testing semiconductor devices.

Abstract: Methods, systems, and apparatus for testing semiconductor devices.

Abstract: Methods, systems, and apparatus for testing semiconductor devices.

Abstract: Methods, systems, and apparatus for testing semiconductor devices.

Abstract: A system includes a first integrated circuit configured to operate in at least a normal mode and a test mode and a second integrated circuit, where both the first integrated circuit and the second integrated circuit are disposed within a same semiconductor device package. The system further includes a first terminal, external to the semiconductor device package, electronically coupled to the first integrated circuit and the second integrated circuit. The first terminal is electronically coupled to a buffer in the second integrated circuit and used to convey signals to or from the first integrated circuit.

Abstract: Methods, systems, and apparatus for testing semiconductor devices.

Abstract: Methods, systems, and apparatus for testing semiconductor devices. A semiconductor device includes one or more external terminals configured to receive fuse configuration data from an external source. The semiconductor device also includes a soft-blow circuit to generate a soft-blow signal based on the fuse configuration data, and a fuse circuit that includes a fuse and has first and second operational states corresponding to the fuse being intact and blown, respectively. The fuse circuit is configured to receive the soft-blow signal and to select its operational state to be the first or second operational state based on the received soft-blow signal.

Abstract: Lancet device includes a magnet member, a sleeve member capable of being affected by magnetic forces emanating from the magnet member, and a movable lancet holder. At least one of the following is also utilized; a lancet releaser movable at least between an initial position and a position that allows a lancet to be removed from the lancet holder and a lancet holder lock movable at least between a lock position that prevents axial movement of the lancet holder along an axial direction and an unlock position that allows the lancet holder to move along the axial direction.

Abstract: An optical device for a lens assembly of a camera module is disclosed. The optical device includes a liquid lens having at least one fixed lens and a transparent window, facing each other and delimiting, at least in part, an internal volume containing two immiscible liquids having different optical indices, and a first and a second electrode. The liquids form an interface moveable by application of a voltage between said electrodes. The optical device also includes a liquid lens holder, wherein the liquid lens holder has at least one electrical contact for contacting one electrode of the liquid lens, and at least one Z reference datum for aligning the fixed lens of the liquid lens with other optical elements of the lens assembly.

Abstract: Methods, systems, and apparatus for testing semiconductor devices. A semiconductor device includes one or more external terminals configured to receive fuse configuration data from an external source. The semiconductor device also includes a soft-blow circuit to generate a soft-blow signal based on the fuse configuration data, and a fuse circuit that includes a fuse and has first and second operational states corresponding to the fuse being intact and blown, respectively. The fuse circuit is configured to receive the soft-blow signal and to select its operational state to be the first or second operational state based on the received soft-blow signal.

Abstract: Methods, systems, and apparatus for testing semiconductor devices. A semiconductor device includes one or more external terminals configured to receive fuse configuration data from an external source. The semiconductor device also includes a soft-blow circuit to generate a soft-blow signal based on the fuse configuration data, and a fuse circuit that includes a fuse and has first and second operational states corresponding to the fuse being intact and blown, respectively. The fuse circuit is configured to receive the soft-blow signal and to select its operational state to be the first or second operational state based on the received soft-blow signal.

Abstract: An optical device for a lens assembly of a camera module is disclosed. The optical device includes a liquid lens having at least one fixed lens and a transparent window, facing each other and delimiting, at least in part, an internal volume containing two immiscible liquids having different optical indices, and a first and a second electrode. The liquids form an interface moveable by application of a voltage between said electrodes. The optical device also includes a liquid lens holder, wherein the liquid lens holder has at least one electrical contact for contacting one electrode of the liquid lens, and at least one Z reference datum for aligning the fixed lens of the liquid lens with other optical elements of the lens assembly.

Abstract: An apparatus for changing a connection between two serial components on the same circuit board. The apparatus comprises at least one column, and each column includes first, second, third and fourth pads. The first pad communicates with a first breakout connector disposed on the circuit board. The second pad communicates with a second breakout connector disposed on the circuit board. The third pad communicates with one of the serial components. The fourth pad communicates with the other of the serial components and with the third pad during normal operation.

Abstract: Methods, systems, and apparatus for testing semiconductor devices. A semiconductor device includes one or more external terminals configured to receive fuse configuration data from an external source. The semiconductor device also includes a soft-blow circuit to generate a soft-blow signal based on the fuse configuration data, and a fuse circuit that includes a fuse and has first and second operational states corresponding to the fuse being intact and blown, respectively. The fuse circuit is configured to receive the soft-blow signal and to select its operational state to be the first or second operational state based on the received soft-blow signal.