Patents by Inventor Paul G. Chenard

Paul G. Chenard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making multi-chip package with high-speed serial communications between semiconductor dice
    Patent number: 7537960
    Abstract: A multi-chip package includes a package substrate. First and second semiconductor die are formed on the package substrate. The first and the second semiconductor die are configured to communicate with each other via a high-speed serial communications protocol.
    Type: Grant
    Filed: January 10, 2008
    Date of Patent: May 26, 2009
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Michael G. Kelly, Paul G. Chenard, Revathi Uma Polisetti, Patrick A. McKinley