Patents by Inventor Paul G. Deacon

Paul G. Deacon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7566475
    Abstract: A method of making an acoustic insulator includes depositing thermoplastic particulate on a first surface of a base layer. The method further includes heating the particulate such that the particulate at least partially melts and penetrates the first surface of the base layer, thereby increasing density and airflow resistance of the base layer proximate the first surface such that the base layer has an areal mass in the range of 0.1 to 1.0 kg/m2 and an airflow resistance in the range of 300 to 5,000 Nsm?3 proximate the first surface.
    Type: Grant
    Filed: November 9, 2004
    Date of Patent: July 28, 2009
    Assignee: International Automotive Components Group North America, Inc.
    Inventors: Terence Connelly, Paul G. Deacon, Jean-Jacques Katz, Barry R. Wyerman, Kenneth R. Parrish
  • Patent number: 6789646
    Abstract: Acoustical attenuating devices (52) and method of forming them. The attenuating devices (52) include an exterior layer (64), a sound absorption layer (66), and multiple perforated layers (68) coupled to the sound absorption layer (66). The perforated layers (68) include a perforated structural layer (70) and a perforated substrate layer (72). The perforated structural layer (70) and the perforated substrate layer (72) provide structural stiffness and define multiple resonating tubes (88) that attenuate sound.
    Type: Grant
    Filed: October 11, 2002
    Date of Patent: September 14, 2004
    Assignee: Lear Corporation
    Inventors: Shuo Wang, Gordon Ebbitt, Mark W. Fero, Roland Woodcock, Brian A. Cristea, Paul G. Deacon
  • Publication number: 20040069564
    Abstract: Acoustical attenuating devices (52) and method of forming them. The attenuating devices (52) include an exterior layer (64), a sound absorption layer (66), and multiple perforated layers (68) coupled to the sound absorption layer (66). The perforated layers (68) include a perforated structural layer (70) and a perforated substrate layer (72). The perforated structural layer (70) and the perforated substrate layer (72) provide structural stiffness and define multiple resonating tubes (88) that attenuate sound.
    Type: Application
    Filed: October 11, 2002
    Publication date: April 15, 2004
    Inventors: Shuo Wang, Gordon Ebbitt, Mark W. Fero, Roland Woodcock, Brian A. Cristea, Paul G. Deacon