Abstract: A micropump includes a body with an inlet and an outlet defined therein. A channel connects the inlet to the outlet. The micropump further includes a magnetic shape memory (MSM) alloy positioned within the channel. The MSM alloy selectively forms a barrier between the inlet and the outlet. The micropump also includes an electrode and/or a transparent window positioned along a surface of the channel. A cavity is selectively formed within a surface of the MSM alloy due to a magnetic field. The cavity is selectively moveable between a first position adjacent to the inlet, a second position adjacent to the electrode and/or the transparent window, and a third position adjacent to the outlet, by altering the magnetic field. By altering a magnetic field applied to the MSM alloy, a fluid may be pumped from the inlet to the electrode and/or the transparent window where the fluid may be analyzed. The fluid may be subsequently pumped to the outlet.

Abstract: A micropump includes a body with an inlet and an outlet defined therein. A channel connects the inlet to the outlet. The micropump further includes a magnetic shape memory (MSM) alloy positioned within the channel. The MSM alloy selectively forms a barrier between the inlet and the outlet. The micropump also includes an electrode and/or a transparent window positioned along a surface of the channel. A cavity is selectively formed within a surface of the MSM alloy due to a magnetic field. The cavity is selectively moveable between a first position adjacent to the inlet, a second position adjacent to the electrode and/or the transparent window, and a third position adjacent to the outlet, by altering the magnetic field. By altering a magnetic field applied to the MSM alloy, a fluid may be pumped from the inlet to the electrode and/or the transparent window where the fluid may be analyzed. The fluid may be subsequently pumped to the outlet.

Abstract: Semiconductor substrates, particularly metallized substrates such as partially processed wafers, are rinsed with an aqueous medium, preferably deionized water, which further contains an anti-corrosive chemical agent or agents selected so as to minimize corrosion of metals resulting from contact with the water. The amount of anti-corrosive chemical agent is maintained in a controlled manner at a predetermined level or within a predetermined range preferably the rinsing with aqueous medium containing anticorrosive chemical agent is also carried out for a specified time, followed by further rinsing with deionized water alone. The rinsing may be combined, either in the same vessel or in a different vessel, with a subsequent drying step, such as a drying process utilizing a drying vapor introduced into the rinse tank or into a downstream vessel.