Abstract: The examples set forth herein involve inkjet printing one or more layers on a multilayer ceramic base. In some examples, the multilayer ceramic base is fired in a first firing process before one or more inkjet printed layers are printed on the multilayer ceramic base to form a combination package comprising the multilayer ceramic base and the one or more inkjet printed layers. In further examples, the combination package is fired in a second firing process.

Abstract: A semiconductor packaging structure is disclosed. The semiconductor packaging structure includes a heat spreader, a set of at least two leads, and a ceramic insulator. The heat spreader has a thermal conductivity greater than 300 W/m*K. The ceramic insulator has a mean flexural strength that is greater than 500 MPa and so better able to withstand the thermal expansion mismatch between it and the heat spreader. The heat spreader, the set of at least two leads, and the ceramic insulator may also be part of a semiconductor package along with at least one semiconductor device, a wire bond, and a ceramic lid.

Abstract: An optical module includes a high-thermal-expansion ceramic substrate on which is mounted a planar lightwave circuit as well as at least one device component. The high-thermal-expansion ceramic substrate may be used in conjunction with a high-thermal-expansion metal in order to reduce thermal stress produced from the mismatch of thermal properties within the optical module. The high-thermal-expansion ceramic substrate may also be part of an optical module package which includes a die attach area, on which at least one device can be mounted, and a circuit pattern which electrically connects the at least one device to other at least one device components. A high-thermal-expansion metal may also be used with the high-thermal-expansion ceramic substrate in order to reduce the thermal stress that would otherwise exist in the optical module package.

Abstract: A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled to the die by wire bonds. The non-ceramic based window frame is thermally matched to copper or other highly conductive material typically used for the flange, to facilitate assembly of the semiconductor package at high temperatures. The non-ceramic based window frame is flexible and is thermally matched to the highly conductive flange so as to expand and contract at a rate similar to the flange to prevent failure during assembly of the semiconductor package. The non-ceramic based material of the window frame includes a matrix of principally organic material, such as polytetrafluorethylene, filled with fibers which may be glass fibers or ceramic fibers.

Abstract: A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled to the die by wire bonds. The non-ceramic based window frame is thermally matched to copper or other highly conductive material typically used for the flange, to facilitate assembly of the semiconductor package at high temperatures. The non-ceramic based window frame is flexible and is thermally matched to the highly conductive flange so as to expand and contract at a rate similar to the flange to prevent failure during assembly of the semiconductor package. The non-ceramic based material of the window frame includes a matrix of principally organic material, such as polytetrafluorethylene, filled with fibers which may be glass fibers or ceramic fibers.

Abstract: A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled to the die by wire bonds. The non-ceramic based window frame is thermally matched to copper or other highly conductive material typically used for the flange, to facilitate assembly of the semiconductor package at high temperatures. The non-ceramic based window frame is flexible and is thermally matched to the highly conductive flange so as to expand and contract at a rate similar to the flange to prevent failure during assembly of the semiconductor package. The non-ceramic based material of the window frame includes a matrix of principally organic material, such as polytetrafluoroethylene, filled with fibers which may be glass fibers or ceramic fibers.

Abstract: The present invention provides methods and materials for use in repairing a worn component having thin walls. One kind of thin wall may be the wall of a cylindrical portion of the component where such wall has a worn inner surface and an opposite outer surface. The method includes the steps of preparing the outer surface of the component for cold spraying; cold spraying material onto the outer surface so as to form a strengthening coating; reaming the inner surface so as to create a repair surface with a repair diameter greater than the inner diameter; and installing an insert on the repair surface. The thickness of the coating is selected so as to impart a desired degree of strength to the wall. The method allows the repair of expensive aluminum castings that would otherwise, because of the thin wall construction, not be suitable for repair.

Abstract: A gauging system for checking a valve seat and a valve guide of an engine part, the system comprising: a gauge support mountable to a stable platform; a gauge which, in use, depends from the gauge support and has a gauge head for seating on the valve seat and insertion into the valve guide; a balancing mechanism to seat the gauge on the valve seat with a predetermined load, the valve seat providing the datum for the gauge; a motor to rotate the gauge head with respect to the valve seat and valve guide.

Abstract: A ring hybrid circuit achieves broadband matching in a compact, small footprint configuration which allows all matching structures to be printed on the same surface layer as the ring hybrid. The circuit includes a power dividing ring of circular configuration and having an inner diameter. A plurality of transmission lines are coupled to the ring at ports. Each of the ports has a notch in the inner diameter of the ring opposite the transmission line at the port for providing reactance compensation. The ring is provided with four ports, with each of the ports having a notch in the inner diameter of the ring opposite an associated one of the plurality of transmission lines. The ring may be constructed of a 50 ohm line, and each of the transmission lines may include a 42 ohm quarter-wave matching section extending out from the port thereof and terminating in a 50 ohm line.

Abstract: A gauging system for checking a valve seat and a valve guide of an engine part, the system comprising: a gauge support mountable to a stable platform; a gauge which, in use, depends from the gauge support and has a gauge head for seating on the valve seat and insertion into the valve guide; a balancing mechanism to seat the gauge on the valve seat with a predetermined load, the valve seat providing the datum for the gauge; a motor to rotate the gauge head with respect to the valve seat and valve guide.

Abstract: A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled to the die by wire bonds. The non-ceramic based window frame is thermally matched to copper or other highly conductive material typically used for the flange, to facilitate assembly of the semiconductor package at high temperatures. The non-ceramic based window frame is flexible and is thermally matched to the highly conductive flange so as to expand and contract at a rate similar to the flange to prevent failure during assembly of the semiconductor package. The non-ceramic based material of the window frame includes a matrix of principally organic material, such as polytetrafluorethylene, filled with fibers which may be glass fibers or ceramic fibers.

Abstract: RF feedthroughs for use with monolithic microwave integrated circuits (MMIC) are installed in environmentally protective or hermetically sealed packages that provide electromagnetic shielding. A feedthrough for an MMIC package has a dielectric substrate, a microstrip or transmission line formed on the substrate for transmitting high frequency electronic signals and a wall disposed above the transmission line and the substrate. The wall of the feedthrough has a varying thickness so that the narrowest portion of the wall is disposed on the transmission line substantially perpendicular to the substrate. The transmission line also has a varying width so that the narrowest width portion of the transmission line crosses the narrowest portion of the wall. The narrowest portion of the wall may be created by placing two oppositely facing concaved surfaces on each side of the wall. To reduce parasitic capacitance, the substrate and the wall may each have an air cavity embedded in respective bodies.

Abstract: A hermetically sealed package assembly for microwave circuits in the high microwave frequencies having a dielectric gap defined in the substrate. The package assembly comprises a substrate for carrying the circuit on a top surface, a seal ring wall carried on the top surface, a via structure provided through the substrate for transmitting high-frequency signals into and out of the package, and a conducive lead carried on the bottom surface of the substrate and passes under the seal ring wall. A dielectric gap is provided in the substrate between the seal ring wall and the lead to reduce the capacitive coupling between the lead and the wall. The gap may be a sealed cavity provided inside the substrate, or a cutout area in the substrate so that the lead is suspended in air at the location where it passes under the seal ring wall.

Abstract: Absorption solvents for removing mercaptans from gas streams are disclosed. The absorption solvents comprise an alkylether of a polyalkylene glycol, e.g., methoxytriglycol, and a secondary monoalkanolamine, e.g., N-methylethanolamine, as well as optionally other amines, e.g., methyldiethanolamine and diethanolamine. The absorption solvents do not require the presence of iodine for removal of mercaptans. Absorption processes utilizing the solvents are also disclosed.

Abstract: Absorption solvents for removing mercaptans from gas streams are disclosed. The absorption solvents comprise an alkylether of a polyalkylene glycol, e.g., methoxytriglycol, and a secondary monoalkanolamine, e.g., N-methylethanolamine, as well as optionally other amines, e.g., methyldiethanolamine and diethanolamine. The absorption solvents do not require the presence of iodine for removal of mercaptans. Absorption processes utilizing the solvents are also disclosed.

Abstract: A machine for comminuting material by impact, comprising a hollow impeller rotatable about a substantially vertical axis, an upwardly opening material inlet and radially outward material outlet ducts (40). The ducts (40) are sufficiently narrow to prevent material striking the walls thereof with a high impact force. A plurality of anvils are arranged to be struck by material which has emerged from the ducts (40). One side wall of each duct (40) is lined with a tile (55) of a ceramic material such as aluminum oxide.

Abstract: A machine for comminuting material by impact has a hollow impeller rotatable about a substantially vertical axis. The impeller has an upwardly opening material inlet and at least one radially outward material outlet. A tube serves to feed material to be comminuted into the material inlet. The lower portion of the tube rotates about its longitudinal axis and imparts an angular velocity to the material fed therethrough. Material entering the impeller travels along at least a portion of the interior walls of the impeller and on emerging from the impeller strikes an anvil where comminution occurs.