Patents by Inventor Paul Gauche

Paul Gauche has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11549761
    Abstract: A system or method for thermal storage includes a recess or containment unit having a first storage layer and a second storage layer comprising a permeable filler material. An intermediate layer is disposed between the storage layers. A primary well traverses the layer in the recess. The primary well is in thermal communication with the first permeable filler material and the second permeable filler material. A heat source is provided for heating an inlet fluid. An input pump is in fluid communication with the primary well and the heat source. The primary well receives heated inlet fluid from the inlet pump and injects the fluid into the second layers. The heated inlet fluid transfers heat to the respective permeable filler material radially from the primary well toward an outer periphery of the thermocline recess.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: January 10, 2023
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Clifford K. Ho, Paul Gauche, Hendrik F. Laubscher
  • Publication number: 20220260284
    Abstract: An air receiver for use in a solar power plant receives sunlight from a plurality of heliostats focused on the air receiver via an aperture of the receiver to heat air in the cavity of the receiver. The heated air is directed out of the receiver via one or more output ports in fluid communication with the cavity. A solar power tower can include one or more receivers (e.g., oriented in different directions) and have outflow conduit(s) in fluid communication with the output ports. The outflow conduit(s) receive heated air from the one or more receivers and direct it toward one or both of a hot thermal storage tank and a heat utilization module (e.g., for use in generating electricity or facilitating an industrial process, such as a chemical reaction).
    Type: Application
    Filed: February 7, 2022
    Publication date: August 18, 2022
    Inventors: Steven Edward Schell, Andrew Stephen Oles, Paul Gauche
  • Patent number: 7501699
    Abstract: A package includes a thermal solution to thermal couple to a semiconductor device to remove heat generated by the semiconductor device, and a device to electrically isolate at least a portion of the thermal solution from the semiconductor device. The package also includes a biasing device to apply a voltage to a body of the semiconductor device.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: March 10, 2009
    Assignee: Intel Corporation
    Inventors: Paul Gauche, Rajiv Mongia, Alex Waizman, Efraim Rotem
  • Patent number: 7372702
    Abstract: According to some embodiments, an arrangement is provided for cooling a heat-generating device, including a memory module (e.g., a small outline dual inline memory module), in a system such as a laptop computer. The arrangement includes a heat spreader having a first section including at least one thermally conductive coupling member to thermally engage surfaces of electronic components on the heat-generating device and a second section including at least one spring member to cause pressurized engagement between the first section and the surfaces of the electronic components. The heat spreader may further be thermally coupled to a heat exchanger or a keyboard from which the heat is dissipated. Other embodiments are also described and claimed.
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: May 13, 2008
    Assignee: Intel Corporation
    Inventors: Paul Gauche, Robert T. Jackson
  • Publication number: 20070023892
    Abstract: A package includes a thermal solution to thermal couple to a semiconductor device to remove heat generated by the semiconductor device, and a device to electrically isolate at least a portion of the thermal solution from the semiconductor device. The package also includes a biasing device to apply a voltage to a body of the semiconductor device.
    Type: Application
    Filed: June 30, 2005
    Publication date: February 1, 2007
    Inventors: Paul Gauche, Rajiv Mongia, Alex Waizman, Efraim Rotem
  • Publication number: 20060146497
    Abstract: A cooling system includes a heat spreader configured to wrap around a memory module inserted into a memory connector. The heat spreader is coupled to a heat exchanger and a fan.
    Type: Application
    Filed: December 30, 2004
    Publication date: July 6, 2006
    Inventors: Paul Gauche, Shawn McEuen
  • Publication number: 20060139891
    Abstract: According to some embodiments, an arrangement is provided for cooling a heat-generating device, including a memory module (e.g., a small outline dual inline memory module), in a system such as a laptop computer. The arrangement includes a heat spreader having a first section including at least one thermally conductive coupling member to thermally engage surfaces of electronic components on the heat-generating device and a second section including at least one spring member to cause pressurized engagement between the first section and the surfaces of the electronic components. The heat spreader may further be thermally coupled to a heat exchanger or a keyboard from which the heat is dissipated. Other embodiments are also described and claimed.
    Type: Application
    Filed: December 23, 2004
    Publication date: June 29, 2006
    Inventors: Paul Gauche, Robert Jackson