Patents by Inventor Paul Gennissen

Paul Gennissen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240029978
    Abstract: Methods and apparatuses for failure mode detection in a contactor are disclosed. In a particular embodiment, a method for failure mode detection in a contactor includes maintaining the contactor command signal in the open state; connecting the contactor to a voltage supply that supplies a first predetermined voltage amount to the contactor; measuring a first amount of time for a magnitude of a coil current of the coil to exceed a first predetermined current threshold; determining whether the first amount of time exceeds a first predetermined time threshold; responsive to determining that the first amount of time does not exceed the first predetermined time threshold, determining that the contactor is in the open state; and responsive to determining that the first amount of time exceeds the first predetermined time threshold, determining that the contactor is in the closed state.
    Type: Application
    Filed: September 15, 2021
    Publication date: January 25, 2024
    Inventors: SIEBE BERVELING, PAUL GENNISSEN, MURRAY MCTIGUE, GREGORY LYONS
  • Patent number: 8499642
    Abstract: The invention relates to a fluid pressure sensing device comprising a pressure sensing transducer having a support structure and a diaphragm attached to said support structure, the diaphragm having a fluid facing side. A housing has a transducer receiving cavity defined by a bottom wall and a housing sidewall extending upwardly from the bottom wall. The bottom wall is formed with a fluid pressure receiving recess. A fluid pressure port is formed in the housing in communication with the recess. The diaphragm is positioned between the support structure and the fluid pressure receiving recess and a seal material around a support structure sidewall fixes the pressure sensing transducer in the housing and provides a hermetic seal.
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: August 6, 2013
    Assignee: Sensata Technologies, Inc.
    Inventors: Wico Hopman, Robert Zwijze, Paul Gennissen, Maarten van Noorden, George van der Donk, Jans Kruise
  • Publication number: 20110296927
    Abstract: The invention relates to a fluid pressure sensing device comprising a pressure sensing transducer having a support structure and a diaphragm attached to said support structure, the diaphragm having a fluid facing side. A housing has a transducer receiving cavity defined by a bottom wall and a housing sidewall extending upwardly from the bottom wall. The bottom wall is formed with a fluid pressure receiving recess. A fluid pressure port is formed in the housing in communication with the recess. The diaphragm is positioned between the support structure and the fluid pressure receiving recess and a seal material around a support structure sidewall fixes the pressure sensing transducer in the housing and provides a hermetic seal.
    Type: Application
    Filed: April 29, 2011
    Publication date: December 8, 2011
    Inventors: Wico Hopman, Robert Zwijze, Paul Gennissen, Maarten van Noorden, George van der Donk, Jans Kruise
  • Patent number: 7000478
    Abstract: A combined pressure and temperature transducer (10) particularly adapted for high temperature fluids has a sensing element assembly mounted at the tip of a tubular probe (20) which is arranged for placement in a fluid flow path. A sensing element (12) includes a pressure responsive diaphragm (12g) closing the open end of the tubular probe and being provided with piezo-resistive gauge elements bonded to the diaphragm. Wires are bonded between the gauge elements and a first, heat resistant, printed circuit board (PCB). The first PCB, together with the piezo-resistive elements, form a Wheatstone bridge. An inner connector (26) mounts elongated, axial stress absorbing contacts connecting the first PCB at one end of the inner connector with a second printed circuit board (PCB) mounted at the opposite end of the inner connector physically removed from the sensing element and first PCB and away from the fluid flow path. The second PCB mounts signal conditioning and amplifying electronics.
    Type: Grant
    Filed: March 4, 2005
    Date of Patent: February 21, 2006
    Assignee: Texas Instruments Incorporated
    Inventors: Cris Ruiz Zwollo, Paul Gennissen, Roger M. Appelo