Patents by Inventor Paul Gies

Paul Gies has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070022830
    Abstract: A sensor body for use in a pig for determining characteristics of a pipeline wall though which the pig passes includes a circuit board and a single coil wrapped around the circuit board. A microcontroller is mounted to the circuit board and connected to the single coil and configured to induce a waveform on the coil to thereby create an eddy current in the pipeline wall adjacent the sensor body. The microcontroller is also configured to measure changes in a characteristic of the induced waveform on the single coil that correspond to the presence of anomalies on an inside diameter of the pipeline wall. The sensor body also includes a sensor body cover molded about the circuit board, the microcontroller and the single coil. The sensor body cover consists essentially of a wear resistant, non-conductive material that includes a polymer material.
    Type: Application
    Filed: July 29, 2005
    Publication date: February 1, 2007
    Inventors: Michael Mandziuk, Paul Gies
  • Patent number: 5948562
    Abstract: A metal foil laminate package for an electrochemical cell has a multilayered structure (32, 34) comprising a metal foil (40) sandwiched between layers of a thermoplastic (38) and a heat-sealable polymer (42). An electrically conducting tab (28) extends from the cell and has a layer of insulative tape (29) disposed on both sides of the tab. Apertures (50,52,60,62) formed through the various layers of the package expose both sides of the tab, providing sites for subsequent welding of the tab to external circuitry.
    Type: Grant
    Filed: November 3, 1997
    Date of Patent: September 7, 1999
    Assignee: Motorola, Inc.
    Inventors: Michael Fulcher, Paul Gies, Steven L. Hassenzahl