Patents by Inventor Paul Goodwin
Paul Goodwin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7539582Abstract: An apparatus for detecting spectral components in a predetermined frequency band within a signal includes first and second processing devices and first, second, and third connectors tuned to the frequency band. The first processing device includes first, second, and third elements. The second processing device includes fourth, fifth, and sixth elements. The first connector is coupled to the first and fourth elements, the second connector to the second and fifth elements, and the third connector to the third and sixth elements. An apparatus for analyzing spectral components in predetermined frequency bands within a signal includes an input for receiving the signal, a device for isolating a portion of the signal, and frequency detectors coupled in parallel to the device. Each frequency detector corresponds to a frequency band and generates an output signal component corresponding to a proportion of energy of the spectral components detected by the frequency detector.Type: GrantFiled: April 3, 2007Date of Patent: May 26, 2009Assignee: Variance Dynamical, IncInventor: Paul A. Goodwin
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Patent number: 7522425Abstract: Multiple DIMM circuits or instantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers, are arranged in two ranks in two fields on each side of a flexible circuit. The flexible circuit has expansion contacts disposed along one side. The flexible circuit is disposed about a supporting substrate or board to place one complete DIMM circuit or instantiation on each side of the constructed module. In alternative but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile.Type: GrantFiled: October 9, 2007Date of Patent: April 21, 2009Assignee: Entorian Technologies, LPInventor: Paul Goodwin
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Patent number: 7511968Abstract: Multiple fully buffered DIMM circuits or instantiations are presented in a single module. In a preferred embodiment, memory integrated circuits (preferably CSPs) and accompanying AMBs are arranged in two ranks in two fields on each side of a flexible circuit. The flexible circuit has expansion contacts disposed along one side. The flexible circuit is disposed about a supporting substrate or board to place one complete FB-DIMM circuit or instantiation on each side of the constructed module. In alternative but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile.Type: GrantFiled: December 8, 2004Date of Patent: March 31, 2009Assignee: Entorian Technologies, LPInventor: Paul Goodwin
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Patent number: 7508723Abstract: A memory module having a DRAM device configured to generate a low DQS state on a DQS line, and a buffer coupled to the DRAM device, the buffer having a plurality of drivers, wherein the buffer is configured to detect the low DQS state by comparing the low DQS state to a low voltage level of one of the plurality of drivers.Type: GrantFiled: May 24, 2007Date of Patent: March 24, 2009Assignee: Entorian Technologies, LPInventors: Paul Goodwin, Brian Miller, Robert Washburn
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Publication number: 20090052124Abstract: Flexible circuitry is populated with integrated circuitry (ICs), and contacts are distributed along the flexible circuitry to provide connection to an application environment. The flexible circuitry is disposed about a rigid substrate, placing the ICs on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate is preferably devised from thermally-conductive materials and one or more thermal spreaders are in thermal contact with at least some of the ICs. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.Type: ApplicationFiled: October 31, 2008Publication date: February 26, 2009Applicant: Entorian Technologies, L.P. (formerly Staktek Group, L.P)Inventors: James Douglas Wehrly, JR., James Wilder, Mark Wolfe, Paul Goodwin
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Publication number: 20090046431Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs.Type: ApplicationFiled: October 24, 2008Publication date: February 19, 2009Inventors: James Douglas Wehrly, Jr., James Wilder, Paul Goodwin, Mark Wolfe
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Patent number: 7480152Abstract: A flexible circuit is populated with integrated circuits. Integrated circuits populated on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. In a preferred embodiment, the overall module profile does not, consequently, include the thickness of the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile. The flex circuit may be aligned using tooling holes in the flex circuit and substrate. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers. Other embodiments may stagger or offset the ICs.Type: GrantFiled: December 7, 2004Date of Patent: January 20, 2009Assignee: Entorian Technologies, LPInventor: Paul Goodwin
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Patent number: 7474973Abstract: An apparatus for detecting spectral components in a predetermined frequency band within a signal includes first and second processing devices and first, second, and third connectors tuned to the frequency band. The first processing device includes first, second, and third elements. The second processing device includes fourth, fifth, and sixth elements. The first connector is coupled to the first and fourth elements, the second connector to the second and fifth elements, and the third connector to the third and sixth elements. An apparatus for analyzing spectral components in predetermined frequency bands within a signal includes an input for receiving the signal, a device for isolating a portion of the signal, and frequency detectors coupled in parallel to the device. Each frequency detector corresponds to a frequency band and generates an output signal component corresponding to a proportion of energy of the spectral components detected by the frequency detector.Type: GrantFiled: June 25, 2004Date of Patent: January 6, 2009Assignee: Variance Dynamicaz, Inc.Inventor: Paul A. Goodwin
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Patent number: 7468893Abstract: Modules with larger areas for device mounting but minimized profiles are provided. In preferred embodiments, modules that employ one or more flex circuits have sculpted supportive substrates to selectively accommodate larger or taller profile devices. In several preferred embodiments, higher profile circuits such as AMBs, for example, are disposed in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. In other preferred embodiments, both the substrate and the flexible circuitry have openings into which a device of greater profile such as, for example, an AMB or a logic device with or without a resident heat sink are provided with a volume to occupy without adding the full profile of the taller device to the profile of the module itself.Type: GrantFiled: February 16, 2005Date of Patent: December 23, 2008Assignee: Entorian Technologies, LPInventor: Paul Goodwin
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Patent number: 7468553Abstract: The present invention provides a system and method for devising stackable assemblies that may be then stacked to create a stacked circuit module. One or more integrated circuit (IC) die are disposed on one or more sides of a redistribution substrate that is preferably flexible circuitry. In some preferred embodiments, the die and redistribution substrate are bonded together and wire-bond connected. Two or more stackable assemblies are interconnected through frame members to create low profile high density stacked circuit modules.Type: GrantFiled: March 6, 2007Date of Patent: December 23, 2008Assignee: Entorian Technologies, LPInventors: Leland Szewerenko, Paul Goodwin, James Douglas Wehrly, Jr.
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Patent number: 7459784Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs.Type: GrantFiled: December 20, 2007Date of Patent: December 2, 2008Assignee: Entorian Technologies, LPInventors: James Douglas Wehrly, Jr., James Wilder, Paul Goodwin, Mark Wolfe
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Publication number: 20080291747Abstract: A memory module having a DRAM device configured to generate a low DQS state on a DQS line, and a buffer coupled to the DRAM device, the buffer having a plurality of drivers, wherein the buffer is configured to detect the low DQS state by comparing the low DQS state to a low voltage level of one of the plurality of drivers.Type: ApplicationFiled: May 24, 2007Publication date: November 27, 2008Applicant: STAKTEK GROUP L.P.Inventors: Paul Goodwin, Brian Miller, Robert Washburn
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Publication number: 20080278901Abstract: Memory module flex circuitry is devised to accommodate packaged integrated circuit devices (ICs) of varying heights or thicknesses. The invention may be employed to advantage in a variety of modules that employ flex circuitry including, but not limited to, fully-buffered, registered or more simple memory modules. Many such modules may replace conventionally-constructed DIMMs without change to the system in which the module is employed. Regions of the flex circuitry devised to provide one or more mounting locales for ICs are delineated, in part, from the main body of the flex circuit. The delineation may be implemented in a preferred embodiment by separating a designated IC mounting area or peninsula from the main body of the flex circuitry either with isolating areas or separations or with tabs that extend from the primary perimeter of the flex circuitry.Type: ApplicationFiled: March 11, 2005Publication date: November 13, 2008Inventor: Paul Goodwin
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Publication number: 20080278924Abstract: A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board.Type: ApplicationFiled: June 26, 2008Publication date: November 13, 2008Inventors: James W. Cady, Paul Goodwin
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Patent number: 7446410Abstract: Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices.Type: GrantFiled: November 18, 2005Date of Patent: November 4, 2008Assignee: Entorian Technologies, LPInventors: James Douglas Wehrly, Jr., James Wilder, Mark Wolfe, Paul Goodwin
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Patent number: 7443023Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs.Type: GrantFiled: September 21, 2005Date of Patent: October 28, 2008Assignee: Entorian Technologies, LPInventors: James Douglas Wehrly, Jr., James Wilder, Paul Goodwin, Mark Wolfe
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Patent number: 7423885Abstract: A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board.Type: GrantFiled: June 21, 2005Date of Patent: September 9, 2008Assignee: Entorian Technologies, LPInventors: James W. Cady, Paul Goodwin
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Publication number: 20080093724Abstract: The present invention provides a system and method for devising stackable assemblies that may be then stacked to create a stacked circuit module. One or more integrated circuit (IC) die are disposed on one or more sides of a redistribution substrate that is preferably flexible circuitry. In some preferred embodiments, the die and redistribution substrate are bonded together and wire-bond connected. Two or more stackable assemblies are interconnected through frame members to create low profile high density stacked circuit modules.Type: ApplicationFiled: March 6, 2007Publication date: April 24, 2008Applicant: STAKTEK GROUP L.P.Inventors: Leland Szewerenko, Paul Goodwin, James Douglas Wehrly
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Publication number: 20080094803Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs.Type: ApplicationFiled: December 20, 2007Publication date: April 24, 2008Inventors: James Wehrly, James Wilder, Paul Goodwin, Mark Wolfe
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Publication number: 20080079132Abstract: Two or more integrated circuits are stacked into a high density circuit module. The lower IC is inverted. Electrical connection to the integrated circuits is made by module contacts on a flexible circuit extending along the lower portion of the module. In one embodiment, the flexible circuit provides a balanced electrical connection to two CSP integrated circuits. In another embodiment, the flexible circuit provides a balanced electrical connection to inter-flex contacts of additional flexible circuits on two submodules. The additional flexible circuits provide further balanced connections to CSP integrated circuits in each submodule.Type: ApplicationFiled: October 29, 2007Publication date: April 3, 2008Applicant: Staktek Group L.P.Inventor: Paul Goodwin