Abstract: There may be provided a wafer support member which may include a support column and a plurality of wafer-engagement-shelves extending substantially perpendicularly to the support column from a first side of the support column. Each wafer-engagement-shelf may define a plurality of through-holes extending between a base surface and an opposite wafer-engagement surface of the wafer-engagement shelf 130. The plurality of through-holes may serve as discharge ports for a plurality of loose particulates on the wafer-engagement-shelf to exit therefrom via the discharge ports.

Abstract: A heatsink includes a fin-set that includes a corrugated ribbon having a first, deformable, portion and a second, convective, portion that is not deformed. A plurality of corrugated ribbons may be physically and/or thermally coupled (e.g., via mechanical fasteners, thermally conductive bonding, or reflow) to form the heatsink. A force may be applied to the heatsink sufficient to at least partially crush the first, deformable, portion to conform to an external surface of an electronic device. The heatsink may be physically affixed and thermally coupled to an external surface of the electronic device via mechanical fasteners, thermally conductive adhesives or via reflow of a low-melt temperature layer disposed on an external surface of the heatsink. The crushed portion of the first, deformable, portion conforms to the regular (e.g., planar) or irregular surface profile of the electronic device, beneficially and surprisingly improving thermal performance of the heatsink.

Abstract: An embodiment of an electronic apparatus comprises a main board, a wing board electrically coupled to the main board by a flexible connector along an edge of the main board, wherein the wing board is arranged at an angle that is non-parallel with respect to the main board. Other embodiments are disclosed and claimed.

Abstract: Methods and apparatus to grasp an object with an unmanned aerial vehicle are described herein. An example unmanned aerial vehicle includes a gripper having a claw to grasp onto an object and an active material disposed on the claw. The example unmanned aerial vehicle further includes a material activator to: (1) apply an activation signal to the active material to soften the active material while the claw grasps the object with the active material, and (2) allow the active material to harden in a shape substantially matching a surface of the object.

Abstract: Technologies for facilitating the transfer of heat from a first location to a second location. In embodiments, the technologies include composite thermal interface materials, thermal interface components, and methods for making such composites and components. The thermal interface materials may include a core including a first b-stage matrix and first thermally conductive particles, and a skinning layer including a second b-stage matrix and second thermally conductive particles. The thermal interface components may be formed from or include the composite thermal interface material, and may include one or more convex surfaces.

Abstract: Apparatuses, storage media and methods associated with computer assisted or autonomous driving (CA/AD), are disclosed herein. In some embodiments, an apparatus includes one or more communication interfaces to receive an intended or projected path of an object proximally moving near the CA/AD vehicle; sensors to collect sensor data associated with stationary or moving objects in a surrounding area of the CA/AD vehicle; and a navigation subsystem to navigate or assist in navigating the CA/AD vehicle to a destination, based at least in part on the sensor data associated with the stationary or moving objects in the surrounding area, and the received intended or projected path of the object proximally moving near the CA/AD vehicle. Other embodiments are also described and claimed.

Abstract: A heatsink includes a fin-set that includes a corrugated ribbon having a first, deformable, portion and a second, convective, portion that is not deformed. A plurality of corrugated ribbons may be physically and/or thermally coupled (e.g., via mechanical fasteners, thermally conductive bonding, or reflow) to form the heatsink. A force may be applied to the heatsink sufficient to at least partially crush the first, deformable, portion to conform to an external surface of an electronic device. The heatsink may be physically affixed and thermally coupled to an external surface of the electronic device via mechanical fasteners, thermally conductive adhesives or via reflow of a low-melt temperature layer disposed on an external surface of the heatsink. The crushed portion of the first, deformable, portion conforms to the regular (e.g., planar) or irregular surface profile of the electronic device, beneficially and surprisingly improving thermal performance of the heatsink.

Abstract: Technologies for facilitating the transfer of heat from a first location to a second location. In embodiments, the technologies include composite thermal interface materials, thermal interface components, and methods for making such composites and components. The thermal interface materials may include a core including a first b-stage matrix and first thermally conductive particles, and a skinning layer including a second b-stage matrix and second thermally conductive particles. The thermal interface components may be formed from or include the composite thermal interface material, and may include one or more convex surfaces.

Abstract: Methods and apparatus to grasp an object with an unmanned aerial vehicle are described herein. An example unmanned aerial vehicle includes a gripper having a claw to grasp onto an object and an active material disposed on the claw. The example unmanned aerial vehicle further includes a material activator to: (1) apply an activation signal to the active material to soften the active material while the claw grasps the object with the active material, and (2) allow the active material to harden in a shape substantially matching a surface of the object.

Abstract: Techniques for providing airflow through an electronic device are described herein. An example of an electronic device includes an integrated display and a circuit board comprising a processor, a memory, and a driver circuit coupled to the integrated display. A housing encloses the integrated display and the circuit board, wherein the housing is comprised of at least two panels wherein at least one of the panels is formed from a porous material configured to allow air flow through the panel.

Abstract: Particular embodiments described herein provide for a morphing material that may include an outer layer, a polymer layer, and an inner core. The polymer layer can be between the inner core and the outer layer. The inner core can include a shape memory polymer and the shape memory polymer can have a known glass transition temperature. The morphing material can be mechanically deformed to a temporary shape when a temperature of the shape memory polymer is at or above the glass transition temperature.

Abstract: Techniques for forming a surface to attach a biomimetic material are described herein. The techniques include a method including forming a surface of a computing device, wherein the surface of the computing device comprises a feature to receive a biomimetic material. A biomimetic material is attached to the surface of the computing device via the feature of the surface.

Abstract: The present disclosure provides techniques for a flexible sensor. In particular, the present disclosure provides techniques for a flexible, capacitive flexible sensor. A computing device can include a flexible sensor to collect input. The computing device can also include a processor to process the input. A deformation of the flexible sensor changes a capacitance of the flexible sensor.

Abstract: Techniques for forming portions of a computing device are described herein. The techniques include a method including forming a first portion of a computing device, the first portion composed of a metal. A nanostructure layer of the first portion is formed, and a second portion of the computing device is formed, wherein the second portion composed of a polymer. The method includes coupling the first portion to the second portion by injection molding the polymer of the second portion onto the nanostructure layer.

Abstract: Techniques for modifying forming a top cover and bottom cover of a computing device are described herein. The techniques include a method including forming a bottom cover of a computing device having protrusions, and forming a top cover of the computing device having recesses, the top cover recesses to receive the bottom cover protrusions.

Abstract: Techniques for providing airflow through an electronic device are described herein. An example of an electronic device includes an integrated display and a circuit board comprising a processor, a memory, and a driver circuit coupled to the integrated display. A housing encloses the integrated display and the circuit board, wherein the housing is comprised of at least two panels wherein at least one of the panels is formed from a porous material configured to allow air flow through the panel.

Abstract: A chassis for a computing device and a method for generating the chassis. The method includes generating a polymer-fiber sheet comprising composite strands of discontinuous fiber strands. Each of the discontinuous fiber strands overlap with a neighboring discontinuous fiber strand, and are impregnated with a polymer. The sheet is heated above the glass temperature of the polymer. The sheet is inserted into a mold. Additionally, the sheet is molded to a specified shape to generate the chassis. Further, the chassis is cooled below the glass temperature.

Abstract: A case for a computing device and method for generating the case are described. The method includes heating a sheet above a melting temperature of a polymer. The sheet includes composite strands impregnated with a polymer. The sheet and a multi-layer film are inserted in a mold. The sheet and multi-layer film are molded in a single mold cycle.

Abstract: An apparatus is disclosed herein. The apparatus includes a heat pipe configured to cool a heat-generating device, and a heat exchanger. The heat pipe includes an outer structure containing aluminum, coolant disposed within the outer structure, and a barrier layer disposed between the coolant and the outer structure.

Abstract: A coolant capable of enhancing corrosion inhibition includes a potassium formate solution having a first concentration of a polyphosphate salt and a second concentration of dicyandiamide. In one embodiment, such a coolant may provide corrosion inhibition that is especially effective for silicon and aluminum, among other materials. The corrosion protection may be enhanced for certain materials by adding benzotriazole in a third concentration to the potassium formate solution.