Patents by Inventor Paul H. Roosen

Paul H. Roosen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board having an overlapping via
    Patent number: 7064279
    Abstract: A printed circuit board (100) includes a first BGA landing pad (102) having a first clearance zone (106) and a second BGA landing pad (104) having a second clearance zone (108). A via (110), overlaps the first clearance zone and the second clearance zone such that the first BGA landing pad and the second BGA landing pad are electrically coupled to the via.
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: June 20, 2006
    Assignee: Motorola, Inc.
    Inventors: Matthew C. Meyer, Jesse C. Chai, Paul H. Roosen, Robert T. Young