Abstract: An improved leadframe structure and an improved IC package and process using such structure are disclosed. The improved leadframe structure eliminates the dambar commonly found on leadframes for use in plastic packages. A polymer structure is formed and employed primarily to act as a barrier to flashing during the epoxy encapsulation process and secondarily to provide support for the leads. The polymer structure remains a permanent part of the IC package following molding. An improved IC packaging process using the improved leadframe design eliminates common debar, dejunk and deflash operations, resulting in reduced capital costs and higher yields.

Abstract: An improved diazotype photoprinting material of high printing speed and its method of preparation are disclosed. The improvement is achieved by distributing through the film coating a substantially uniform distribution of sites having a refractive index substantially different from that of the remainder of the coating. The sites consist of either voids or finely divided solids. Voids are created by contacting the film coating with an aqueous fluid at elevated temperature or an organic solvent for a sufficient period of time to cause a measurable haze to appear on the film. The sites operate to reflect or refract incident light rays during imagewise exposure, and thus increase the optical path length through a given thickness of film.