Patents by Inventor Paul Hack

Paul Hack has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250192032
    Abstract: According to various examples, a semiconductor device for backside power delivery is described. The semiconductor device may include a device layer including an integrated circuit, wherein the device layer is between a top metal layer and a bottom metal layer. The semiconductor device may also include a focused-ion beam access point on the top metal layer. The semiconductor device may also include one or more tie cells connected to the integrated circuit of the device layer. The semiconductor device may also include one or more functional cells connected to the one or more tie cells, wherein the one or more tie cells and one or more function cells provide an electrical route on the top metal layer to the focused-ion beam access point.
    Type: Application
    Filed: December 7, 2023
    Publication date: June 12, 2025
    Inventors: Carlos Alberto JIMENEZ CHAVEZ, Paul HACK, John GIACOBBE, Ilan RONEN
  • Publication number: 20240143882
    Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed. An example apparatus includes interface circuitry to obtain circuitry logic, the circuitry logic including a plurality of circuit elements logically connected by a plurality of nodes; identifier circuitry to: identify a node within the plurality of nodes for elevation; and identify a layer of an integrated circuit; port adder circuitry to modify the circuitry logic by adding a signal port, the signal port corresponding to a physical terminal in the identified layer; connector circuitry to modify the circuitry logic by connecting the signal port to the identified node; and layout planner circuitry to determine a layout of the integrated circuit based on the modified circuitry logic.
    Type: Application
    Filed: October 31, 2022
    Publication date: May 2, 2024
    Inventors: Paul Hack, Carlos Alberto Jimenez Chavez, Scot Zickel, Ilan Ronen, Koby Zand, Leonid Tsukerman, John Giacobbe
  • Patent number: 11424573
    Abstract: Connectors that have a low profile, can form strong and reliable connections despite connection alignment errors, and can be readily manufactured. One example can provide a connector receptacle having a magnetic array arranged to provide a strong attachment that allows the use of a low profile connector receptacle and connector insert. The magnetic array can include magnets and magnetic elements, where the magnetic elements can be magnetically conductive pole-pieces. Each pole piece can have magnets at two of its sides. Another example can provide contacts for a connector insert that can have more than one contacting surface to connect to a contact of a connector receptacle.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: August 23, 2022
    Assignee: Apple Inc.
    Inventors: Mahmoud R. Amini, Ayoub Yari Boroujeni, John C. DiFonzo, Bradley J. Hamel, George Tziviskos, Hao Zhu, Paul Hack, Jean-March Gery