Patents by Inventor Paul Harlan REKEMEYER

Paul Harlan REKEMEYER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Through-silicon transmission lines and other structures enabled by same
    Patent number: 11973057
    Abstract: One embodiment is a microelectronic assembly including an assembly support structure; a first die including a pair of hot via comprising through-substrate-via (TSVs) extending through the first die between first and second sides thereof and a plurality of ground vias surrounding the pair of hot vias and extending through the first die between the first and second sides thereof. The first die further includes a pair of signal interconnect structures electrically connected to the pair of hot vias disposed on the second side of the first die. The assembly further includes a second die between the assembly support structure and the first die the pair of signal interconnect structures disposed on the first side thereof. The first die is connected to the second die via a signal die-to-die (DTD) interconnect structure including the signal interconnect structures of the first and second dies.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: April 30, 2024
    Assignee: Analog Devices, Inc.
    Inventors: Ed Balboni, Ozan Gurbuz, William B. Beckwith, Paul Harlan Rekemeyer
  • THROUGH-SILICON TRANSMISSION LINES AND OTHER STRUCTURES ENABLED BY SAME
    Publication number: 20220189917
    Abstract: One embodiment is a microelectronic assembly including an assembly support structure; a first die including a pair of hot via comprising through-substrate-via (TSVs) extending through the first die between first and second sides thereof and a plurality of ground vias surrounding the pair of hot vias and extending through the first die between the first and second sides thereof. The first die further includes a pair of signal interconnect structures electrically connected to the pair of hot vias disposed on the second side of the first die. The assembly further includes a second die between the assembly support structure and the first die the pair of signal interconnect structures disposed on the first side thereof. The first die is connected to the second die via a signal die-to-die (DTD) interconnect structure including the signal interconnect structures of the first and second dies.
    Type: Application
    Filed: December 10, 2021
    Publication date: June 16, 2022
    Applicant: Analog Devices, Inc.
    Inventors: Ed BALBONI, Ozan GURBUZ, William B. BECKWITH, Paul Harlan REKEMEYER