Abstract: A system for distributing dated promotions over the internet via email to registered consumers permits the consumer to identify goods of interest and offers numerous ways to limit or restrict the number of dated promotions to be received in a given time period, such as by relative importance of goods, level of retail outlet, intended user, and the like, so that received dated promotions are of the most significance to the consumer.

Abstract: A semiconductor chip package is disclosed. The package includes a substrate, a metallization layer formed on one side of the substrate and a semiconductor die mounted on the substrate. The semiconductor die is electrically connected to a portion of the metallization layer. A shield element is mounted on the substrate and electrically connected to a portion of the metallization layer.

Abstract: A deck construction including a plurality of supports for anchoring deck construction elements to a building site. The supports include a body (which may be an integrally molded concrete pier) having upper and lower portions. The upper portion includes at least one slot for seating a horizontally oriented construction member. The slot includes a center socket portion having four extended corners for seating the bottom end of a vertically oriented construction member. The slot and center socket are defined by connecting wall portions which may be integral to the body or may be of plastic or metal and suitable secured to the body. In some cases, two mutually perpendicular slots are provided.

Abstract: A semiconductor chip package includes a plurality of leadframe portions and a semiconductor die mounted on at least one of the leadframe portions. A shield element is attached to at least one of the leadframe portions. A package mold surrounds the semiconductor die and the shield element. Radiation shielding is thereby provided in a practical manner for a leadframe-based semiconductor chip package.

Abstract: A deck construction including a plurality of supports for anchoring deck construction elements to a building site. The supports include a body (which may be an integrally molded concrete pier block) having upper and lower portions. The upper portion includes at least one slot for seating a horizontally oriented construction member. The slot includes a center socket portion having four extended corners for seating the bottom end of a vertically oriented construction member. The slot and center socket are defined by connecting wall portions which may be integral to the body or may be of plastic or metal and suitable secured to the body. In some cases, two mutually perpendicular slots are provided. Upon constructing a deck, pier blocks are positioned on a building site with vertical support elements placed within the center socket of those pier blocks determined to have their upper ends below a desired predetermined height.

Abstract: Embodiments of integrated circuit packages for housing a plurality of integrated circuits are disclosed, along with methods of making the packages. One embodiment of a package includes a substrate having a first surface with first metallizations thereon and an opposite second surface with second metallizations thereon. One or more apertures extend through the substrate between the first and second surfaces. Conductive vias also extend through the substrate. Eachof the vias electrically connect one or more of the first and second metallizations. A first integrated circuit having a first surface with first bond pads thereon and an opposite second surface is attached to the second surface of the substrate so that the first bond pads are superimposed with an aperture. At least one second integrated circuit is attached to the second surface of the first integrated circuit. An opposite surface of the second integrated circuit has edge bond pads thereon.

Abstract: A deck construction including a plurality of supports for anchoring deck construction elements to a building site. The supports include a body (which may be an integrally molded concrete pier) having upper and lower portions. The upper portion includes at least one slot for seating a horizontally oriented construction member. The slot includes a center socket portion having four extended corners for seating the bottom end of a vertically oriented construction member. The slot and center socket are defined by connecting wall portions which may be integral to the body or may be of plastic or metal and suitable secured to the body. In some cases, two mutually perpendicular slots are provided.

Abstract: A fuel for producing attractive audio and visual burning results is disclosed.

Abstract: Semiconductor devices and methods of manufacturing such devices are disclosed. In one embodiment of this invention, a semiconductor chip is bonded to a first surface of a substrate. The substrate extends beyond the edge of the chip. Signal input/output pads on the chip are juxtaposed with an opening in the substrate. A molded support is formed on the portion of the first surface of the substrate that extends beyond between the sidewall of the edge of the chip. The support prevents bending of the substrate, and allows solder balls to be formed on the entire area of a second surface of the substrate opposite the first surface of the substrate. A heat dissipating plate is mounted on a surface of the chip opposite the substrate. The heat dissipating plate is attached to the support.

Abstract: A fuel for producing attractive audio and visual burning results is disclosed.

Abstract: Chip-scale semiconductor packages of the fan-out type and methods of manufacturing such packages are disclosed. In one package embodiment within the invention, the package substrate is stiff enough to effectively carry an increased number of solder balls on an exterior area outside the edge of a semiconductor chip, in addition to the area above the chip. In another package embodiment, a molded support is mounted to the lower surface of the exterior area. The methods of the present invention include making a plurality of packages on a substrate. Prior to sawing a wafer to obtain chips for the assembly method, the wafer is inspected so as to discriminate between good chips and the defective chips. Only good chips are mounted to a wafer-shaped or strip-shaped substrate.

Abstract: A deck construction including a plurality of supports for anchoring deck construction elements to a building site. The supports include a body (which may be an integrally molded concrete pier) having upper and lower portions. The upper portion includes at least one slot for seating a horizontally oriented construction member. The slot includes a center socket portion having four extended corners for seating the bottom end of a vertically oriented construction member. The slot and center socket are defined by connecting wall portions which may be integral to the body or may be of plastic or metal and suitable secured to the body. In some cases, two mutually perpendicular slots are provided.

Abstract: Methods of making packages for integrated circuit devices are described. An exemplary method includes providing a substrate sheet having an array of package sites at which individual integrated circuit packages will be assembled. A continuous sheet of an adhesive film is placed on the substrate strip so as to cover the plurality of package sites. The adhesive film sheet is then cured by applying heat or pressure or heat and pressure to the substrate strip and the sheet of adhesive film. The pressure and/or heat cause the sheet of adhesive film to be permanently attached to the substrate strip. A subsequent step forms one or more apertures though the joined substrate strip and adhesive film at each package site. An integrated circuit die is mounted on the adhesive film at each package site, and bond wires are attached through the aperture between metallizations of the substrate and the integrated circuit device.

Abstract: A thermally enhanced package for an integrated circuit, the integrated circuit having a surface with bond pads formed thereon, includes a heat sink structure attached to a central region of the integrated circuit surface inward of the bond pads. The package further includes a substrate attached to the heat sink structure. The heat sink structure includes a heat sink and first, second adhesive layers between the heat sink and the integrated circuit, substrate, respectively. The heat sink enhances heat transfer between the integrated circuit and the substrate. Further, the first, second adhesive layers decouple any difference in thermal expansion between the integrated circuit, the heat sink and the substrate.

Abstract: Embodiments of integrated circuit packages for housing a plurality of integrated circuits are disclosed, along with methods of making the packages. One integrated circuit package comprises a substrate having a first surface having first metallizations thereon, an opposite second surface, and a plurality of apertures between the first and second surfaces. A first integrated circuit having a first surface with first bond pads thereon and an opposite second surface is mounted on the second surface of the substrate so that the first bond pads are superimposed with an aperture. Each first bond pad is electrically connected by a first bond wire extending through the superimposing aperture to a first metallization. A second integrated circuit having a first surface with conductive second bond pads thereon is mounted on the second surface of the first integrated circuit.

Abstract: A deck construction including a plurality of supports for anchoring deck construction elements to a building site. The supports include a body (which may be an integrally molded concrete pier) having upper and lower portions. The upper portion includes at least one slot for seating a horizontally oriented construction member. The slot includes a center socket portion having four extended corners for seating the bottom end of a vertically oriented construction member. The slot and center socket are defined by connecting wall portions which may be integral to the body or may be of plastic or metal and suitable secured to the body. In some cases, two mutually perpendicular slots are provided.

Abstract: A deck construction including a plurality of supports for anchoring deck construction elements to a building site. The supports include a body (which may be an integrally molded concrete pier) having upper and lower portions. The upper portion includes at least one slot for seating a horizontally oriented construction member. The slot includes a center socket portion having four extended corners for seating the bottom end of a vertically oriented construction member. The slot and center socket are defined by connecting wall portions which may be integral to the body or may be of plastic or metal and suitable secured to the body. In some cases, two mutually perpendicular slots are provided.

Abstract: A deck construction including a plurality of supports for anchoring deck construction elements to a building site. The supports include a body (which may be an integrally molded concrete pier) having upper and lower portions. The upper portion includes at least one slot for seating a horizontally oriented construction member. The slot includes a center socket portion having four extended corners for seating the bottom end of a vertically oriented construction member. The slot and center socket are defined by connecting wall portions which may be integral to the body or may be of plastic or metal and suitable secured to the body. In some cases, two mutually perpendicular slots are provided.

Abstract: A freestanding fireplace hearth includes an artificial log set, a snuffer and a fuel tray beneath the snuffer and log set. When refilling is necessary, a drawer containing the fuel tray is pulled out for access, the tray descending away from the snuffer as it is pulled laterally outward. After filling, the drawer is pushed in and the fuel tray moves laterally under, and then upwardly into operative position with respect to, the snuffer. The snuffer can be opened to allow vaporized fuel to ascend into the log set. When lit, an attractive dancing flame is displayed. When the snuffer is closed, fuel vapor flow through the log set closes and the fire is extinguished. Details of tray, drawer, snuffer and hearth construction are disclosed.

Abstract: An extendable and retractable snow pole which is particularly useful by snowboarders. In the retracted position the pole is adapted to be mounted on the snowboard between the front and rear bindings. In the extended position the pole is adapted to be gripped by the snowboarder at one end and utilizes a basket affixed to the opposite end of the pole to push the user along the surface of the snow or ice enabling him to more easily traverse a flat area or to aid him in getting upright after a fall. The length of the snow pole is adjustable to a plurality of positions. The grip end of the pole is pivotally mounted and the plate or basket end can be rotated upwardly such that a portion of the basket overlaps the rear leg or knee of the user to support the rear end of the snowboard when the user is seated on a chairlift. Detent mechanisms provide easy access for extending and retracting the pole. A second detent mechanism enables a pivotable and removable connection of the grip end of the pole from the snowboard.