Patents by Inventor Paul Hsiang

Paul Hsiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060184393
    Abstract: A method and system for facilitating the filling out of a medical evaluation form online and/or for facilitating the reviewing of the medical information form online are disclosed. By filling out the medical information form online, the form can be filled out generally anywhere and generally any time prior to a consultation with the doctor. Assistance with the filling out process can be provided, such as by a friend or relative, without requiring that the person providing the assistance accompany the patient to the doctor's office. A doctor can review the medical evaluation form generally anywhere and generally any time prior to the consultation. On line and face-to-face medical evaluations and interactions can potentially be made safer, more efficient and of higher quality by using such a process.
    Type: Application
    Filed: December 28, 2005
    Publication date: August 17, 2006
    Inventors: Leon Ewin, Paul Hsiang, Thomas Tackabery, Derek Niehus, Leslie Davidner, Richard Tackabery
  • Publication number: 20030019912
    Abstract: An outer cover shell and plate member soldering method includes the steps of: (a) applying a predetermined thickness of soldering material to the border of the plate member, (b) pressing the outer cover shell on the plate member in the platform of a high-frequency heating machine, (c) lifting the platform to let the outer cover shell be coupled to the induction coil of the high-frequency heating machine, (d) driving the high-frequency heating machine to output an oscillating current, causing a high temperature to be produced around the border of the outer cover shell within the induction coil, (e) letting the soldering material be melted due to the thermal effect of the outer cover shell, so that the outer cover shell and the plate member are bonded together.
    Type: Application
    Filed: July 11, 2001
    Publication date: January 30, 2003
    Inventors: Dennis Shiau, Paul Hsiang