Patents by Inventor Paul Humpal

Paul Humpal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070231541
    Abstract: Disclosed herein is a microstructured tool having a microstructured layer on a base layer. The microstructured layer is made from an aromatic acrylate polymer that is a reaction product of an oligomer and a radiation curable diluent, the aromatic acrylate polymer having a ratio of aromatic to aliphatic carbons of less than about 1:1, the oligomer comprising a multifunctional acrylate monomer or an acrylate functionalized oligomer. The microstructured layer has a microstructured surface having one or more features. The base layer may be metal, polymer, ceramic, or glass. Also disclosed herein is a method of making the microstructured tool using laser ablation. The microstructured tool may be used to make articles suitable for use in optical applications.
    Type: Application
    Filed: March 31, 2006
    Publication date: October 4, 2007
    Inventors: Paul Humpal, Patrick Fleming, Thomas Corrigan, Todd Williams, Tadesse Nigatu
  • Publication number: 20070133095
    Abstract: An optical element having a front side and a back side operates in an ambient lit mode and a backlit mode. The optical element includes a diffusely reflecting layer facing the front side for reflecting ambient light. A light absorbing layer faces the back side and is positioned to prevent back light from illuminating the diffusely reflecting layer. A plurality of light transmitting regions extend through the light absorbing layer and the diffusely reflecting layer for permitting back light to pass through in a restricted angular range without illuminating the diffusely reflecting layer.
    Type: Application
    Filed: December 8, 2005
    Publication date: June 14, 2007
    Inventors: Kay-Uwe Schenke, Guido Hitschmarin, Stefan Dietrich, Robert Bennett, Paul Humpal, Keith Kotchick
  • Publication number: 20050029942
    Abstract: A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.
    Type: Application
    Filed: September 8, 2004
    Publication date: February 10, 2005
    Inventors: Raymond Chiu, Timothy Hoopman, Paul Humpal, Vincent King, Kenneth Dillon