Patents by Inventor Paul I. Mikulan

Paul I. Mikulan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Memory cell having closed curve structure
    Patent number: 10504910
    Abstract: A memory cell for a printhead includes a substrate with a source and a drain. The substrate further includes a channel located between the source and the drain and surrounding the drain. The drain can include a first rounded closed curved structure. The memory cell can include a floating gate and a control gate. The floating gate can include a second rounded closed curve structure located above the channel and below the control gate. The control gate is capacitively coupled to the floating gate.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: December 10, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Reynaldo V. Villavelez, Paul I. Mikulan
  • Circuit that selects EPROMs individually and in parallel
    Patent number: 9864524
    Abstract: An integrated circuit including a first EPROM, a second EPROM, and a circuit. The first EPROM is configured to provide a first state and a second state. The second EPROM is configured to provide a third state and a fourth state. The circuit is configured to select the first EPROM and the second EPROM individually and in parallel with each other.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: January 9, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ning Ge, Paul I. Mikulan, Bee Ling Peh
  • CIRCUIT THAT SELECTS EPROMS INDIVIDUALLY AND IN PARALLEL
    Publication number: 20170147212
    Abstract: An integrated circuit including a first EPROM, a second EPROM, and a circuit. The first EPROM is configured to provide a first state and a second state. The second EPROM is configured to provide a third state and a fourth state. The circuit is configured to select the first EPROM and the second EPROM individually and in parallel with each other.
    Type: Application
    Filed: January 26, 2017
    Publication date: May 25, 2017
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Ning GE, Paul I. MIKULAN, Bee Ling PEH
  • Circuit that selects EPROMs individually and in parallel
    Patent number: 9592664
    Abstract: An integrated circuit including a first EPROM, a second EPROM, and a circuit. The first EPROM is configured to provide a first state and a second state. The second EPROM is configured to provide a third state and a fourth state. The circuit is configured to select the first EPROM and the second EPROM individually and in parallel with each other.
    Type: Grant
    Filed: September 27, 2011
    Date of Patent: March 14, 2017
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Ning Ge, Paul I. Mikulan, Bee Ling Peh
  • MEMORY CELL HAVING CLOSED CURVE STRUCTURE
    Publication number: 20170062449
    Abstract: A memory cell for a printhead includes a substrate with a source and a drain. The substrate further includes a channel located between the source and the drain and surrounding the drain. The drain can include a first rounded closed curved structure. The memory cell can include a floating gate and a control gate. The floating gate can include a second rounded closed curve structure located above the channel and below the control gate. The control gate is capacitively coupled to the floating gate.
    Type: Application
    Filed: November 15, 2016
    Publication date: March 2, 2017
    Inventors: Reynaldo V. Villavelez, Paul I. Mikulan
  • Delaying or deterring counterfeiting and/or cloning of a component
    Patent number: 9536112
    Abstract: In an embodiment, to deter or delay counterfeiting/cloning of a replacement component of a host device, the replacement component is provided with a code value. The code value is generated from a value of at least one physical parameter of the replacement component and is stored on the replacement component. The host device determines whether the replacement component is authentic if the stored code value matches a reference code value.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: January 3, 2017
    Assignees: STMicroelectronics Asia Pacific Pte Ltd., STMicroelectronics
    Inventors: TeckKhim Neo, Paul I. Mikulan, Murray J. Robinson, Rube M. Ross
  • Memory cell having closed curve structure
    Patent number: 9524780
    Abstract: A memory cell including a drain, a channel, and a floating gate. The channel surrounds the drain and includes a first rounded closed curve structure around the drain. The floating gate is situated over the channel and includes a second rounded closed curve structure over the channel.
    Type: Grant
    Filed: March 15, 2011
    Date of Patent: December 20, 2016
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Reynaldo V Villavelez, Paul I. Mikulan
  • Methods of making inkjet print heads using a sacrificial substrate layer
    Patent number: 9340023
    Abstract: A method of making inkjet print heads may include forming a first wafer including a sacrificial substrate layer, and a first dielectric layer thereon having first openings therein defining inkjet orifices. The method may also include forming a second wafer having inkjet chambers defined thereon, and joining the first and second wafers together so that each inkjet orifice is aligned with a respective inkjet chamber. The method may further include removing the sacrificial substrate layer thereby defining the inkjet print heads.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: May 17, 2016
    Assignee: STMICROELECTRONICS, INC.
    Inventors: Paul I. Mikulan, Kenneth J. Stewart, Virgina L. Hwang
  • CIRCUIT THAT SELECTS EPROMS INDIVIDUALLY AND IN PARALLEL
    Publication number: 20140218436
    Abstract: An integrated circuit including a first EPROM, a second EPROM, and a circuit. The first EPROM is configured to provide a first state and a second state. The second EPROM is configured to provide a third state and a fourth state. The circuit is configured to select the first EPROM and the second EPROM individually and in parallel with each other.
    Type: Application
    Filed: September 27, 2011
    Publication date: August 7, 2014
    Inventors: Ning Ge, Paul I. Mikulan, Bee Ling Peh
  • MEMORY CELL HAVING CLOSED CURVE STRUCTURE
    Publication number: 20130329498
    Abstract: A memory cell including a drain, a channel, and a floating gate. The channel surrounds the drain and includes a first rounded closed curve structure around the drain. The floating gate is situated over the channel and includes a second rounded closed curve structure over the channel.
    Type: Application
    Filed: March 15, 2011
    Publication date: December 12, 2013
    Inventors: Reynaldo V. Villavelez, Paul I. Mikulan
  • Fluid ejection device comprising substrate contact via
    Patent number: 8476742
    Abstract: Edges of a first conductive layer (104) and a silicate glass layer (106) extend adjacent one another along a via (164) extending to a semiconductor substrate (41). An electrical conductor (112/114) extends through the via (164) into contact with the semiconductor substrate (41).
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: July 2, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Gregory N. Burton, Paul I. Mikulan
  • Power distribution in a thermal ink jet printhead
    Patent number: 8444255
    Abstract: A thermal inkjet printhead may include a substrate and a resistive layer. A thermal resistor may be formed in the resistive layer. A first metal layer may be between the substrate and a resistive layer having a thickness to form a power bus. A dielectric layer may be between the first metal layer and the resistive layer.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: May 21, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chris Bakker, Lawrence H. White, Bjorn Warloe, Reynaldo V. Villavelez, Paul I. Mikulan, Kenneth Stewart, Michael Allen Godwin, Teck-Khim Neo, Joseph M. Torgerson, Lonnie Byers
  • DELAYING OR DETERRING COUNTERFEITING AND/OR CLONING OF A COMPONENT
    Publication number: 20120317662
    Abstract: In an embodiment, to deter or delay counterfeiting/cloning of a replacement component of a host device, the replacement component is provided with a code value. The code value is generated from a value of at least one physical parameter of the replacement component and is stored on the replacement component. The host device determines whether the replacement component is authentic if the stored code value matches a reference code value.
    Type: Application
    Filed: June 13, 2012
    Publication date: December 13, 2012
    Applicants: STMICROELECTRONICS, INC., STMICROELECTRONICS ASIA PACIFIC PTE LTD. (Singapore)
    Inventors: TeckKhim NEO, Paul I. MIKULAN, Murray J. ROBINSON, Rube M. ROSS
  • THERMAL INK JET PRINTHEAD
    Publication number: 20120293587
    Abstract: A thermal inkjet printhead may include a substrate and a resistive layer. A thermal resistor may be formed in the resistive layer. A first metal layer may be between the substrate and a resistive layer having a thickness to form a power bus. A dielectric layer may be between the first metal layer and the resistive layer.
    Type: Application
    Filed: May 18, 2011
    Publication date: November 22, 2012
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chris Bakker, Lawrence H. White, Bjorn Warloe, Reynaldo V. Villavelez, Paul I. Mikulan, Kenneth Stewart, Michael Allen Godwin, Teck-Khim Neo, Joe Torgerson, Lonnie Byers
  • Semiconductor Substrate Contact VIA
    Publication number: 20100320608
    Abstract: Edges of a first conductive layer (104) and a silicate glass layer (106) extend adjacent one another along a via (164) extending to a semiconductor substrate (41). An electrical conductor (112/114) extends through the via (164) into contact with the semiconductor substrate (41).
    Type: Application
    Filed: February 28, 2008
    Publication date: December 23, 2010
    Inventors: Gregory N. Burton, Paul I. Mikulan
  • Devices and methods for integrated circuit manufacturing
    Patent number: 7488611
    Abstract: Integrated circuits and methods for producing them are provided. In particular, integrated circuits with shielding elements are provided.
    Type: Grant
    Filed: December 6, 2005
    Date of Patent: February 10, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Simon Dodd, Frank Randolph Bryant, Paul I. Mikulan
  • Fluid ejection device including integrated circuit with shielding element
    Patent number: 7004558
    Abstract: Integrated circuits and methods for producing them are provided. In particular, integrated circuits with shielding elements are provided.
    Type: Grant
    Filed: October 25, 2002
    Date of Patent: February 28, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Simon Dodd, Frank Randolph Bryant, Paul I. Mikulan
  • Devices and methods for integrated circuit manufacturing
    Patent number: 6740536
    Abstract: Integrated circuits and methods for producing them are provided. In particular, integrated circuits with shielding elements are provided.
    Type: Grant
    Filed: October 26, 2001
    Date of Patent: May 25, 2004
    Assignee: Hewlett-Packard Develpment Corporation, L.P.
    Inventors: Simon Dodd, Frank Randolph Bryant, Paul I. Mikulan
  • Devices and methods for integrated circuit manufacturing
    Publication number: 20030207477
    Abstract: Integrated circuits and methods for producing them are provided. In particular, integrated circuits with shielding elements are provided.
    Type: Application
    Filed: October 25, 2002
    Publication date: November 6, 2003
    Inventors: Simon Dodd, Frank Randolph Bryant, Paul I. Mikulan
  • Devices and methods for integrated circuit manufacturing
    Publication number: 20030080362
    Abstract: Integrated circuits and methods for producing them are provided. In particular, integrated circuits with shielding elements are provided.
    Type: Application
    Filed: October 26, 2001
    Publication date: May 1, 2003
    Inventors: Simon Dodd, Frank Randolph Bryant, Paul I. Mikulan