Abstract: An electronic device may have pixels that form an active area for a flexible display layer. An inactive area that is free of pixels may surround the active area. One or more edges of the flexible display layer may be bent around respective bend axes. The display layer may also have one or more unbent edges in which the inactive area and active area of the display have a planar shape. An image transport layer may have an input surface that receives the image and an output surface to which the image is transported. The image transport layer may be formed from a coherent fiber bundle or a layer of Anderson localization material. The coherent fiber bundle may have straight fibers that run parallel to each other in a vertical direction that is parallel to a surface normal of a central portion of the display layer.

Abstract: An electronic device may have a display with pixels configured to display an image. The pixels may be overlapped by a cover layer. The display may have peripheral edges with curved cross-sectional profiles. An inactive area in the display may be formed along a peripheral edge of the display or may be surrounded by the pixels. Electrical components such as optical components may be located in the inactive area. An image transport layer may be formed from a coherent fiber bundle or Anderson localization material. The image transport layer may overlap the pixels, may have an opening that overlaps portions of the inactive area, may have an output surface that overlap portions of the inactive area, and/or may convey light associated with optical components in the electronic device.

Abstract: Table top sanitizer dispenser bottle bases are disclosed herein. An exemplary table top sanitizer dispenser bottle base includes a movable upper housing, the upper moveable housing has a floor with an aperture located therein and a peripheral wall. The top sanitizer dispenser bottle includes a lower stationary housing. The upper movable housing is connected to the lower stationary housing and is configured to move linearly upward and downward with respect to lower stationary. One or more biasing members bias the upper movable housing upward. A switch is included and the upper movable housing has an engagement member or surface for actuating the switch upon downward movement of the upper movable housing. At least one of a visual indicator and an audible indicator are also included. Control circuitry is provided for activating the one or more of a visual indicator and audible indicator when the engagement member actuates the switch.

Abstract: Table top sanitizer dispenser bottle bases are disclosed herein. An exemplary table top sanitizer dispenser bottle base includes a movable upper housing, the upper moveable housing has a floor with an aperture located therein and a peripheral wall. The top sanitizer dispenser bottle includes a lower stationary housing. The upper movable housing is connected to the lower stationary housing and is configured to move linearly upward and downward with respect to lower stationary. One or more biasing members bias the upper movable housing upward. A switch is included and the upper movable housing has an engagement member or surface for actuating the switch upon downward movement of the upper movable housing. At least one of a visual indicator and an audible indicator are also included. Control circuitry is provided for activating the one or more of a visual indicator and audible indicator when the engagement member actuates the switch.

Abstract: Various exemplary embodiments relate to a printed circuit board (PCB) for electrically connecting a discrete array component including a pattern formed on the PCB which is a merger of a set of via pads and a discrete array component; wherein the pattern is generated by a pin mapping between the discrete array component and a via grid array on the PCB; and wherein the pattern is formed of a metal etched during a manufacturing process of the PCB.

Abstract: A printed circuit board (PCB) having a layout aligned with a Ball Grid Array (BGA) package, the PCB including a plurality of victim vias arranged in the PCB, at least one aggressor via arranged in the PCB having a transition with at least one victim via, wherein the transition is a space in the PCB between a victim via and an aggressor via along a row direction or a column direction, and the victim via is not positioned next to more than one transition.

Abstract: Disclosed is a socket apparatus for ball grid array (BGA) balls, including a base member of electrically insulative material, a plurality of electrical contact members disposed in row and column configuration attached to the electrically insulative material, a plate member extending in a row direction, and a plurality of extension members connected to the plate member and configured to press BGA balls of a mounted BGA into the plurality of electrical contact members when the plate member is pulled in a first direction.

Abstract: A printed circuit board (PCB) having a layout aligned with a Ball Grid Array (BGA) package, the PCB including a plurality of victim vias arranged in the PCB, at least one aggressor via arranged in the PCB having a transition with at least one victim via, wherein the transition is a space in the PCB between a victim via and an aggressor via along a row direction or a column direction, and the victim via is not positioned next to more than one transition.

Abstract: Various exemplary embodiments relate to a printed circuit board (PCB) for electrically connecting a discrete array component including a pattern formed on the PCB which is a merger of a set of via pads and a discrete array component; wherein the pattern is generated by a pin mapping between the discrete array component and a via grid array on the PCB; and wherein the pattern is formed of a metal etched during a manufacturing process of the PCB.

Abstract: A method of laying out electrical connections on a printed circuit board (PCB) including: establishing primary design axes X and Y of the PCB respectively parallel to the weave of the fiberglass fibers in the PCB; selecting a non-zero routing angle ?; defining routing axes X? and Y? that are rotated by +? from axes X and Y; defining routing axes X? and Y? that are rotated by ?? from axes X and Y; determining a shortest route between a first point and a second point to be electrically connected, wherein the route traverses a path constrained to extend along the X?, Y?, X? and Y? axes.

Abstract: An anti-tangling coupling device has an inner portion which is rotatably engaged with an outer portion. Fluid containment devices such as hoses can be coupled at either end of the device. One hose is secured to the inner portion while a second hose is secured to the outer portion, with the hoses being positioned at opposite ends of each other. Fluid communication is maintained throughout the inner portion and the outer portion, allowing water to flow between hoses coupled with the device. The rotational engagement is achieved by a bearing assembly, the bearing assembly including an inner race, and outer race, and ball bearings secured in cages. The ball bearings are capable of rotational movement (imparted from contact with the first race and second race), but are prevented from translational movement by a cage. As a result the likelihood of tangling between coupled hoses is greatly reduced.

Abstract: Disclosed is a socket apparatus for ball grid array (BGA) balls, including a base member of electrically insulative material, a plurality of electrical contact members disposed in row and column configuration attached to the electrically insulative material, a plate member extending in a row direction, and a plurality of extension members connected to the plate member and configured to press BGA balls of a mounted BGA into the plurality of electrical contact members when the plate member is pulled in a first direction.

Abstract: An apparatus configured to temporarily support a Ball Grid Array (BGA) component against a printed circuit board (PCB) during a manufacturing reflow operation, the apparatus including a support plate sized to fit over the BGA and having one or more mounting holes external to the periphery of the Ball Grid Array component, a retaining member for each mounting hole, passing through said mounting hole, a resilient biasing member for each retaining member, wherein the resilient biasing member urges the support plate against the BGA component from below the BGA component such that the BGA component is urged against the PCB.

Abstract: An underlying recess is provided for component placement beneath Ball Grid Arrays allowing closer proximity for decoupling capacitors and other components. The underlying recess placement of components assists in minimizing reliability issues concerning surface mount components and provides closer proximity placement of components. The underlying recess placement of components is particularly useful for overcoming the problem of parasitic inductance of more distant component placements known in the art.

Abstract: Various exemplary embodiments relate to a printed circuit board (PCB) for electrically connecting a discrete array component including a pattern formed on the PCB which is a merger of a set of via pads and a discrete array component; wherein the pattern is generated by a pin mapping between the discrete array component and a via grid array on the PCB; and wherein the pattern is formed of a metal etched during a manufacturing process of the PCB.

Abstract: Disclosed is a socket apparatus for gripping the balls of a ball grid array (BGA), including a base member of electrically insulative material, an array of pairs of electrical contacts disposed in the base member in a configuration corresponding to a terminal ball configuration of said BGA to be mated with the socket apparatus, a first plate member disposed for slidable movement on said base member and having a plurality of parallel extension members extending therefrom and configured to pass through the array of pairs of electrical contacts, a second plate member disposed for slidable movement on said base member and having a plurality of parallel extension members extending therefrom and configured to pass through the array of pairs of electrical contacts, the plurality of parallel extension members of said first plate member disposed between the plurality of parallel extension members of said second plate member, a plurality of insulative nodules disposed on each extension member with nodules forming an ar

Abstract: Various exemplary embodiments relate to a printed circuit board (PCB) for electrically connecting a surface mount component including: a plurality of metal pads on the surface of one side of the PCB corresponding to connection points on the component, wherein at least a portion of the plurality of metal pads have stubs which extend outside the boundary of the surface mount component when the surface mount component is mounted to the PCB; and wherein the stubs have sufficient thermal conductivity to facilitate at least one of the set of dismounting and reattaching of the surface mount component.

Abstract: A relieved component pad for 0201 component use between vias on a tight-pitch Ball Grid Array is disclosed herein. The relieved component pad for 0201 component use between vias provides substantially rectangular component pads having a relieved section at a point of closest approach to a via pad. The relieved component pad for 0201 component use is particularly useful for overcoming the problem of 0201 component placement on tight-pitch arrays known in the art.

Abstract: A relieved component pad for 0201 component use between vias on a tight-pitch Ball Grid Array is disclosed herein. The relieved component pad for 0201 component use between vias provides substantially rectangular component pads having a relieved section at a point of closest approach to a via pad.

Abstract: A printed circuit board design for 0204 reverse geometry capacitor use between vias on a tight-pitch Ball Grid Array is disclosed. The printed circuit board design for 0204 reverse geometry capacitor use between vias on a tight-pitch Ball Grid Array provides component landing pads sized to accommodate an 0204 surface mount component within a 1.2 mm by 1.0 mm rectangular spacing. The printed circuit board design for 0204 reverse geometry capacitor use between vias on a tight-pitch Ball Grid Array is particularly useful for overcoming the problem of component placement on tight-pitch arrays known in the art.