Patents by Inventor Paul J. Ciccolo

Paul J. Ciccolo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of removing negative acting photoresists
    Patent number: 8975008
    Abstract: Polymerized negative acting photoresists are removed from substrates at relatively low temperatures and fast stripping times using aqueous based alkaline solutions.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: March 10, 2015
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Paul J. Ciccolo, Brian D. Amos, Stephen McCammon
  • METHOD OF REMOVING NEGATIVE ACTING PHOTORESISTS
    Publication number: 20140154631
    Abstract: Polymerized negative acting photoresists are removed from substrates at relatively low temperatures and fast stripping times using aqueous based alkaline solutions.
    Type: Application
    Filed: May 21, 2013
    Publication date: June 5, 2014
    Inventors: Paul J. CICCOLO, Brian D. AMOS, Stephen McCAMMON
  • Conditioning process for electroless plating of polyetherimides
    Patent number: 5441770
    Abstract: A process for promoting the adhesion of metal to thermoplastic substrates such as polyetherimides. The improvement comprises conditioning the substrate by treating with an inorganic hydroxide solution prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of flexural strength of the substrate throughout subsequent processing steps.
    Type: Grant
    Filed: August 14, 1991
    Date of Patent: August 15, 1995
    Assignee: Shipley Company Inc.
    Inventors: James E. Rychwalski, Paul J. Ciccolo, Robert B. Currie, Philip D. Knudsen
  • Pretreatment process for electroless plating of polyimides
    Patent number: 5178956
    Abstract: A process for promoting the adhesion of metal to thermoplastic substrates such as polyimides. The improvement comprises conditioning the substrate by treating with a lactone and aqueous rinse prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of the cohesive integrity of the substrate throughout subsequent processing steps.
    Type: Grant
    Filed: October 3, 1989
    Date of Patent: January 12, 1993
    Assignee: Shipley Company Inc.
    Inventors: James Rychwalski, Paul J. Ciccolo, Edward C. Couble