Patents by Inventor Paul J. Coppa

Paul J. Coppa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11935756
    Abstract: A method for patterning a layer increases the density of features formed over an initial patterning layer using a series of self-aligned spacers. A layer to be etched is provided, then an initial sacrificial patterning layer, for example formed using optical lithography, is formed over the layer to be etched. Depending on the embodiment, the patterning layer may be trimmed, then a series of spacer layers formed and etched. The number of spacer layers and their target dimensions depends on the desired increase in feature density. An in-process semiconductor device and electronic system is also described.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: March 19, 2024
    Inventors: Baosuo Zhou, Mirzafer K. Abatchev, Ardavan Niroomand, Paul A. Morgan, Shuang Meng, Joseph Neil Greeley, Brian J. Coppa
  • Publication number: 20040078909
    Abstract: A disinfecting mat that enables better cleaning of shoes of a person through multi-functional capabilities. The mat has three discrete sections, with each section carrying out a different function in cleaning the shoes. A first section has a laterally extending bristle brush for cleaning material from the shoes while the second section includes a reservoir containing a liquid disinfectant that is transferred to the shoe of the user by an endless belt that dips into the reservoir and carries the disinfectant to the upper surface of the belt to be transferred to the shoes. Finally, in a third section there is a stationary wiping mat to enable the user to brush the shoes across the mat to rid the shoe of remaining material as well as dry the shoe from the liquid disinfectant. All of the sections are convenient to the user and housed within a unitary molded base.
    Type: Application
    Filed: October 29, 2002
    Publication date: April 29, 2004
    Inventor: Paul J. Coppa