Patents by Inventor Paul J. Gibney

Paul J. Gibney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Uses of uniaxially electrically conductive articles
    Patent number: 5637925
    Abstract: The present concepts include "1:1" uniax (40) with one conductive through-hole per chip connection site, "mirror chip" testing, heat-sink bonding to chips, avoiding contact with conductive cleaved edge of chip, indium solid columns, metal recessed (41) in the through-holes. All of these are subject to preferred materials (UPILEX polyimide) and techniques (U.V. laser ablation, minimum taper of holes).
    Type: Grant
    Filed: January 21, 1993
    Date of Patent: June 10, 1997
    Inventors: Michael J. Ludden, Nicholas J. G. Smith, Paul J. Gibney, Peter Nyholm
  • Uses of uniaxially electrically conductive articles
    Patent number: 5631447
    Abstract: Polymer (preferably polyimide) sheets (10) with laser ablated through-holes plated with metal (20) are used for making electrical conections to specified microcircuits, especially unbumped microchips and Tape Automated Bonding (TAB) articles. Bonding with different melting point materials at opposite ends of the plated holes is disclosed. Preferred polyimides are those derived from polymerisation of 4,4'-biphenyldianhydride and (4,4'-diaminobiphenyl, or 4,4'-diaminobiphenylether, or phylenediamine, preferably p-phenylenediamine).
    Type: Grant
    Filed: January 3, 1995
    Date of Patent: May 20, 1997
    Assignee: Raychem Limited
    Inventors: Nicholas J. G. Smith, Michael J. Ludden, Peter Nyholm, Paul J. Gibney