Abstract: In accordance with some embodiments, a processor-based device may be implemented with an emissive projection display that is removable from the device. The screen only may be removable in some embodiments and, in other embodiments, the screen, together with the emissive projection display, may be removable from the processor-based device.

Abstract: Methods and systems to provide location and navigation information to a user within a building. In an embodiment, low power radars may be used to locate and track a user. Moreover, the systems and methods described herein may take advantage of the known layout of a building, or may ascertain the layout using the radar devices. This information may be used to direct a user from a current location to a desired destination. In some contexts, such as stores, radio frequency ID (RFID) tags may be used to identify a particular destination, such as a particular product in a particular aisle in a store. Multiple persons may be tracked as they move about the building, so that the more frequently used paths may be identified for moving from point to point. These identified paths may then be used in constructing a path for a user who needs directions.

Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer, laptop, or tablet that includes a circuit board coupled to a plurality of electronic components (which may include any type of components, elements, circuitry, etc.). One particular example implementation of an information-processing device includes a logic component mounted on a circuit board. The information-processing device also includes a plastic layer surrounding the logic component. Further, the information-processing device includes a first metal layer surrounding the logic component. The plastic layer is integrated with the first metal layer.

Abstract: Systems and methods may provide virtual and configurable touchscreens. The systems and methods may include a plurality of micro impulse radar (MIR) transceivers and logic to determine a location of an input object such as a finger or pointer based on signals from the plurality of MIR transceivers. The MIR transceivers may also create a virtual touchscreen in a plane coincident (adjacent) to or spaced apart from (offset) with respect to a display screen. The MIR transceivers may also map the location of the input object to a position on the display screen. In one example, the system uses triangulation to determine the location of the input object in a virtual plane that creates the virtual touchscreen.

Abstract: Methods and systems may provide for detecting a location of an adjacent ultrasonic receiver of a battery powered device relative to a charging surface of a contactless charger. The charging surface may include an ultrasonic array of transmitter sub arrays, wherein one or more of the transmitter sub arrays may be selectively activated based on the location to focus an ultrasonic beam on the adjacent ultrasonic receiver. In one example, a movement of the adjacent ultrasonic receiver may be detected and the focus of the ultrasonic beam is adjusted in response to the movement.

Abstract: A leveling system includes a chassis and a first foot protruding from the chassis. The leveling system also includes a plurality of pressure sensors to measure pressure at a first location at the first foot and a second location separated from the first foot. In addition, the leveling system includes a processor that retracts or extends the first foot using an electroactive polymer (EAP) actuator to balance pressures at the first location and the second location.

Abstract: In one embodiment a chassis for an electronic device comprises a first section and a second section, the second section coupled to the first section by a hinge, a first resistance element to provide a first rotational resistance in a first angular range from a resting position, and a second resistance element to provide a second rotational resistance, greater than the first rotational resistance, in a second angular range, wherein the first resistance element operates independently of the second resistance element. Other embodiments may be described.

Abstract: An apparatus and computing device are described herein. The apparatus includes a chassis cover of a computing device. The apparatus also includes a foam core. Furthermore, the foam core is in contact with a surface of the chassis cover of the computing device.

Abstract: In some embodiments, a cooling device may be mounted to a portion of a chassis of an electronic system, wherein the cooling device may be releasably and pivotably attached to the chassis in at least an open position to permit access to components within the electronic system and a closed position to permit installation of a cover on the chassis. Other embodiments are disclosed and claimed.

Abstract: According to some embodiments, an outer metal is cladded to a core metal to create a cladded heat sink fin, the cladded heat sink fin is inserted in a groove of a heat sink base, and the outer metal is heated to a reflow temperature of the outer metal. Embodiments may alternatively include a heat sink base, an upper metal cladded to an upper surface of the heat sink base, the upper metal defining at least one groove, and a heat sink fin disposed in the groove and secured to the upper metal. Further to the foregoing, embodiments may include a lower metal cladded to a lower surface of the heat sink base, and a pedestal secured to the lower cladding.

Abstract: In some embodiments, a cooling device may be mounted to a portion of a chassis of an electronic system, wherein the cooling device may be releasably and pivotably attached to the chassis in at least an open position to permit access to components within the electronic system and a closed position to permit installation of a cover on the chassis. Other embodiments are disclosed and claimed.

Abstract: In some embodiments, a cooling device may be mounted to a portion of a chassis of an electronic system, wherein the cooling device may be releasably and pivotably attached to the chassis in at least an open position to permit access to components within the electronic system and a closed position to permit installation of a cover on the chassis. Other embodiments are disclosed and claimed.

Abstract: In some embodiments, a cooling device may be mounted to a portion of a chassis of an electronic system, wherein the cooling device may be releasably and pivotably attached to the chassis in at least an open position to permit access to components within the electronic system and a closed position to permit installation of a cover on the chassis. Other embodiments are disclosed and claimed.

Abstract: An apparatus may include a thermally-conductive heat sink core having at least one surface, a solid-state heat pump including a first surface and a second surface, the first surface in contact with the at least one surface of the core, and a thermally-conductive unit in contact with the second surface of the solid-state heat pump. Also included may be a stop in contact with the thermally-conductive unit, disposed at least partially over the first end of a cavity defined by the thermally-conductive unit, and defining an opening, and a fastener passing through the cavity, in contact with the core, and to bias the core toward the stop.

Abstract: A small water-cooling type electronic component cooling apparatus is provided. The electronic component cooling apparatus comprises a so-called water-cooling heat sink 3, a radiator 7 cooled by an electric fan 5, first and second coolant paths 9, 11 for circulating a coolant between the heat sink 3 and the radiator 7, and an electric pump 13 to supply a moving energy to the coolant. The electric pump 13 is arranged at a position facing the heat-radiating portion of the radiator 7.

Abstract: According to some embodiments, an outer metal is cladded to a core metal to create a cladded heat sink fin, the cladded heat sink fin is inserted in a groove of a heat sink base, and the outer metal is heated to a reflow temperature of the outer metal. Embodiments may alternatively include a heat sink base, an upper metal cladded to an upper surface of the heat sink base, the upper metal defining at least one groove, and a heat sink fin disposed in the groove and secured to the upper metal. Further to the foregoing, embodiments may include a lower metal cladded to a lower surface of the heat sink base, and a pedestal secured to the lower cladding.

Abstract: In some embodiments, a cooling device may be mounted to a portion of a chassis of an electronic system, wherein the cooling device may be releasably and pivotably attached to the chassis in at least an open position to permit access to components within the electronic system and a closed position to permit installation of a cover on the chassis. Other embodiments are disclosed and claimed.

Abstract: Some aspects include a heat sink base, an upper metal cladded to an upper surface of the heat sink base, the upper metal defining at least one groove, and a heat sink fin disposed in the groove and secured to the upper metal. Some aspects may also include a lower metal cladded to a lower surface of the heat sink base, and a pedestal secured to the lower cladding.

Abstract: In some embodiments, a cooling device may be mounted to a portion of a chassis of an electronic system, wherein the cooling device may be releasably and pivotably attached to the chassis in at least an open position to permit access to components within the electronic system and a closed position to permit installation of a cover on the chassis. Other embodiments are disclosed and claimed.

Abstract: A device to efficiently boil and distribute liquid vapor by using a high efficiency heat exchanger technology that incorporates the high heat spreading capability of two-phase heat transfer physics. The evaporation/boiling permits the heat load from a discrete component to be efficiently spread via vapor transport to the entire HEX fin array. In doing so, both the spreading resistance and air-side convective resistance may be made superior to air-cooled technologies alone and rival liquid cooling performance, but without moving parts or need of a mechanical pump. One embodiment is the combination of highly effective vapor distribution and liquid condensate return channels, a high surface area air-side heat exchanger that serves as the vapor condenser, and an efficient evaporation chamber to form a complete thermal solution.