Abstract: Circuits, methods, and apparatus that may provide audio jacks capable of providing a sufficient retention force to avoid some inadvertent extractions of an audio plug. Examples may also provide audio jacks that may be readily assembled. Other examples may provide other types of connectors. These audio jacks or other connectors may provide contact structures having one or more contacts, each having a contact support to increase contact retention force. Different materials may be used to form the contacts and the contact supports. In this way, contacts may be formed using a highly conductive material, while the contact supports may be formed of a material having good spring characteristics. While such a contact may not be able to provide an adequate retention force on its own, the use of a contact support may sufficiently increase the retention force to prevent accidental extractions of an audio plug or other connector.

Abstract: Sockets that provide easy access for users to change cards while allowing the use of thinner device enclosures. One example provides a socket having two positions. When the socket is in an open state, the card may be oriented in a direction substantially away from the main logic board. When the socket is in a closed state, the card moves such that it is oriented at least closer to being in parallel to the main logic board.

Abstract: Circuits, methods, and apparatus that may provide audio jacks capable of providing a sufficient retention force to avoid some inadvertent extractions of an audio plug. Examples may also provide audio jacks that may be readily assembled. Other examples may provide other types of connectors. These audio jacks or other connectors may provide contact structures having one or more contacts, each having a contact support to increase contact retention force. Different materials may be used to form the contacts and the contact supports. In this way, contacts may be formed using a highly conductive material, while the contact supports may be formed of a material having good spring characteristics. While such a contact may not be able to provide an adequate retention force on its own, the use of a contact support may sufficiently increase the retention force to prevent accidental extractions of an audio plug or other connector.

Abstract: Circuits, methods, and apparatus that may provide audio jacks capable of providing a sufficient retention force to avoid some inadvertent extractions of an audio plug. Examples may also provide audio jacks that may be readily assembled. Other examples may provide other types of connectors. These audio jacks or other connectors may provide contact structures having one or more contacts, each having a contact support to increase contact retention force. Different materials may be used to form the contacts and the contact supports. In this way, contacts may be formed using a highly conductive material, while the contact supports may be formed of a material having good spring characteristics. While such a contact may not be able to provide an adequate retention force on its own, the use of a contact support may sufficiently increase the retention force to prevent accidental extractions of an audio plug or other connector.

Abstract: Sockets that provide easy access for users to change cards while allowing the use of thinner device enclosures. One example provides a socket having two positions. When the socket is in an open state, the card may be oriented in a direction substantially away from the main logic board. When the socket is in a closed state, the card moves such that it is oriented at least closer to being in parallel to the main logic board.

Abstract: Circuit edits may be performed through the back side of an integrated circuit die. In one embodiment, a circuit edit is achieved by exposing first and second circuit edit connection targets through a semiconductor substrate of the integrated circuit die from the back side. An insulating layer is not deposited over the first and second circuit edit connection targets and the exposed semiconductor substrate. Next, a conductor is deposited over the circuit edit connection targets from the back side of the integrated circuit to couple together the circuit edit connection targets.

Abstract: A method for use in removing a portion of a semiconductor chip. The method comprises etching a backside of the semiconductor chip, the frontside including a first well with a first type of doping and a second well with a second type of doping; monitoring a backside of the semiconductor chip during etching; and determining when a first portion of the backside over one of the first and second wells differs from a second portion of the backside over the other of the first and second wells. A method for etch endpoint detection includes etching a backside of a semiconductor chip, the semiconductor chip having at least one doped well formed proximate a frontside of the semiconductor chip; monitoring the backside of the semiconductor chip during etching until at least one doped well becomes visible; and stopping etching after the doped well becoming visible.

Abstract: Circuit edits may be performed through the back side of an integrated circuit die. In one embodiment, a circuit edit is achieved by exposing first and second circuit edit connection targets through a semiconductor substrate of the integrated circuit die from the back side. An insulating layer is not deposited over the first and second circuit edit connection targets and the exposed semiconductor substrate. Next, a conductor is deposited over the circuit edit connection targets from the back side of the integrated circuit to couple together the circuit edit connection targets.

Abstract: semiconductor chip. The method comprises etching a backside of the semiconductor chip, the frontside including a first well with a first type of doping and a second well with a second type of doping; monitoring a backside of the semiconductor chip during etching; and determining when a first portion of the backside over one of the first and second wells differs from a second portion of the backside over the other of the first and second wells. A method for etch endpoint detection includes etching a backside of a semiconductor chip, the semiconductor chip having at least one doped well formed proximate a frontside of the semiconductor chip; monitoring the backside of the semiconductor chip during etching until at least one doped well becomes visible; and stopping etching after the doped well becoming visible.

Abstract: An enclosure for a magnetic recording system comprises a baseplate, and a cover secured to the baseplate to form a housing. A rectangular groove is provided around the periphery of the baseplate and cover. Disposed within the cover and baseplate grooves is a gasket for sealing the cover/baseplate interface. The gasket is cross-shaped and comprises a relatively soft urethane material. The gasket is molded to fit the geometric shape of the cover and baseplate and forms a three-point seal for sealing the internal components of the disk drive from the ambient environment when the cover is secured to the baseplate.

Abstract: A sleeveless rotatable beryllium/aluminum alloy actuator arm for a disk drive for a computer. A rotatable actuator for a magnetic disk drive for a computer is also described. The rotatable actuator includes a sleeveless beryllium/aluminum alloy arm, a suspension attached to a first end of the arm, a transducer attached to the suspension, and a voice coil attached to a second end of the arm.