Abstract: A junction device for flat flexible cables (FFCs) includes a device housing, a power contact, a signal contact assembly, and a data contact assembly. The power contact defines an input power FFC connection, an output power FFC connection, and a breakout power FFC connection, with the input, output and breakout FFC connections being electrically interconnected. The signal contact assembly defines an input signal FFC connection, an output signal FFC connection, and a breakout signal FFC connection. The signal contact assembly is adapted to output a signal to the breakout signal FFC connection indicative of a signal received at the input signal FFC connection. The data contact assembly includes an input data FFC connection, an output data FFC connection, and a breakout data FFC connection. The data contact assembly is adapted to output a data signal received at the input FFC connection from the output FFC connection and the breakout FFC connection.

Abstract: A light emitting display comprising a first electrode layer on a substrate. The electrode layer is patterned to form a plurality of laterally spaced apart strips in a first direction. A plurality of spacedly disposed light emitting organic elements with a second electrode layer atop are disposed on the first electrode layer in a second direction. An undercut structure made of an undercut pattern transfer layer and an overlaying pattern transfer layer. The undercut structure is disposed between the plurality of spacedly disposed light emitting organic elements. A light emitting display having a color isolation well. The color isolation well is characterized by a first well layer and a second well layer in which the first well layer matches a property of an emissive polymer or small molecule dye held by the well whereas the second well layer does not match the property.

Abstract: The present invention involves a low-temperature, photoresist-free method of fabricating a barrier layer on a flexible substrate. An embodiment involves the conversion of a precursor into a top-surface imaging layer during a direct patterning step. Preferred precursors are formed from a metal complex comprising at least one ligand selected from the group consisting of acac, carboxylato, alkoxy, azide, carbonyl, nitrato, amine, halide, nitro, and mixtures thereof and at least one metal selected from the group consisting of Li, Al, Si, Ti, V, Cr, Mn, Fe, Ni, Co, Cu, Zn, Sr, Y, Zr, Nb, Mo, Ru, Rh, Pd, Ag, In, Sn, Ba, La, Pr, Sm, Eu, Hf, Ta, W, Re, Os, Ir, Pt, Au, Pb, Th, U, Sb, As, Ce, Mg, and mixtures thereof.

Abstract: The present invention involves the formation of titanium carbonate films that exhibit improved hydrolytic stability and photosensitivity. Such films can be used in semiconductor processing to deposit titanium and titanium oxide layers on a substrate and to form patterns without the use of photoresists. Preferred titanium carboxylates are non-branched and branched carboxylates wherein the alkoxide component is an alcohol, branched titanium carboxylates wherein the alkoxide component is a diol, non-branched and branched titanium alpha hydroxy carboxylate compounds, and titanium dicarboxylate compounds.

Abstract: The present invention involves the hydrothermal treatment of nanostructured films to form high k PMOD™ films for use in applications that are temperature sensitive, such as applications using a polymer based substrate. After a PMOD™ precursor is deposited and converted on a substrate, and possibly after other process steps, the amorphous, nanoporous directly patterned film is subjected to low temperature hydrothermal treatment to densify and possibly crystallize the resulting high dielectric PMOD™ film. A post hydrothermal treatment bake is then performed to remove adsorped water.

Abstract: This invention comprises methods for making nanostructured and nanoporous thin film structures of various compositions. These films can be directly patterned. In these methods, precursor films are deposited on a surface and different components of the precursor film are reacted under selected conditions, forming a nanostructured or nanoporous film. Such films can be used in a variety of applications, for example, low k dielectrics, sensors, catalysts, conductors or magnetic films. Nanostructured films can be created: (1) using one precursor component and two reactions, (2) using two or more components based on differential rates of photochemical conversion, (3) using two precursors based on the thermal sensitivity of one precursor and the photochemical sensitivity of the other, and (4) by photochemical reaction of a precursor film and selected removal of a largely unreacted component from the film.

Abstract: The present invention involves fabrication of a hard mask. An embodiment involves the conversion of a precursor into a top-surface imaging layer during a direct patterning step. Another embodiment of the present invention is a method of forming an etched pattern in a substrate. A further embodiment of the present invention is a method of forming an implanted region in a substrate. Preferred precursors are formed from a metal complex comprising at least one ligand selected from the group consisting of acac, carboxylato, alkoxy, azide, carbonyl, nitrato, amine, halide, nitro, and mixtures thereof and at least one metal selected from the group consisting of Li, Al, Si, Ti, V, Cr, Mn, Fe, Ni, Co, Cu, Zn, Sr, Y, Zr, Nb, Mo, Ru, Rh, Pd, Ag, In, Sn, Ba, La, Pr, Sm, Eu, Hf, Ta, W, Re, Os, Ir, Pt, Au, Pb, Th, U, Sb, As, Ce, Mg, and mixtures thereof.

Abstract: N-nitrosohydroxylamine compounds exhibiting minimal or no degradation are disclosed. The N-nitrosohydroxylamines can be stabilized in the presence of a compound capable of removing water from the environment.