Abstract: A dry solids composition is provided which may be reconstituted into a chemical-mechanical polishing composition comprising no abrasive particles.

Abstract: A method of making a slurry, by mixing a quantity of water with dissolvable constituents of an aqueous slurry used for polishing, with the dissolvable constituents being apportioned according to their desired per cent concentrations thereof in the aqueous slurry, and drying the mixture to obtain a reconstitutable slurry having solids of the dissolvable constituents.

Abstract: A method of making a slurry, by mixing a quantity of water with dissolvable constituents of an aqueous slurry used for polishing, with the dissolvable constituents being apportioned according to their desired percent concentrations thereof in the aqueous slurry, and drying the mixture to obtain a reconstitutable slurry having solids of the dissolvable constituents.

Abstract: A polishing method uses a dry particulate solids composition that is reconstituted into an aqueous composition for delivery to a polishing apparatus. In one aspect of the invention, the dry particulate solids composition is provided in a package size that is just substantially sufficient to make a reconstituted slurry for completing the polishing of a predetermined number of work pieces. The quantity of dry particulate solids delivered to a reconstitution apparatus can be an amount appropriate for polishing one work piece or a small number of work pieces, or the system can operate in larger batches or a continuous flow mode. The reconstituted aqueous polishing solution can be monitored for physical or chemical properties, filtered, blended with other chemical mixtures, or modified in other ways prior to being used in the polishing apparatus.

Abstract: Manufacture of a polishing pad for polishing a semiconductor substrate, involves, transporting a backing layer to successive manufacturing stations, supplying a fluid phase polymer composition onto the transported backing layer, shaping the fluid phase polymer composition into a surface layer having a measured thickness, and curing the polymer composition on the transported backing layer in a curing oven to convert the liquid phase polymer composition to a solid phase polishing layer attached to the transported backing layer.

Abstract: A dry particulate solids composition is provided which may be reconstituted into a chemical-mechanical polishing slurry.

Abstract: Manufacture of a polishing pad for polishing a semiconductor substrate, involves, transporting a backing layer to successive manufacturing stations, supplying a fluid phase polymer composition onto the transported backing layer, shaping the fluid phase polymer composition into a surface layer having a measured thickness, and curing the polymer composition on the transported backing layer in a curing oven to convert the liquid phase polymer composition to a solid phase polishing layer attached to the transported backing layer.

Abstract: The present invention provides a chemical mechanical polishing slurry for the planarization of shallow trench isolation structures and other integrated circuit structures. The chemical mechanical polishing slurry of this invention comprises small abrasive particles having a mean diameter of between about 2 and 30 nm and large abrasive particles having a mean diameter of between 2 and 10 times larger than the mean diameter of the small abrasive particles. In use, the chemical mechanical polishing slurry of this invention can also include viscosity additives and etchants.

Abstract: A dry solids composition is provided which may be reconstituted into a chemical-mechanical polishing composition comprising no abrasive particles.

Abstract: A dry particulate solids composition is provided which may be reconstituted into a chemical-mechanical polishing slurry.

Abstract: A polishing method uses a dry particulate solids composition that is reconstituted into an aqueous composition for delivery to a polishing apparatus. In one aspect of the invention, the dry particulate solids composition is provided in a package size that is just substantially sufficient to make a reconstituted slurry for completing the polishing of a predetermined number of work pieces. The quantity of dry particulate solids delivered to a reconstitution apparatus can be an amount appropriate for polishing one work piece or a small number of work pieces, or the system can operate in larger batches or a continuous flow mode. The reconstituted aqueous polishing solution can be monitored for physical or chemical properties, filtered, blended with other chemical mixtures, or modified in other ways prior to being used in the polishing apparatus.

Abstract: A method for reconstituting a chemical-mechanical polishing slurry which has been dewatered to form a dry particulate solids composition is provided.

Abstract: A dry particulate solids composition is provided which may be reconstituted into a chemical-mechanical polishing slurry.

Abstract: The present invention provides a chemical mechanical polishing method for the planarization of shallow trench isolation structure and other integrated circuit structures. The method of the invention comprises the steps of providing a substrate having a plurality of patterned regions and polishing the substrate with a chemical mechanical polishing slurry comprising small abrasive particles having a mean diameter of between about 2 and 30 nm and large abrasive particles having a mean diameter of between 2 and 10 times larger than the mean diameter of the small abrasive particles. The chemical mechanical polishing slurries can also include viscosity additives and etchants for use in the invention.

Abstract: Improvement in apparatus for growing crystalline materials by seed pulling from a melt whereby crystalline product produced is substantially free of voids and/or inclusions which were previously caused by the continuous feeding operation. Source material is fed through a bed of particulate refractory material whereby entrained gases in the melting feed material are eliminated thereby resulting in a crystalline product which is substantially free of voids and inclusions. The apparatus improvement comprises providing an inner container for solid particulate material within a crucible and spaced therefrom which container has one or more openings at the bottom thereof to permit exiting of liquid therethrough to the crucible. Such apparatus is particularly adapted to effectuate the process improvement of the invention.

Abstract: Improvement in the method for growing crystalline materials by seed pulling from a melt whereby crystalline product produced is substantially free of voids and/or inclusions which were previously caused by the continuous feeding operation. The improved method comprises feeding the source material through a bed of particulate refractory material whereby entrained gases in the melting feed material are eliminated thereby resulting in a crystalline product which is substantially free of voids and inclusions.

Abstract: A permanent precision liquid polishing suspension, and a method for making same, comprising fine abrasive polishing powders held in a suspension medium comprising an aqueous glycerine based composition thickened by a carboxy polymethylene polymer.