Patents by Inventor Paul Jaynes

Paul Jaynes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip package sealing method
    Patent number: 7972901
    Abstract: A method of manufacturing a package including manufacturing a substrate to include at least one layer of LCP material, manufacturing a cover made of LCP material to include a lower lip, and sealing the cover to the substrate by heating the interface between the lower lip and the substrate.
    Type: Grant
    Filed: April 14, 2005
    Date of Patent: July 5, 2011
    Assignee: Foster-Miller, Inc.
    Inventors: Brian Farrell, Paul Jaynes, Malcolm Taylor
  • Electronic and optoelectronic component packaging technique
    Patent number: 7476566
    Abstract: A packaging method including assembling components on a substrate, manufacturing a lid assembly to include a plurality of integrated covers, and mating the lid assembly to the substrate.
    Type: Grant
    Filed: April 8, 2005
    Date of Patent: January 13, 2009
    Assignee: Foster-Miller, Inc.
    Inventors: Brian Farrell, Paul Jaynes, Malcolm Taylor
  • METHOD AND APPARATUS FOR SEALING FLEX CIRCUITS HAVING HEAT SENSITIVE CIRCUIT ELEMENTS
    Publication number: 20060286189
    Abstract: A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants and to provide thermal protection of temperature sensitive circuit elements within the flex circuit during the encapsulation process.
    Type: Application
    Filed: August 8, 2006
    Publication date: December 21, 2006
    Inventors: C.W. Smith, Charles Newton, Paul Jaynes
  • Method and apparatus for sealing flex circuits having heat sensitive circuit elements
    Publication number: 20060169405
    Abstract: A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants and to provide thermal protection of temperature sensitive circuit elements within the flex circuit during the encapsulation process.
    Type: Application
    Filed: February 3, 2005
    Publication date: August 3, 2006
    Inventors: C.W. Smith, Charles Newton, Paul Jaynes
  • Multi-functional structural circuits
    Publication number: 20060104037
    Abstract: A method and apparatus relating to a multi-functional, structural circuit, referred to as a structural circuit, are disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a structural element (215). At least one circuit component can be attached to the surface of the LCP circuit (220).
    Type: Application
    Filed: November 12, 2004
    Publication date: May 18, 2006
    Applicant: HARRIS CORPORATION
    Inventors: C.W. Smith, Paul Jaynes, Charles Newton, Travis Kerby
  • Method and apparatus for sealing flex circuits made with an LCP substrate
    Publication number: 20060028612
    Abstract: A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants.
    Type: Application
    Filed: August 3, 2004
    Publication date: February 9, 2006
    Inventors: C.W. Sinjin Smith, Charles Newton, Paul Jaynes
  • Chip package sealing method
    Patent number: 6977187
    Abstract: A method of manufacturing a package including manufacturing a substrate to include at least one layer of LCP material, manufacturing a cover made of LCP material to include a lower lip, and sealing the cover to the substrate by heating the interface between the lower lip and the substrate.
    Type: Grant
    Filed: June 13, 2003
    Date of Patent: December 20, 2005
    Assignee: Foster-Miller, Inc.
    Inventors: Brian Farrell, Paul Jaynes, Malcolm Taylor
  • Electronic and optoelectronic component packaging technique
    Publication number: 20050260797
    Abstract: A packaging method including assembling components on a substrate, manufacturing a lid assembly to include a plurality of integrated covers, and mating the lid assembly to the substrate.
    Type: Application
    Filed: April 8, 2005
    Publication date: November 24, 2005
    Inventors: Brian Farrell, Paul Jaynes, Malcolm Taylor
  • Electronic and optoelectronic component packaging technique
    Patent number: 6952046
    Abstract: A package including a substrate, a plurality of components on the substrate, and a lid assembly including a plurality of integrated covers for at least select components on the substrate. A method of manufacturing such a lid assembly is also disclosed as is a packaging method.
    Type: Grant
    Filed: June 13, 2003
    Date of Patent: October 4, 2005
    Assignee: Foster-Miller, Inc.
    Inventors: Brian Farrell, Paul Jaynes, Malcolm Taylor
  • Chip package sealing method
    Publication number: 20050189332
    Abstract: A method of manufacturing a package including manufacturing a substrate to include at least one layer of LCP material, manufacturing a cover made of LCP material to include a lower lip, and sealing the cover to the substrate by heating the interface between the lower lip and the substrate.
    Type: Application
    Filed: April 14, 2005
    Publication date: September 1, 2005
    Inventors: Brian Farrell, Paul Jaynes, Malcolm Taylor
  • Chip package sealing method
    Publication number: 20040010910
    Abstract: A method of manufacturing a package including manufacturing a substrate to include at least one layer of LCP material, manufacturing a cover made of LCP material to include a lower lip, and sealing the cover to the substrate by heating the interface between the lower lip and the substrate.
    Type: Application
    Filed: June 13, 2003
    Publication date: January 22, 2004
    Inventors: Brian Farrell, Paul Jaynes, Malcolm Taylor
  • Electronic and optoelectronic component packaging technique
    Publication number: 20040012083
    Abstract: A package including a substrate, a plurality of components on the substrate, and a lid assembly including a plurality of integrated covers for at least select components on the substrate. A method of manufacturing such a lid assembly is also disclosed as is a packaging method.
    Type: Application
    Filed: June 13, 2003
    Publication date: January 22, 2004
    Inventors: Brian Farrell, Paul Jaynes, Malcolm Taylor