Abstract: A system includes a heat sink, a semiconductor device, a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device, and a fastener system that couples the semiconductor device, the layer of TIM, and the heat sink together. The TIM may facilitate dissipation of heat generated by the semiconductor device via the heat sink during operation of the semiconductor device. The fastener system includes a first Belleville-type washer configured to cooperate with the TIM, which flows when heated beyond a threshold temperature, to maintain a substantially constant coupling force between the semiconductor device and the heat sink during operation of the semiconductor device.

Abstract: A linear drive transport system may include a track that includes first, second, third, and fourth track surfaces that define perimeter boundaries of the track and a magnetic drive system. The first, second, third, and fourth track surfaces include first, second, third, and fourth trajectories about the track, respectively, which are each different from one another. A mover may move along the track and include first and second leading bearings that interact with the first and second track surfaces, respectively, and first and second lagging bearings that interact with the third and fourth track surfaces, respectively, and a reaction element that interacts with the magnetic drive system to generate a propulsive force. The first and second leading bearings may be coupled to the mover at a first fixed distance from one another, and the first and second lagging bearings may be coupled to the mover at a similar distance.

Abstract: A linear drive transport system may include a track that includes first, second, third, and fourth track surfaces that define perimeter boundaries of the track and a magnetic drive system. The first, second, third, and fourth track surfaces include first, second, third, and fourth trajectories about the track, respectively, which are each different from one another. A mover may move along the track and include first and second leading bearings that interact with the first and second track surfaces, respectively, and first and second lagging bearings that interact with the third and fourth track surfaces, respectively, and a reaction element that interacts with the magnetic drive system to generate a propulsive force. The first and second leading bearings may be coupled to the mover at a first fixed distance from one another, and the first and second lagging bearings may be coupled to the mover at a similar distance.

Abstract: A system includes a heat sink, a semiconductor device, a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device, and a fastener system that couples the semiconductor device, the layer of TIM, and the heat sink together. The TIM may facilitate dissipation of heat generated by the semiconductor device via the heat sink during operation of the semiconductor device. The fastener system includes a first Belleville-type washer configured to cooperate with the TIM, which flows when heated beyond a threshold temperature, to maintain a substantially constant coupling force between the semiconductor device and the heat sink during operation of the semiconductor device.

Abstract: A system includes a heat sink, a semiconductor device, and a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device. The TIM may facilitate dissipation of heat generated by the semiconductor device via the heat sink. The system also includes a fastener system that couples the semiconductor device to the heat sink about the layer of TIM. The system also includes one or more washers of the fastener system that maintain a coupling force between the semiconductor device and the heat sink after the TIM flows.

Abstract: A system includes a heat sink, a semiconductor device, and a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device. The TIM may facilitate dissipation of heat generated by the semiconductor device via the heat sink. The system also includes a fastener system that couples the semiconductor device to the heat sink about the layer of TIM. The system also includes one or more washers of the fastener system that maintain a coupling force between the semiconductor device and the heat sink after the TIM flows.