Patents by Inventor Paul Jonathan Diglio

Paul Jonathan Diglio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS AND APPARATUS TO REDUCE LEAKAGE OF COOLING FLUID USED TO COOL AN ELECTRONIC COMPONENT
    Publication number: 20240328512
    Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed that reduce leakage of a cooling fluid used to cool an electronic component. An example disclosed herein includes a seal assembly comprising a socket to receive an electronic component, the electronic component including a semiconductor die and a substrate to support the die, a first seal to be forced against the electronic component, the first seal to surround the die, and a second seal to be forced against the electronic component, the second seal to surround the first seal.
    Type: Application
    Filed: March 29, 2023
    Publication date: October 3, 2024
    Inventors: Craig Yost, Paul Jonathan Diglio, Ruben Eduardo Nunez Blanco
  • Thermal interface material handling for thermal control of an electronic component under test
    Patent number: 9377486
    Abstract: Thermal interface material handing is described for thermal control of an electronic component under test. In one example, a thermal control unit is adapted to control the temperature of at least a portion of an electronic component during testing. A pedestal between the thermal control unit and the electronic component conducts heat from the electronic component to the thermal head. A conduit extends through a portion of the pedestal, to permit the flow of a liquid thermal interface material from an external source to a space between the pedestal and the electronic component. The liquid thermal interface material improves heat conduction between the electronic component and the pedestal. An elastomeric seal between the electronic device and the pedestal constrains the thermal interface fluid within the space between the electronic component and the pedestal.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: June 28, 2016
    Assignee: Intel Corporation
    Inventors: David Won-jun Song, Christopher Roy Schroeder, Joseph Walczyk, Lothar Kress, Todd Michael Young, Robert Levi Bennett, Arun Krishnamoorthy, Paul Jonathan Diglio, Charles Clifton Fulton, Sruti Chigullapalli
  • THERMAL INTERFACE MATERIAL HANDLING FOR THERMAL CONTROL OF AN ELECTRONIC COMPONENT UNDER TEST
    Publication number: 20150276798
    Abstract: Thermal interface material handing is described for thermal control of an electronic component under test. In one example, a thermal control unit is adapted to control the temperature of at least a portion of an electronic component during testing. A pedestal between the thermal control unit and the electronic component conducts heat from the electronic component to the thermal head. A conduit extends through a portion of the pedestal, to permit the flow of a liquid thermal interface material from an external source to a space between the pedestal and the electronic component. The liquid thermal interface material improves heat conduction between the electronic component and the pedestal. An elastomeric seal between the electronic device and the pedestal constrains the thermal interface fluid within the space between the electronic component and the pedestal.
    Type: Application
    Filed: March 28, 2014
    Publication date: October 1, 2015
    Inventors: David Won-jun Song, Christopher Roy Schroeder, Joseph Walczyk, Lothar Kress, Todd Michael Young, Robert Levi Bennett, Arun Krishnamoorthy, Paul Jonathan Diglio, Charles Clifton Fulton, Sruti Chigullapalli