Patents by Inventor Paul Jungwirth

Paul Jungwirth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Failure mitigation in arrays of light-emitting devices
    Patent number: 8860318
    Abstract: In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: October 14, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, Philippe M. Schick, Paul Jungwirth, Calvin Wade Sheen
  • Wiring boards for array-based electronic devices
    Patent number: 8786200
    Abstract: In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements.
    Type: Grant
    Filed: April 5, 2013
    Date of Patent: July 22, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, Paul Jungwirth
  • ELECTRONIC DEVICES WITH YIELDING SUBSTRATES
    Publication number: 20140191257
    Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
    Type: Application
    Filed: January 31, 2014
    Publication date: July 10, 2014
    Inventors: Michael A. Tischler, Philippe M. Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth
  • WIRING BOARDS FOR ARRAY-BASED ELECTRONIC DEVICES
    Publication number: 20140175993
    Abstract: In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements.
    Type: Application
    Filed: March 3, 2014
    Publication date: June 26, 2014
    Inventors: Michael A. Tischler, Paul Palfreyman, Philippe M. Schick, Paul Jungwirth
  • Illumination device control systems and methods
    Patent number: 8760075
    Abstract: In various embodiments, a control system for an electronic circuit iteratively applies voltage to and senses current from a load to regulate operation of the load.
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: June 24, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, William P. Coetzee, Paul Jungwirth
  • LIGHT-EMITTING ELEMENT REPAIR IN ARRAY-BASED LIGHTING DEVICES
    Publication number: 20140167611
    Abstract: In accordance with certain embodiments, patches with replacement light-emitting elements thereon are utilized to repair lighting-system fault locations.
    Type: Application
    Filed: August 15, 2013
    Publication date: June 19, 2014
    Inventors: Michael A. Tischler, Tom Pinnington, Philippe M. Schick, Paul Jungwirth
  • Wiring boards for array-based electronic devices
    Patent number: 8704448
    Abstract: In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements.
    Type: Grant
    Filed: August 19, 2013
    Date of Patent: April 22, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, Paul Palfreyman, Philippe M. Schick, Paul Jungwirth
  • Electronic devices with yielding substrates
    Patent number: 8680567
    Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: March 25, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, Philippe M. Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth
  • WIRING BOARDS FOR ARRAY-BASED ELECTRONIC DEVICES
    Publication number: 20140062316
    Abstract: In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements.
    Type: Application
    Filed: August 19, 2013
    Publication date: March 6, 2014
    Inventors: Michael A. Tischler, Paul Palfreyman, Philippe M. Schick, Paul Jungwirth
  • WIRING BOARDS FOR ARRAY-BASED ELECTRONIC DEVICES
    Publication number: 20140062318
    Abstract: In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements.
    Type: Application
    Filed: March 13, 2013
    Publication date: March 6, 2014
    Inventors: Michael A. Tischler, Paul Jungwirth
  • WIRING BOARDS FOR ARRAY-BASED ELECTRONIC DEVICES
    Publication number: 20140062315
    Abstract: In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements.
    Type: Application
    Filed: April 5, 2013
    Publication date: March 6, 2014
    Inventors: Michael A. Tischler, Paul Jungwirth
  • FAILURE MITIGATION IN ARRAYS OF LIGHT-EMITTING DEVICES
    Publication number: 20140062302
    Abstract: In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.
    Type: Application
    Filed: September 25, 2013
    Publication date: March 6, 2014
    Inventors: Michael A. Tischler, Philippe M. Schick, Paul Jungwirth, Calvin Wade Sheen
  • Failure mitigation in arrays of light-emitting devices
    Patent number: 8653539
    Abstract: In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: February 18, 2014
    Assignee: Cooledge Lighting, Inc.
    Inventors: Michael Tischler, Philippe Schick, Calvin Wade Sheen, Paul Jungwirth
  • ELECTRONIC DEVICES WITH YIELDING SUBSTRATES
    Publication number: 20140034960
    Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
    Type: Application
    Filed: August 30, 2013
    Publication date: February 6, 2014
    Inventors: Michael A. Tischler, Philippe M. Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth
  • METHOD AND SYSTEM FOR DRIVING LIGHT EMITTING ELEMENTS
    Publication number: 20130300294
    Abstract: A system topology and circuit design for efficiently and stably driving currents through strings of solid state light emitting elements by providing current sources that are controlled by a stable voltage reference.
    Type: Application
    Filed: April 30, 2013
    Publication date: November 14, 2013
    Inventor: Paul Jungwirth
  • Electronic devices with yielding substrates
    Patent number: 8552463
    Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
    Type: Grant
    Filed: January 28, 2013
    Date of Patent: October 8, 2013
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, Philippe M. Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth
  • Method and system for driving light emitting elements
    Patent number: 8493000
    Abstract: A system topology and circuit design for efficiently and stably driving currents through strings of solid state light emitting elements by providing current sources that are controlled by a stable voltage reference.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: July 23, 2013
    Assignee: Cooledge Lighting Inc.
    Inventor: Paul Jungwirth
  • ELECTRONIC DEVICES WITH YIELDING SUBSTRATES
    Publication number: 20130181238
    Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
    Type: Application
    Filed: January 28, 2013
    Publication date: July 18, 2013
    Inventors: Michael A. Tischler, Philippe M. Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth
  • Electronic devices with yielding substrates
    Patent number: 8466488
    Abstract: In accordance with certain embodiments, an unpackaged inorganic LED die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the unpackaged inorganic LED die or non-coplanarity of the contacts thereof.
    Type: Grant
    Filed: May 8, 2012
    Date of Patent: June 18, 2013
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael Tischler, Philippe Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth
  • Electronic devices with yielding substrates
    Patent number: 8384121
    Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: February 26, 2013
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael Tischler, Philippe Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth