Patents by Inventor Paul Kok

Paul Kok has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High power chip cooling device and method of manufacturing same
    Patent number: 4535841
    Abstract: A leaf-type cooling device for coupling a semi-conductor chip package to a heat sink is formed by accordion pleated folding of two copper strips coated on their non-mating sides with solder and their mating sides with polysulfone and then using heat to solder the non-mating surfaces of strip folds together and the ridges defined by the folds to respective opposed solderable supports. The polysulfone adhesive is thereafter removed by solvation to form interleaved fins between the supports. Springs function to bias the supports away from each other.
    Type: Grant
    Filed: October 24, 1983
    Date of Patent: August 20, 1985
    Assignee: International Business Machines Corporation
    Inventor: Paul Kok