Patents by Inventor Paul Kuntz

Paul Kuntz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230327438
    Abstract: Provided is a system and method for determining the state estimate of a power grid by dividing the power grid into smaller sub-sections, generating state estimates for each sub-section, and then generating a consensus among the sub-sections. In one example, the method may include partitioning a section of the power distribution grid into a plurality of sub-sections based on loads distributed within the section of the power distribution grid, generating a plurality of state estimates for the plurality of sub-sections based on load distribution within the plurality of sub-sections and a Kalman Filter model, generating an aggregate state estimate for the section of the power distribution grid based on an aggregate of the plurality of state estimates and a boundary consensus between the plurality of sub-sections from a previous state estimation, and displaying data about the aggregate state estimate via a user interface.
    Type: Application
    Filed: April 11, 2022
    Publication date: October 12, 2023
    Inventors: Aditya Kumar, Reza Ghaemi, Michael Unum, Paul Kuntz, Ethan Clair Boardman
  • Patent number: 4616178
    Abstract: The tester includes a test cabinet which forms an electromagnetic shield enclosure with an aperture in the top wall through which a device under test extends and a thermal hood intersecting the top wall to form a thermal and electromagnetic shield enclosure about the device under test. A device under test receptacle is mounted to a removable electromagnetic shield load board with coaxial connectors which snap into coaxial connectors on a electromagnetic shield mother board which is permanently mounted in the electromagnetic shielded enclosure. The connection of the terminals at the bottom of the mother board are by matched impedance, equal length coaxial cables to the A.C. interface and a ribbon cord to the D.C. interface. The environmental enclosure, the housing are grounded to frame ground and the load board and the mother board are all grounded to instrument ground which is then attached to frame ground via single ground point.
    Type: Grant
    Filed: June 13, 1985
    Date of Patent: October 7, 1986
    Assignee: Harris Corporation
    Inventors: Max C. Thornton, Jr., Paul Kuntz, Russell L. Meyer, Kenneth M. Rosier
  • Patent number: 4528504
    Abstract: The tester includes a test cabinet which forms an electromagnetic shield enclosure with an aperture in the top wall through which a device under test extends and a thermal hood intersecting the top wall to form a thermal and electromagnetic shield enclosure about the device under test. A device under test receptacle is mounted to a removable electromagnetic shield load board with coaxial connectors which snap into coaxial connectors on a electromagnetic shield mother board which is permanently mounted in the electromagnetic shielded enclosure. The connection of the terminals at the bottom of the mother board are by matched impedance, equal length coaxial cables to the A.C. interface and a ribbon cord to the D.C. interface. The environmental enclosure, the housing are grounded to frame ground and the load board and the mother board are all grounded to instrument ground which is then attached to frame ground via single ground point.
    Type: Grant
    Filed: May 27, 1982
    Date of Patent: July 9, 1985
    Assignee: Harris Corporation
    Inventors: Max C. Thornton, Jr., Paul Kuntz, Russell L. Meyer, Kenneth M. Rosier