Abstract: A system and method for forming high resolution electronic circuits on a substrate is provided. The system (10) includes a substrate (12), a source of radiant energy (34) and a focusing means (16). The source of radiant energy (34) directs an energy beam (14) through the focusing means (16) in order to direct a focused energy beam (18) onto the surface of the substrate (12). The focused energy beam (18) creates a plurality of channels (20) in the surface of the substrate (12). A paste applicator (22) fills the channels (20) with an electrically conductive paste (24). Once heated and cured, the electrically conductive paste (24) makes up the electrically conductive pathways of the electronic circuit.

Abstract: Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include adhesion promoting additives for providing improved adhesion of the compositions to various substrates.

Abstract: Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a substrate coated with a cure temperature reducing agent to reduce the curing temperatures.

Abstract: A system and method for forming high resolution electronic circuits on a substrate is provided. The system (10) includes a substrate (12), a source of radiant energy (34) and a focusing means (16). The source of radiant energy (34) directs an energy beam (14) through the focusing means (16) in order to direct a focused energy beam (18) onto the surface of the substrate (12). The focused energy beam (18) creates a plurality of channels (20) in the surface of the substrate (12). A paste applicator (22) fills the channels (20) with an electrically conductive paste (24). Once heated and cured, the electrically conductive paste (24) makes up the electrically conductive pathways of the electronic circuit.

Abstract: A device and method for depositing a material of interest onto a receiving substrate includes a first laser and a second laser, a receiving substrate, and a target substrate. The target substrate comprises a laser transparent support having a back surface and a front surface. The front surface has a coating that comprises the source material, which is a material that can be transformed into the material of interest. The first laser can be positioned in relation to the target substrate so that a laser beam is directed through the back surface of the target substrate and through the laser-transparent support to strike the coating at a defined location with sufficient energy to remove and lift the source material from the surface of the support. The receiving substrate can be positioned in a spaced relation to the target substrate so that the source material is deposited at a defined location on the receiving substrate.

Abstract: A method of forming high resolution electronic circuits (10) on a substrate (12) is provided. The method includes the steps of laminating a dielectric layer (14) on a substrate (12), laser drilling channels (16 and 18) in the dielectric film (14) and the substrate (12), and filling channels (16 and 18) with a filler material (20). Further, a release layer (22) is applied to dielectric film layer (14) and filler material (20), the release layer (22) having an adhesive thereon. Release layer (22) is peeled or otherwise removed from substrate (12), leaving filler material (20) formed and shaped on substrate (12), thus producing a high resolution electronic circuit on substrate (12).

Abstract: A method of forming high resolution electronic circuits (10) on a substrate (12) is provided. The method includes the steps of laminating a dielectric layer (14) on a substrate (12), laser drilling channels (16 and 18) in the dielectric film (14) and the substrate (12), and filling channels (16 and 18) with a filler material (20). Further, a release layer (22) is applied to dielectric film layer (14) and filler material (20), the release layer (22) having an adhesive thereon. Release layer (22) is peeled or otherwise removed from substrate (12), leaving filler material (20) formed and shaped on substrate (12), thus producing a high resolution electronic circuit on substrate (12).