Patents by Inventor Paul L. Wykowski

Paul L. Wykowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5326795
    Abstract: Storage stable thermosettable ethylenically unsaturated resins containing at least one 1,4-naphthoquinone substituted on the 2 or 3 or both the 2 and 3 positions. The reactivity of these storage stable resins with curing agents is not unacceptably reduced by the presence of the stabilizer. The compositions are useful in the preparation of laminates or composites and in filament winding pultrusion, braiding and resin transfer molding applications.
    Type: Grant
    Filed: October 20, 1993
    Date of Patent: July 5, 1994
    Assignee: The Dow Chemical Company
    Inventor: Paul L. Wykowski
  • Patent number: 5298543
    Abstract: Curable compositions from storage stable thermosettable ethylenically unsaturated resins containing at least one 1,4-naphthoquinone substituted on the 2 or 3 or both the 2 and 3 positions. The reactivity of these storage stable resins with curing agents is not unacceptably reduced by the presence of the stabilizer. The curable compositions are useful in the preparation of laminates or composites and in filament winding pultrusion, braiding and resin transfer molding applications.
    Type: Grant
    Filed: July 28, 1993
    Date of Patent: March 29, 1994
    Assignee: The Dow Chemical Company
    Inventor: Paul L. Wykowski
  • Patent number: 5272197
    Abstract: Thermosettable ethylenically unsaturated resins are rendered storage stable by the addition of at least one 1,4-naphthoquinone substituted on the 2 or 3 or both the 2 and 3 positions. The reactivity of these storage stable resins with curing agents is not unacceptably reduced by the presence of the stabilizer.
    Type: Grant
    Filed: April 1, 1992
    Date of Patent: December 21, 1993
    Assignee: The Dow Chemical Company
    Inventor: Paul L. Wykowski
  • Patent number: 5034437
    Abstract: Thermosettable ethylenically unsaturated resins are rendered storage stable by the addition of a complex formed by mixing (a) at least one quinonoid compound and (b) at least one imidazole compound. The reactivity of these storage stable resins with curing agents is not significantly reduced by the presence of the stabilizer complex.
    Type: Grant
    Filed: January 12, 1990
    Date of Patent: July 23, 1991
    Assignee: The Dow Chemical Company
    Inventor: Paul L. Wykowski
  • Patent number: 4983692
    Abstract: Novel epoxy resins are prepared by dehydrohalogenating the reaction product of an epihalohydrin and a hydroxyalkyl containing polysulfide.
    Type: Grant
    Filed: December 12, 1989
    Date of Patent: January 8, 1991
    Assignee: The Dow Chemical Company
    Inventors: Robert E. Hefner, Jr., Paul L. Wykowski
  • Patent number: 4921927
    Abstract: Novel epoxy resins are prepared by dehydrohalogenating the reaction product of an epihalohydrin and a hydroxyalkyl containing polysulfide.
    Type: Grant
    Filed: January 23, 1989
    Date of Patent: May 1, 1990
    Assignee: The Dow Chemical Company
    Inventors: Robert E. Hefner, Jr., Paul L. Wykowski
  • Patent number: 4829133
    Abstract: Novel epoxy resins are prepared by dehydrohalogenating the reaction product of an epihalohydrin and a hydroxyalkyl containing polysulfide.
    Type: Grant
    Filed: August 19, 1988
    Date of Patent: May 9, 1989
    Assignee: The Dow Chemical Company
    Inventors: Robert E. Hefner, Jr., Paul L. Wykowski
  • Patent number: 4816546
    Abstract: Novel epoxy resins are prepared by dehydrohalogenating the reaction product of an epihalohydrin and a hydroxyalkyl containing polysulfide.
    Type: Grant
    Filed: June 23, 1987
    Date of Patent: March 28, 1989
    Assignee: The Dow Chemical Company
    Inventors: Robert E. Hefner, Jr., Paul L. Wykowski
  • Patent number: 4798761
    Abstract: Compositions comprising a mixture of (A) an epoxy resin composition consisting essentially of (1) at least one epoxy resin which has an average of not more than 2 vicinal epoxy groups per molecule; (2) at least one epoxy resin which has an average of more than 2 vicinal epoxy groups per molecule and (3) at least one rubber or elastomer; and (B) optionally, a low viscosity reactive diluent, are useful in preparing low temperature curable compositions. Also claimed is low temperature curable compositions containing the above components (A) and (B); (C) at least one cycloaliphatic amine hardener and (D) optionally, an accelerator for component (D).
    Type: Grant
    Filed: November 3, 1987
    Date of Patent: January 17, 1989
    Assignee: The Dow Chemical Company
    Inventors: Paul L. Wykowski, Paul M. Puckett