Patents by Inventor Paul Lee Clouser

Paul Lee Clouser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6607125
    Abstract: An improved handheld merchandise scanning device and method are disclosed. A first and second mode are enabled in the scanning device for scanning a product tag which includes product information and a security tag. The product tag is scanned utilizing the scanning device in the first mode to obtain the product information without deactivating the security tag. The product tag is scanned utilizing the scanning device in the second mode to concurrently obtain the product information and deactivate the security tag.
    Type: Grant
    Filed: November 29, 1999
    Date of Patent: August 19, 2003
    Assignee: International Business Machines Corporation
    Inventors: Paul Lee Clouser, Frank Eliot Levine, Danny Marvin Neal
  • Patent number: 6495911
    Abstract: A method and implementing system are described in which a tri-plate chip carrier is effective to significantly reduce electromagnetic signal radiation and provide enhanced noise immunity. The tri-plate structure includes a ground layer, a middle signal conducting layer upon which an integrated circuit is mounted, and a top reference potential layer. The middle layer includes groups of printed circuit conductors extending from the chip to the outer edges of the carrier. The top layer is arranged to have separate electrically isolated conducting areas for VDD and ground reference potential connections. The conducting areas are arranged such that each group of signal conductors in the middle signal layer has a ground potential area above it and a ground potential area below it to provide enhanced signal isolation and reduced electromagnetic radiation.
    Type: Grant
    Filed: August 17, 2000
    Date of Patent: December 17, 2002
    Assignee: International Business Machines Corporation
    Inventors: Patrick H. Buffet, Paul Lee Clouser, Danny Marvin Neal
  • Publication number: 20020186554
    Abstract: A method and implementing system are described in which a tri-plate chip carrier is effective to significantly reduce electromagnetic signal radiation and provide enhanced noise immunity. The tri-plate structure includes a ground layer, a middle signal conducting layer upon which an integrated circuit is mounted, and a top reference potential layer. The middle layer includes groups of printed circuit conductors extending from the chip to the outer edges of the carrier. The top layer is arranged to have separate electrically isolated conducting areas for VDD and ground reference potential connections. The conducting areas are arranged such that each group of signal conductors in the middle signal layer has a ground potential area above it and a ground potential area below it to provide enhanced signal isolation and reduced electromagnetic radiation.
    Type: Application
    Filed: August 12, 2002
    Publication date: December 12, 2002
    Inventors: Patrick H. Buffet, Paul Lee Clouser, Danny Marvin Neal
  • Patent number: 6483720
    Abstract: A method and implementing electronic tri-plate connection system are provided including a nested set of RF Faraday cages within the system with integrated circuit packages containing the core drivers and receivers as the innermost Faraday cage, and additional Faraday cages being implemented at each outward level through card, board, backplane and unit level and into the network level. There is no distinction between power ground, signal ground or shield ground. All grounds throughout the system are at the same level and all package ground levels are interconnected.
    Type: Grant
    Filed: August 17, 2000
    Date of Patent: November 19, 2002
    Assignee: International Business Machines Corporation
    Inventors: Patrick H. Buffet, Paul Lee Clouser, Danny Marvin Neal
  • Patent number: 6477057
    Abstract: A method and implementing computer system are provided in which de-coupling capacitors are used at driver and receiver sources, and defined gaps are created separating power and ground areas on a voltage reference plane of a circuit board. Short-circuit via connections are also provided through one or more vias between spatially separated circuit board layers. Each driver or receiver module includes the driver or receiver along with an associated gap, capacitor and via connections to VDD and ground planes, all included within a defined proximity to effectively block switching energy and/or VDD noise from entering the tri-plate ground-to-ground reference system. In a related exemplary construction, signal lines are placed at predetermined positions between ground planes to provide a tri-plate circuit board structure for transmitting logic signals from a driver to one or more receivers.
    Type: Grant
    Filed: August 17, 2000
    Date of Patent: November 5, 2002
    Assignee: International Business Machines Corporation
    Inventors: Patrick H. Buffet, Paul Lee Clouser, Danny Marvin Neal
  • Patent number: 6070211
    Abstract: A system of supporting differential signalling circuitry in an enhanced PCI bus within a data processing system is disclosed The enhanced PCI bus comprises a plurality of differential signal conductor pairs. A system and method in accordance with the present invention comprises a system for providing each of the plurality of differential signal pairs over a first line and a second line, the first line having a front end and a back end, the second line having a front end and a back end. The system and method includes a differential driver for driving the first line and the second line with a small voltage change of equal amounts in opposite direction to change logic states, a receiver for sensing a voltage change between the first line and the second line and a termination network coupled to the first line and second line for terminating the first line and the second line.
    Type: Grant
    Filed: June 11, 1997
    Date of Patent: May 30, 2000
    Assignee: International Business Machines Corporation
    Inventors: Danny Marvin Neal, Charles Bertram Perkins, Jr., Richard Allen Kelley, Paul Lee Clouser
  • Patent number: 4115749
    Abstract: In a hybrid connector for microwave devices between coaxial and microstrip application, the utilization of a calibrated, shaped, dielectric spacer in the connection for phase matching.
    Type: Grant
    Filed: April 25, 1977
    Date of Patent: September 19, 1978
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Sidney Michael Cole, Paul Lee Clouser