Patents by Inventor Paul Lindars

Paul Lindars has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7665196
    Abstract: Provided is a method of manufacturing a multi-frequency surface acoustic wave (SAW) device on a common piezoelectric substrate. The method features varying the resonant frequency of waveguide elements of the SAW device using a single etch step. The etch step removes a sub-portion of multiple layers of conductive film disposed on the substrate.
    Type: Grant
    Filed: November 26, 2007
    Date of Patent: February 23, 2010
    Inventors: David M. Lee, Paul Lindars, Christopher Ellis Jones, James E. Flowers, Martin P. Goetz
  • Publication number: 20080222864
    Abstract: Provided is a method of manufacturing a multi-frequency surface acoustic wave (SAW) device on a common piezoelectric substrate. The method features varying the resonant frequency of waveguide elements of the SAW device using a single etch step. The etch step removes a sub-portion of multiple layers of conductive film disposed on the substrate.
    Type: Application
    Filed: November 26, 2007
    Publication date: September 18, 2008
    Inventors: David M. Lee, Paul Lindars, Christopher Ellis Jones, James E. Flowers, Martin P. Goetz
  • Patent number: 7299528
    Abstract: Provided is a method of manufacturing a multi-frequency surface acoustic wave (SAW) device on a common piezoelectric substrate. The method features varying the resonant frequency of waveguide elements of the SAW device using a single etch step. The etch step removes a sub-portion of multiple layers of conductive film disposed on the substrate.
    Type: Grant
    Filed: November 5, 2002
    Date of Patent: November 27, 2007
    Inventors: David M. Lee, Paul Lindars, Christopher Ellis Jones, James E. Flowers, Martin P. Goetz
  • Publication number: 20040083590
    Abstract: Provided is a method of manufacturing a multi-frequency surface acoustic wave (SAW) device on a common piezoelectric substrate. The method features varying the resonant frequency of waveguide elements of the SAW device using a single etch step. The etch step removes a sub-portion of multiple layers of conductive film disposed on the substrate.
    Type: Application
    Filed: November 5, 2002
    Publication date: May 6, 2004
    Applicant: CLARISAY, INC.
    Inventors: David M. Lee, Paul Lindars, Christopher Ellis Jones, James E. Flowers, Martin P. Goetz