Abstract: A portable electric soldering tool includes a housing forming a handle and a power head. A heating rod with a main and a secondary heating coil extends from the power head, the rod having an axial bore with a stainless steel lining to prevent solder from building up in the heating rod. A pump draws molten solder through the axial bore of the heating rod. A disposable solder collecting cartridge is removably mounted in the power head to collect solder drawn through the heating rod. The cartridge includes a barrel formed of a heat resistant plastic. Sealing gaskets are disposed at the open ends of the barrel, and a solder accumulator is disposed in the barrel to collect molten solder. The main and secondary heating coils are connected to a power switch. An electric motor for the pump is connected in series with the secondary heating coil. A selector switch energizes alternatively the main heating coil or the secondary heating coil and motor.

Abstract: This disclosure sets out a soldering wand control system. With a wand having a heated tip, a heater element and a thermostat for measuring tip temperature, an output signal of tip temperature is provided. Using an analog to digital converter, tip temperature is transmitted to a CPU along with a set point temperature. The CPU also connects with a binary switch which is toggled to input an operator generated signal for changing tip temperature. In the preferred form, the binary switch is a reed switch which is physically mounted for easy operation by an operator moved magnet. This enables easy input of a binary signal for changing the circuit and its operation. In one form, the binary switch is a reed switch mounted on a printed circuit board within the cabinet and is magnetically sensitive by virtue of an external magnet which causes operation.

Abstract: An apparatus and method for aligning fine pitch electrical components and for solder paste stenciling includes a template for aligning an electrical component and for aligning a solder stencil. The template has a window with shelves on opposite sides. Tape is adhered to the shelves across the window and is used to secure the template to the desired location on the printed circuit board. The template also includes upright tabs that engage notches in the edges of the stencil for aligning the stencil. A two headed vacuum lifting device is used to lift an aligned component and an aligned stencil from the template. With the template removed from the printed circuit board, the stencil is replaced in the aligned position for solder application. The stencil is removed and the electrical component is placed for soldering.