Patents by Inventor Paul-Ludwig Waterkamp

Paul-Ludwig Waterkamp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laser-inscribable coating based on a polymer powder
    Publication number: 20030191223
    Abstract: A thermoplastic polymer powder composition which contains a thermoplastic polymer and a laser light-active compound is used for coating of metallic substrates. The resulting coating can be subsequently inscribed using laser light, even after further coating with a finish layer.
    Type: Application
    Filed: April 7, 2003
    Publication date: October 9, 2003
    Applicant: DEGUSSA AG
    Inventors: Paul-Ludwig Waterkamp, Heinz Scholten, Wolfgang Christoph, Thomas Schiffer
  • Electrostatic coating of moldings with thermoplastic and crosslinkable copolyamide hot-melt adhesives
    Patent number: 6589606
    Abstract: A process is described in which a nonconductive molding is electrostatically coated with a thermoplastic or crosslinkable copolyamide hot-melt adhesive. The hot-melt adhesive may be used as a fine powder with a particle size between 1 and 200 &mgr;m and have a melting point up to 160° C.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: July 8, 2003
    Assignee: Degussa AG
    Inventors: Paul-Ludwig Waterkamp, Ulrich Simon, Hans-Willi Losensky
  • Electrostatic coating of moldings with thermoplastic and crosslinkable copolyamide hot-melt adhesives
    Publication number: 20020031614
    Abstract: A process is described which permits the electrostatic coating of nonconducting moldings with thermoplastic or crosslinkable copolyamide hot-melt adhesives.
    Type: Application
    Filed: June 29, 2001
    Publication date: March 14, 2002
    Inventors: Paul-Ludwig Waterkamp, Ulrich Simon, Hans-Willi Losensky